Plexus Corp. · NASDAQ:PLXS
Plexus — Technical Presentation (January 2013)
56 slides from Plexus's technical presentation, Jan 23, 2013
Slide 1: AIA Design for Excellence Webinar
AIA “DESIGN FOR EXCELLENCE” WEBINAR January 23, 2013
Slide 2: Why Are We Here?
WHY ARE WE HERE? Learn how to: • Minimize the risk of cost over-runs • Reduce time to market • Curtail sustainment costs • Enhance product quality • Improve overall total cost of ownership By implementing Design for Excellence techniques in the design process 2
Slide 3: What Is DFX?
WHAT IS DFX? Design for eXcellence (DFX), as defined by Plexus A philosophy and proven process that promotes communication and cooperation between design and manufacturing value streams responsible for the design and manufacture of end products What value does it bring? • Provides continuous design
Slide 4: Plexus: Delivering Optimized Product Realization Solutions
PLEXUS . Delivering Optimized Product Realization Solutions Conceptualize | Design | Commercialize | Manufacture Fulfill | Sustain | iT, Hmeoeeb.f «Ay Dalear MID-LOW VOLUME, HIGHER COMPLEXITY
Slide 5: DFX Embedded Into Design Process
DFX EMBEDDED INTO DESIGN PROCESS Whether as a stand-along service or part of a collaborative development, a comprehensive Design for Excellence approach ensures a product that can be reproduced with high yields over its entire life cycle. Circuit Board Level Box Level • Design for PCB fabrication •
Slide 6: Product Life Cycle Cost Commitments
PRODUCT LIFE CYCLE COST COMMITMENTS 100% Ability to improve costs Cumulative Total life cycle percent of costs cost Costs to implement change 0% Product development Production Support Majority of total life cycle costs are largely determined during development 6
Slide 7: Collaboration in Product Development
COLLABORATION IN PRODUCT DEVELOPMENT Product development process • Early stage – requires more ad hoc and unstructured collaboration • Later stages – require more rigorous and structured collaboration Design for Excellence systems need to be integrated early and be a collaborative activity of the pr
Slide 8: A&D Outsourcing Trends
Booz & Company AIA Design For Excellence Webinar, January 23, 2013 A&D Outsourcing Trends The Need For A Streamlined Outsourcing Process Jono Anderson Principal Engineered Products & Services Booz & Company (N.A.) Inc. © Booz & Company (NA) Inc. – Not for further distribution without permission
Slide 9: Value proposition for outsourcing engineering design is shifting to strategic drivers
Globally, the value proposition for outsourcing engineering design services is shifting towards more strategic drivers Overall Engineering Services Outsourcing Value Drivers Across Verticals (2006-2020, Hi-Tech/ Telecom, Auto, Aerospace, Utilities, Construction/Indus. Machinery) 100% Cost will be le
Slide 10: In India, aerospace engineering expected to grow over next 5-10 years
In India, for example, aerospace engineering is expected to grow over the next 5-10 years $35 Window’s Of Opportunity for Outsourcing of Engineering Services (2004 – 2020) Vertical $30 Utilities Industrial Aerospace Aerospace Value (US$ Billion) $25 (5-10 years) $20 Automotive Automotive (3-7 years)
Slide 11: Avionics, engine and power controls among first outsourced systems
Avionics, engine and power controls are amongst the first systems to have portions of design and manufacturing outsourced Major Systems Major Aircraft Systems Selected Subsystems Vertical Aerostructures Fin Aircraft Systems Interiors Rudder Environmental Aft Power Controls Fuselage Electro-mechanica
Slide 12: Avionics engineering services outsourcing spend projected to increase 5% per year
Focusing on avionics, engineering services outsourcing spend is projected to increase 5% per year to through 2020 ESTIMATED Avionics Spend 2008-2020, $ billions CAGR ’08-’20 Driving Factors $6 7% § New programs $5 § Retrofits 5% $4 4% § Increasing technology complexity § More frequent upgrades $3 §
Slide 13: Avionics outsourcing will outpace most other verticals
