Nanoveu Reaches Final GDS Stage for 16nm ECS-DoT SoC
Filed with ASX · · 6 pages · English
• EMASS’s next-generation 16nm ECS-DoT Edge AI SoC has completed front end design, synthesis and physical design, and is now in the final GDS (graphic data system) sign-off stage ahead of tape-out and fabrication at TSMC, advancing Nanoveu’s Atoms-to-Apps silicon roadmap. • EMASS is setting the pace among Edge AI SoC peers by delivering an ultra-low-power 16nm AI SoC purpose-built for always-on ed
In the deck
Earlier from Nanoveu
- EMASS and Semtech Collaborate on Low-Power Edge AI
- EMASS Announces Collaboration with Arrow Electronics
- Ignite Investment Summit Hong Kong Presentation
- NVU To Launch Live Drone Testing to Validate Sim Results
- NVU Edge-AI Chip Achieves Landmark Drone Energy Efficiency
Later from Nanoveu
- EMASS Pushes the Edge Further with 16nm ECS-DoT
- Investor Webinar Presentation
- Trading Halt
- $7.5M Placement to Accelerate ECS-DoT Chip Commercialisation
- Nanoveu Tapes Out 16nm ECS-DoT Edge AI SoC
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