Be Semiconductor Industries N.v. · EURONEXT:BESI
Be Semiconductor Industries — Investor Presentation (November 2019)
56 slides from Be Semiconductor Industries's investor presentation, November 2019
Slide 1: Investor Presentation November 2019
INVESTOR PRESENTATION November 2019
Slide 2: Safe Harbor Statement
Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to ex
Slide 3: Agenda
Agenda I. Company Overview II. Market III. Strategy IV. Financial Update and Summary V. Appendix 22 November 2019 3
Slide 4: I. Company Overview
I. COMPANY OVERVIEW 22 November 2019 4
Slide 5: Besi Overview
Besi Overview • Leading assembly equipment supplier with #1 and #2 positions in key markets. 32% addressable market share Corporate Profile • Broad portfolio: die attach, packaging and plating • Strategic positioning in substrate and wafer level packaging • Global operations in 6 countries; 1,634 em
Slide 6: Company History
Company History Die Attach Acquisitions 65% 400 € 356.3 60% •2000 2002 2005 2009 55% Product Strategy 300 • Expanded advanced packaging leadership into die attach area 50% Revenue (€ millions) • Gained market share organically and via acquisitions Gross Margin (%) 55.8% • Gained mindshare with key i
Slide 7: Best in Class Product Portfolio
Best in Class Product Portfolio Die Attach Die Bonding Multi Module Attach Flip Chip Die Sorting Die Lid Attach • 2100 xP / hS plus • 2100 DS New • 2200 evo • 8800 CHAMEO advanced New • WTT New • DLA New • 2100 sD plus / PPP plus • 2100 SC • 2200 evo plus • 8800 TC advanced New • TTR New • 2100 sD a
Slide 8: Customer Ecosystem
Customer Ecosystem Customers OEMs End Products IDMs Subcontractors • Diversified, blue chip customer base, top 10 = 54% of 2018 revenue • Leading IDMs and subcontractors. 68%/32% split in 2018 • Also supply leading fabless companies: Qualcomm, Broadcom, MediaTek via subcontractors • Long term relati
Slide 9: Product Positioning
Product Positioning Semiconductor Manufacturing Equipment (2018: $68.6B)* Front end: $57.8B Assembly: $4.3B Test: $6.5B (84.3%) (6.3%) (9.4%) Semiconductor Assembly Process Dicing Die Attach Wire Bond Packaging** Plating Leadframe Assembly Substrate Wire Bond Assembly Substrate Flip Chip Assembly/TC
Slide 10: Operational Profile
Operational Profile Duiven & Drunen, (The Netherlands) Steinhausen, Radfeld, (Austria) (Switzerland) Chandler Suzhou Chengdu Korea Shanghai Leshan Taiwan Shenzhen Sales Office Philippines Malaysia Production Site Singapore Sales, Production and R&D Site LTM September 30, 2019 Europe/NA Asia • Develo
Slide 11: Summary Financials
Summary Financials Year Ended December 31, Long term, step function revenue growth (€ millions, except share data) 2016 2017 2018 YTD-18 YTD-19 • Last peak reached in 2017 at € 592.8 million Revenue 375.4 592.8 525.3 432.7 263.8 • Current revenue trends affected by market downturn starting in mid 20
Slide 12: Business Model Objectives
Business Model Objectives Objectives Revenue € 800MM Addressable 40%+ Market Share Gross Margin 55-60% Net Margin 30-35% Headcount 80% Asia/20% Euro Split 22 November 2019 12
Slide 13: Capital Allocation Trends
Capital Allocation Trends € millions 209.5 Dividends Share Repurchases 200 35.5 • Shareholder friendly capital allocation program 165.0 • € 643.6 million distributions since 2011: 150 42.6 • € 165.0 million YTD 2019 • Share repurchases have increased as % of mix in recent years 100 88.8 • Current sh
Slide 14: II. Market
II. MARKET 22 November 2019 14
Slide 15: What Drives Besi's Business?