Avionics engineering services outsourcing will outpace most other verticals over the next decade ESTIMATED Cross Industry Growth Comparison CAGR - spend CAGR: 2008 - 2020 5.0% 3.4% 2.2% 2.0% 2.0% 1.9% 1.5% 1.5% 1.0% 0.7% Avionics Medical Telecom Industrial Semicon. Computer A&D1 Consumer Consumer Au
Slide 14: Survey: aerospace leaders cite new markets and capacity as major drivers
Based on our survey results, of leaders in aerospace identify access to new markets and the demands on capacity as the major drivers Drivers of R&D Spend in A&D Importance by Company Drivers Aerospace OEM A OEM B OEM C New Markets - Consumer Demand New Products, Segments, Capacity New Features and T
Slide 15: Avionics evolved towards high complexity, hard for OEMs
Avionics have evolved quickly towards high levels of complexity making it difficult for OEMs to maintain up-to-date skillsets Evolution of Avionics Systems & Technologies Common Core System Architectures Distributed Analogue Distributed Digital Federated Digital Integrated Modular Architectures § Ch
Slide 16: Outsourcing focus to move beyond product development and test
Over the next 5-10 years, the focus of outsourcing is expected to move beyond product development and test capabilities Not Exhaustive Engineering Design/Development Value Chain Post Sales/ Req. Technology Product Test & Technical Design Prototyping Integration Aftermarket Analysis Assessment Develo
Slide 17: Technology Driven Designs Make DFX More Critical
TECHNOLOGY DRIVEN DESIGNS MAKE DFX MORE CRITICAL Component packaging technology trends: • Decrease in size (length, width, thickness) • Increase in functionality (electrical, optical, electrical mechanical and mechanical) • Interconnection density per unit area is increasing (increased number of lay
Slide 18: DFX Summary
DFX SUMMARY Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly þ Check point þ Check point þ Check point þ Check point þ Check point Geographical definition Optimized supply chain Design for assembly Design for assembly Design for test – • Documentation language •
Slide 19: DFX Excellence Focus Areas
DFX EXCELLENCE FOCUS AREAS Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 19
Slide 20: Global Environment
Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 20
Slide 21: Global Product Design Elements
GLOBAL PRODUCT DESIGN ELEMENTS Geographical differences Mars climate orbiter • Language • Environmental (local/regional) • Unit of measure (imperial versus metric) • Identify controlling dimension • Identify alternate dimension • Verify accuracy of units • Numerical reporting (decimal versus comma)
Slide 22: Global Material Specification
GLOBAL MATERIAL SPECIFICATION Some materials are controlled by global specifications • Plastics • Electronic components • Printed circuit board laminates Some materials are controlled by local/regional specifications • Metals • Finishes 4. MATERIAL IS AISI 1010- 1020 COLD ROLLED STEEL OR APPROVED SU
Slide 23: Global Material Specification
GLOBAL MATERIAL SPECIFICATION Component fabrication baseline processes can be different Stamped metal fabrication • Sequential/progressive die system versus multiple single die machines (increased tolerance) Plastic injection molding • Percentage of regrind/recycle material allowed Machining • Metri
Slide 24: Global Environment
• Understand cultural differences Global • Define default project conditions Environment • Address material variability in design • Define component fabrication method 24
Slide 25: Conceptual Design
Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 25
Slide 26: Definition of Product Design Requirements
DEFINITION OF PRODUCT DESIGN REQUIREMENTS Physical design allocations • Define X,Y-axis constrained design allocations for printed circuit board assembly and components – PCB/assembly size, feature and edge tolerances – Tight location tolerances for mechanical, electro-mechanical, opto-electronic co
Slide 27: Design for Test Strategy Analysis
DESIGN FOR TEST STRATEGY ANALYSIS Determines the optimal automated test strategy while balancing test costs versus overall yield and capacity for a particular PCB assembly and/or product Uses available automated test technology • Automated Optical Inspection (AOI) • Automated X-ray Inspection (AXI)
Slide 28: Meet Functional and Lifecycle Requirements
