In the semiconductor advanced packaging market, the importance of redistribution layer (RDL) patterning technology is increasing, driven by growing demand for high-density wiring for large interposers and multilayer FC-BGA substrates*5.
Nikon has been developing digital lithography systems that eliminate the need for photomasks while achieving both high resolution and high productivity. Nikon is launching the DSP-110 with 1.5 µm (L/S) resolution as a successor following the DSP-100 with 1.0 µm (L/S) resolution. The improved throughput of the DSP-110 was achieved by redesigning the optical system of the DSP-100. This was made possible by Nikon's unique technological capabilities in designing and manufacturing optical systems in-house. Going forward, Nikon will continue to closely monitor technology trends in advanced packaging while responding to customers' diverse needs, including resolution and supported substrate types.