of the 1st Half of FY2026
IBIDEN CO., LTD.(4062)October 30th, 2026
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Forecasts in this statement have been made based on the premise, prospect and plan of IBIDEN as of October 29th, 2026.Actual results may widely differ from this statement due to any uncertain factor such as international economy, market competition and exchange fluctuation.
[Consolidated]
Results of the 1st Half of FY2026
[Consolidated] Forecasts of the 2nd Half of FY2026
Market Forecasts and
Business Prospects
Trends and Changes in Electronics MarketDemand for AI GPUs and ASICs specialized in AI inference is forecast to continue growing steadily.
With the expansion of AI applications (inference and agents), the demand forecast for high-end server CPUs has been revised upward.
To enable high-speed data transmission between servers and data centers, switching ICs are expected to become even more high-performance.
AI GPU/ASIC Markets
CPU and Other Markets
Switching IC for data centers
(Unit: million units)
According to the information
by the external research firm
(Unit: million units)
AI GPU
ASIC
CPU for server Others
Existing Applications
AI Applications
CPU for server High-end
CPU for
30 server
30 Highend
Forecast (26.05.12)
15
D, All rights
reserved
Page
15
0
ght 2026 IBI
DEN CO.,LT
Copyri
CY24 CY25 CY26 CY27 CY28 CY29 CY30
0 CY24 CY25 CY26 CY27 CY28 CY29 CY30 #11/17
Demand Forecast and Capacity Expansion Plan of IC Package SubstratesAs IC package substrates become larger and more multi-layered, total SAP demand is expected to s ignificantly exceed the industry's supply capacity.
We will maintain our top share in the high-end market through capacity expansion focused on cutting-edge semiconductors.
Capacity Expansion Plan(Index)
SAP*Demand (Size)
*SAP : Semi Additive Process
*Indexed by CY26=100
Changes from CY26 to CY30
(based on customer information)
250
※Japan only
Market
Production Load
SAP
Demand
AI GPU AI ASIC
x 1.8
x 3.0
x 5.4
General-Purpose Server CPU
x 1.3
x 1.9
x 2.5
200
210
170
135
100
350
ASIC
150
AI
Server
100
General-Purpose Server
50
PC | ||||||
Forecast | Forecast | Forecast | Forecast | Forecast | ||
CY26 | CY27 | CY28 | CY29 | CY30 | ||
0
CY26 CY28 CY30
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Capital Expenditure for the growth of the electronics businessMake additional expenditure to maximize the use of building space at Cell6(Gama Plant) and expand SAP capacity.
For additional expenditure, including Cell7 and Cell9, we aim to finalize detailed terms with
customers and make decisions and disclosures within FY2026.
Gama Plant(Cell6)
Ono Plant(Cell8)
Item
Details
Investment (Cell6)
Previously Announced： JPY 220 billion Newly Added： JPY 150 billion
Operation Start
Sequentially commence operations from FY2029
Products
High-Performance IC Package Substrate for AI ASIC
Item
Details
Investment (Cell8)
Previously Announced： JPY 280 billion
※Considering maximum utilization of building space
Operation Start
Sequentially commence operations from FY2027
Products
High-Performance IC Package Substrate for AI GPU
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Prospective s ite
(Cell7)
Cell6
Prospective s ite
(Cell9)
Cell8
Co 7
Technological Advancement and Development of IC Package Substrates- In addition to becoming larger and more multi-layered, increasingly complex core structures and embedded components are expected to increase added value.
Continue to maintain the position as the top supplier by proactively developing essential elemental-technologies across all areas.
CY25
CY26
CY28
CY30～
Die Size (Reticle)
3.5
5.0
7.5
9 <
Substrate Size
80 x 80
90 x 90
110 x 110
130 x 130 <
SAP
9-X-9
10-X-10
12-X-12
14-X-14
Structure (2.5D)
(Interposer)
(Silicon Bridge)
Power Enhancement
Power Enhancement
Power Enhancement
Power Enhancement
High Speed
+
Low Power Consumption
Optical-Electrical Conversion
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(Board-to-Board Connection) (Package-to-Package Connection) (Die-to-Die Connection)
Trends and Changes in Ceramics MarketNo change in the forecast for internal combustion engine products. Continue to capture demand for
commercial vehicles and construction/agricultural machinery in emerging markets.
For EV products, aim for business expansion by maintaining our top market share among existing customers and acquiring new customers.
Nuclear Power
Generation
For graphite products, aim for business expansion in the nuclear power sector (North America) by steadily securing business opportunities from multiple customers.
Powertrain Market
(According to the information
by the external research firm)
(100GWe)
Additional Capacity
Required
Plan / Forecast
Current Capacity
16
(According to the information by the external research firm)
(Unit: million units)
Gasoline
Diesel・
HV
PHEV
EV
14
12
10
8
6
4
2
CY22
CY25
CY27
CY30
CY35
0
CY26 CY30 CY40
CY50
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R&D Activities for Next Growth-
Aim to expand business fields and create new businesses through in-house development
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R&D Field
NEV
Field
Specialized
Substrate Field
New
Field
and open innovation, leveraging external knowledge.R&D Expenses Trends
LiB Safety Material , High-temperature Insulation
Material and High-temperature Dielectric Material
Customer adoption of a new product for battery safety applications has been secured, with mass production
starting in 1Q FY2027. EV Battery
Products for Power Module and Robotics Field
Develop an ultra-compact actuator and start customer evaluation.
Plant Activator and CO2 Fixation Technology
agricultural markets.
establishment of a new research facility.
※Scheduled to open in October 2028
Promote the expansion of LEAFENERGY into overseas
Signed a location agreement with Gifu City for the
Implemented a 1:2 stock split on October 1, 2026, to expand the investor base and improve market liquidity.
The interim dividend for FY2026 was approved at JPY 10.0 per share, a JPY 2.5 increase from the
year-end dividend for FY2025.
The policy for returns to shareholders is to continue a progressive dividend (until FY2030), with
a guideline of a 20% payout ratio, while maintaining a strong financial position through allocation of funds to growth investments, R&D and human capital, and reduction in interest-bearing debt.
Dividend per Share
(Unit: JPY)
※ Prior year dividends per share adjusted for the October 1, 2026 stock split
20.0
12.5
Year-End Dividend
5.0
2.5
the 110th anniversary dividend
10.0 10.0
5.0 5.0
15.0
7.5
2.5
commemorative dividend for
the start of
mass production at the Ono Plant
10.0
10.0
Interim Dividend
5.0 5.0 5.0 5.0
FY22 FY23 FY24 FY25 FY26
Result (Forecas t)
Copyright 2026 IBIDEN Co.,LTD, All rights reserved