Announcement on Convening the Q1 2026 Performance Briefing
Filed with SSE · · 3 pages · Chinese
Earlier from Huaqin
- Huaqin Technology Launches Hong Kong IPO with Blue-Chip Cornerstone Line-up Securing 50% Allocation
- Announcement on the Release of Trading Restrictions of Initial Grant in the 2nd Sales Restriction Lifting Period under 2023 Restricted Stock Incentive Plan and the Release of Trading Restrictions and Listing of Shares of Initial Grant in the 1st Sales Restriction Lifting Period under 2025 Restricted Stock Incentive Plan
- Announcement on Release of Pledge of Partial Shares by Person Acting in Concert of Actual Controllers
- Announcement on Granting Results of 2026 Restricted Stock Incentive Plan
- Announcement on Change of Share Nature and Progress in Granting Interest under 2026 Restricted Stock Incentive Plan
Later from Huaqin
- Announcement on Proposed Agreement-based Acquisition of Partial Equity in Nexchip Semiconductor Corporation by the Wholly-owned Subsidiary
- Notice on Convening the 2025 Annual General Meeting
- Announcement on Results of the Public Issuance of Science and Technology Innovation Corporate Bonds (Phase II) to Professional Investors in 2026
- Announcement on Outline of the Q3 2026 Performance Briefing
- Announcement on Completion of Wholly-owned Subsidiary’s Share Transfer Registration for Agreement-based Acquisition of Partial Shares of Nexchip Semiconductor Corporation
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