MEET FUNCTIONAL AND LIFECYCLE REQUIREMENTS High Risk Component lifecycle analysis reduces the potential impact of near end-of-life components RoHS/non-RoHS compatible analysis ensures compliance with regulatory and product reliability and assembly requirements RoHS & Green Information Part # Supplie
Slide 29: Bill of Materials Accuracy
BILL OF MATERIALS ACCURACY Completeness of bills of material (BoM) • Correct procurable information – Manufacturer – Manufacturer’s part number • Procurement quantity matches reference designator quantity Alternate supplier packages • All suppliers’ packages are equivalent – Functional – Length, wid
Slide 30: Design for Test Schematic Analysis
DESIGN FOR TEST SCHEMATIC ANALYSIS Identifies circuit topologies that will interfere with the control and testing of components within an in-circuit test system Review of the schematics for the following: • Free-running oscillators • Control pins tied hard to power or ground • Control pins tied to a
Slide 31: Component Packaging and Design Impacts
COMPONENT PACKAGING AND DESIGN IMPACTS 0.2 mm 0.4 mm 0.8 mm 1.0 mm 1.27 mm Increased use of leadless component packaging technology • Ball Grid Array (BGA) • Quad Flatpack No-lead (QFN) Increased sensitivity component/printed circuit board flatness • Internal split plane or partial plane • Nonfuncti
Slide 32: Conceptual Design
• Define physical and functional constraints • Define overall test strategy early Conceptual • Supply chain design is critical Design • Application of test and component packaging 32
Slide 33: Initial Design
Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 33
Slide 34: Impacts of Interconnect Design
IMPACTS OF INTERCONNECT DESIGN Placement and types of vias in pad can affect assembly solder joint formation More of an impact on smaller components and/or lower number of electrical connections Design and Construction Affects on PWB Reliability, Paul Reid, IPC Apex Proceedings 2012. 34
Slide 35: Design for Fabrication Analysis
DESIGN FOR FABRICATION ANALYSIS Determines ability of a PCB fabricator to fabricate the PCB and/or issues that may affect cost and long-term reliability Automated rules-driven checking process based on capabilities from a cross-section of multiple printed circuit board suppliers: • Drill – micro-via
Slide 36: Lead Free Assembly Impacts to PCB Laminate
LEAD FREE ASSEMBLY IMPACTS TO PCB LAMINATE Traditional G10 and FR4 printed circuit board laminates cannot survive multiple elevated lead free soldering process exposure or sustain impact to reliability Severity of reliability impacts are influenced by: • Assembly process thermal exposure conditions
Slide 37: Stacked Via in Pad Failure Mode
STACKED VIA IN PAD FAILURE MODE Lead free laminate is less ductile Lead free solder is less ductile Increased stress transmission to internal connections • Test fixture • Assembly fixtures • System integration • Environmental 37
Slide 38: Etch Impacts of Smaller Component Packages
ETCH IMPACTS OF SMALLER COMPONENT PACKAGES Increased PCB supplier control/capability understanding may be required to ensure proper etch compensation values are applied to other surface features and not to conductor patterns. Supplier A Percentage reduction by pad size Supplier B 38
Slide 39: Solder Mask Design and Fabricator Inconsistency
SOLDER MASK DESIGN AND FABRICATOR INCONSISTENCY Non-solder mask defined (NSMD) • Size of pad defined by copper pad and interconnections (variable size) • Solder encapsulates pad • Limited to components with lead pitch greater than 0.4mm Solder mask defined (SMD) • Size of pad defined by solder mask
Slide 40: Initial Design
• Use auto analysis to manage design technology • Ensure delivered product matches design intent Initial Design • Understand lead-free implications and PCB fab constraints • Note traditional tolerancing is inadequate • Documentation ensures vendor implementation integrity 40
Slide 41: Detailed Design
Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 41
Slide 42: Design for Assembly (DFA) Analysis
