Semi-annual Report for 2026
Filed with SSE · · 151 pages · Chinese
China Wafer Level CSP Co., Ltd. on 6ix
Earlier from China Wafer Level CSP
- Announcement on Resolutions of the 1st Extraordinary General Meeting in 2026
- Self-Inspection Report on the Company's Shares by Insiders with Knowledge of Inside Information Related to the Spin-off and Listing of a Subsidiary on the Amsterdam Stock Exchange
- Notice on the 1st Extraordinary General Meeting in 2026
- Announcement on Outline of the Q1 2026 Performance Briefing
- Announcement on Implementation of Dividend Distribution for 2025
Later from China Wafer Level CSP
- Announcement on Convening the 2026 Semi-annual Performance Briefing
- Review Opinion and Statement on the Public Disclosure of the List of Participants under the 2026 Restricted Share Incentive Plan Issued by the Remuneration Committee of the Board of Directors
- Announcement on Outline of the 2026 Semi-annual Performance Briefing
- Announcement on Reply to the Letter of Shareholder Suggestions from the China Securities Investor Services Center
- Announcement on Grant of Equity Incentive Interests
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