Taiwan Semiconductor Manufacturing Co., the world's largest contract chipmaker, said Thursday it will start production of advanced 1.3-nanometer chips using a new manufacturing process in 2029.
TSMC said the new process will enable more compact designs to meet demand for computing power in next-generation artificial intelligence, high-performance computing and mobile applications.
The latest model builds on industry-leading 1.4-nanometer-class semiconductors announced in 2025, reducing chip area by 6 percent.
"At TSMC, we understand our customers are always looking ahead to their next innovation, and they come to us for a reliable stream of new silicon technologies...meticulously engineered to be ready for high-volume production right when their visionary new designs demand them," TSMC Chairman and CEO C.C. Wei said in a statement.
TSMC began mass production using its 2-nanometer process in the fourth quarter of last year and aims to start manufacturing 1.4-nanometer-class chips in 2028.
At its second factory in southwestern Japan's Kumamoto Prefecture, TSMC plans to begin mass production of 3-nanometer chips in 2028. Meanwhile, Japanese chip venture Rapidus Corp. plans to mass-produce 2-nanometer chips from the second half of 2027.
==Kyodo
© Kyodo News International, Inc., source Newswire