DESIGN FOR ASSEMBLY (DFA) ANALYSIS Analysis for issues that may affect the ability to assemble the PCB due to board outline, component, footprint, component placement and/or routing issues Automated rules-driven checking based on DFX guidelines • Bill of material analysis – BoM versus CAD • Fiducial
Slide 43: Design Shape versus Component Packaging
DESIGN SHAPE VERSUS COMPONENT PACKAGING Verify design tool information matches physical dimensions of component package • Component body – length, width, height • Component pins match attachment pattern on printed circuit boards – Lead pitch to pad/hole pitch – Lead size to pad/hole size – Lead span
Slide 44: Internal PCB Impacts
INTERNAL PCB IMPACTS Number of layer connections to plated through-hole • Increased number of layer connections increases thermal mass of plated through-hole • Increased number of plane layer connections greatly increases thermal mass of plated through- hole • Increase thermal pad isolation to impro
Slide 45: Bottom Terminate Component Sensitivity
BOTTOM TERMINATE COMPONENT SENSITIVITY Components without leads are more sensitive to minor design and assembly process changes • Land pattern design – Exposed pad size uniformity • Component /printed circuit board flatness/warping – Copper distribution under package • Paste volume control – Pad to
Slide 46: Component Pad - Thermal Imbalance
COMPONENT PAD - THERMAL IMBALANCE Multiple trace connections • Trace connections per pad • Uniformity across all pads on single component Solder mask defined pad increased soldering defects • Delayed reflow across surface mount technology components – Tombstone components – “Ball in socket” area arr
Slide 47: Design for Test Access Analysis
DESIGN FOR TEST ACCESS ANALYSIS Determines probe accessibility to the various components/nets for the purpose of in-circuit testing • Bottom and top side analysis – if required • PCB design database component outlines will be substituted with validated component outline data per component manufactur
Slide 48: Mechanical Stress/Strain Impacts
MECHANICAL STRESS/STRAIN IMPACTS Mechanical stress/strain impact analysis to indentify test-initiated potential latent field failure modes • Solder joint crack initiation or fracture • Micro/buried via design impacts – Surface copper cracking/separation – Internal copper cracking/separation • Mechan
Slide 49: Detailed Design
• Use auto analysis to manage complex design technology • Verify accuracy of design tool to actual component data Detailed • Incorporate assembly process into thermal design Design • Note lead-free sensitivity to material finish differences • Assess test accessibility and density 49
Slide 50: Prototype Assembly
Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly 50
Slide 51: Stencil to PCB Alignment
STENCIL TO PCB ALIGNMENT Smaller components decrease total PCB and assembly process tolerance Minor misalignment can impact process yields 3 mil 6 mil 51
Slide 52: Tin-Lead and Lead Free Solder Differences
TIN-LEAD AND LEAD FREE SOLDER DIFFERENCES Stencil alignment of solder paste to pad tolerance may be critical to good manufacturing yields (Dependant upon PCB surface finish) Tin-lead paste Lead free paste Alpha Metals, SMT Mag Webcast January 2006 52
Slide 53: Tin-Lead vs Lead Free Wicking
TIN-LEAD VS LEAD FREE WICKING Depending upon the pairing of PCB surface finish and component lead finish, the amount of solder wicking/spread can induce or reduce solder defect formation with lead free soldering process Copper, tin, silver and gold Lead free Tin-lead 53
Slide 54: To Clean or Not to Clean?
TO CLEAN OR NOT TO CLEAN? Ability to remove soldering process residues from PCBs may change due to • Component package type • Component size • Solder mask design 54
Slide 55: Prototype Assembly
• Understand impacts of cumulative tolerances of product & production tooling Prototype on assembly Assembly • Optimize design & assembly processes to meet final product requirements 55
Slide 56: DFX Summary
DFX SUMMARY Global Conceptual Initial Detailed Prototype Environment Design Design Design Assembly þ Check point þ Check point þ Check point þ Check point þ Check point Geographical definition Optimized supply chain Design for assembly Design for assembly Design for test – • Documentation language •