Announcement on Outline of the Q3 2026 Performance Briefing
Filed with SSE · · 6 pages · Chinese
Earlier from Huaqin
- Announcement on Results of the Public Issuance of Science and Technology Innovation Corporate Bonds (Phase II) to Professional Investors in 2026
- Notice on Convening the 2025 Annual General Meeting
- Announcement on Proposed Agreement-based Acquisition of Partial Equity in Nexchip Semiconductor Corporation by the Wholly-owned Subsidiary
- Announcement on Convening the Q1 2026 Performance Briefing
- Huaqin Technology Launches Hong Kong IPO with Blue-Chip Cornerstone Line-up Securing 50% Allocation
Later from Huaqin
- Announcement on Completion of Wholly-owned Subsidiary’s Share Transfer Registration for Agreement-based Acquisition of Partial Shares of Nexchip Semiconductor Corporation
- Announcement on Implementation of Dividend Distribution for 2025
- Announcement on Shareholding Reduction Plan for Shareholders
- Announcement on Changing Registered Capital and Amending the Articles of Association
- Announcement on A-Share and H-Share Shareholding Increase Plan of Certain Directors and Senior Management Members
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