What Drives Besi’s Business? Tech capabilities in IDM customer and Macro GDP trends 24/7 production supply chain environment choice Timing of customer Competitive cycle roadmaps and times and capital spending scalability programs 22 November 2019 15
Slide 16: Assembly Equipment Market Trends
Assembly Equipment Market Trends Assembly Equipment Market Market Size YoY Growth Rate 5.0 30% 22.3% 4.4 4.3 3.8 4.0 20% 3.7 3.5 3.5 US$ billions 25.8% 3.1 3.1 10% 3.0 3.0 12.7% 10.3% 10.3% 0% 2.0 -2.5% -10% 1.0 -20% -16.3% -27.0% 0.0 -30% 2013 2014 2015 2016 2017 2018 2019E 2020E 2021E Source: VLSI
Slide 17: Assembly Equipment Market Composition
Assembly Equipment Market Composition Assembly Equipment Market * Besi Addressable Market * (2018: $4.3 billion) (2018: $1.8 billion) Plating Lead Trim & Form 1.7% Other 5.2% Assembly (Inspection, Wire Bonding Dicing) 22.8% 28.1% Molds & Presses 22.9% Die Bonding 44.6% Die Attach 64% Plating 0.7% Si
Slide 18: Besi Market Share Trends
Besi Market Share Trends 2014 2015 2016 2017 2018 • Market share trending upwards Total Assembly Market ($MM) $3,725 $3,119 $3,515 $4,421 $4,313 • Can vary p.a. based on customer Besi Market Share 13.5% 12.4% 11.9% 15.1% 13.9% road maps and advanced packaging needs Addressable Market ($MM) $1,622 $1
Slide 19: New Era of Chip Growth and Applications Will Drive Greater Computing and Data Needs
New Era of Chip Growth and Applications Will Drive Greater Computing and Data Needs Digital society Driven by new technologies - 5G - AI – big data - Robotics - Transportation - Environment - Health care Will need continuous new solutions - 1zb = 1,000,000,000 tb - 1zb= 1,000 data centres - 1zb = 18
Slide 20: Requiring Increased Density, Higher Accuracy and Smaller Form Factors
Requiring Increased Density, Higher Accuracy and Smaller Form Factors for Next Generation Devices Front End Today => Tomorrow Transistor scaling Lithography New structures 3D Back End Assembly More contacts Smaller pitches Thinner/denser more complex packages From simple Wire Bond to BGA/Flip Chip t
Slide 21: Advanced Packaging Critical to Next Generation Applications
Advanced Packaging Critical to Next Generation Applications Greater Mobile Revolution Miniaturization • Mobile internet • Messaging • Social media • Shared economy Higher Greater • Gaming Accuracy Complexity • Geo-location • Audio/video • Auto electronics Die Bond Packaging Digital Society Datacon 8
Slide 22: Besi Portfolio Well Positioned by Node Size and Accuracy
Besi Portfolio Well Positioned by Node Size and Accuracy Estimated % of 2018 Revenue Typical Application Besi Equipment Accuracy Size 100% Micron NM Die Attach 90% 10+ 28+ Automotive, SiP 25% Packaging Power 80% Plating 70% Die Attach 20% IOT 60% 10 28 Packaging General ICs Plating 50% 40% Computer,
Slide 23: Advanced Packaging Unit Volume and Market Share Are Increasing
Advanced Packaging Unit Volume and Market Share Are Increasing Advanced Packaging Silicon Demand Growth & Market Share 2011 - 2023 55 50% CAGR 2011-2023: 16.6% 41% 43% • Advanced packaging applications have 45 40% 38% 39% 40% grown significantly since 2010 37% 34% 36% • Currently, estimated 37% of w
Slide 24: Fan Out WLP and TCB/TSV Are Emerging Advanced Packaging Process Technologies
Fan Out WLP and TCB/TSV Are Emerging Advanced Packaging Process Technologies Fan Out WLP (Wafer Level) TCB/TSV (Substrate Based) Enabling technology for high end memory and optical Preferred process for high data applications transfer and optical devices in IoT, mobile and power Next step beyond Fli
Slide 25: Besi End User Application Trends
Besi End User Application Trends • Mobile Internet, Computing and 2018 % of Revenue Automotive are largest end markets 40% • Estimated 73% of revenue in 2018 35% 35% • Percentages vary p.a. based on customer roadmaps 30% 25% • Mobile is largest market 21% • % varies based on timing and success 20% 1
Slide 26: Mobile: 5G Is Coming
Mobile: 5G Is Coming Will Drive Increased Mobile Data Traffic and New Applications Source: Ericsson Mobility Report Nov 2018 22 November 2019 26
Slide 27: Mobile: Adoption of 5G Will Expand Applications and Features
Mobile: Adoption of 5G Will Expand Applications and Features With Increased Performance Source: Qualcomm May 2017 ITF Conference 22 November 2019 27
Slide 28: Besi Addressable Market Share of Mobile Increasing
Besi Addressable Market Share of Mobile Increasing Besi technology can support virtually all device platforms utilized in latest mobile devices. 22 November 2019 28
Slide 29: Automotive: Long-Term Outlook Favorable As Electronic Content Increases
Automotive: Long-Term Outlook Favorable As Electronic Content and Features Continue to Increase Source: Yole 22 November 2019 29
Slide 30: Automotive: Requiring a Variety of Package Formats For Customers
Automotive: Requiring a Variety of Package Formats For Customers Source: Amkor investor presentation April 2019 22 November 2019 30
Slide 31: Computing: Demand for Computing Power Growing Exponentially
Computing: Demand for Computing Power Growing Exponentially Source: Intel May 2019 22 November 2019 31
Slide 32: Computing: Assembly Process Becoming Even More Critical Step In CPU Value Chain
Computing: Assembly Process Becoming Even More Critical Step In CPU Value Chain 3D STACKING AND MULTI CHIP ARCHITECTURE AS IMPORTANT OR EVEN MORE IMPORTANT THAN FRONT END PROCESSES !!!!!! Source: ASML Investor Day Nov 2018 22 November 2019 32
Slide 33: III. Strategy
III. STRATEGY 22 November 2019 33
Slide 34: Summary Operating Strategy
Summary Operating Strategy • Expand capabilities for: • Leverage technology leadership to gain share • eWLB, TCB, panel size, ultra thin die bonding in next upturn • Large area, ultra thin, wafer level molding • Increase mainstream penetration of global • Solar and lithium ion battery plating supply
Slide 35: Revenue Opportunities
Revenue Opportunities Roll out 3D imaging and other features to 4G and 5G mobile customers Expand share of Korean and Chinese Android mobile customers Favorable Drivers: Increase share of wallet in Memory/Logic space Digital Society Expand share of Japanese automotive supply chain Big Data • Capital
Slide 36: Asian Production Transfer Has Helped Reduce Break Even Revenue Levels
Asian Production Transfer Has Helped Reduce Break Even Revenue Levels and Improved Cash Generation Asian Production Has Significantly Leading to Lower Fixed European + NA And Reduced Break Even Revenue Improved Cash Generation Expanded Headcount Headcount Levels € millions Shipments 2,000 € millions
Slide 37: Materials Cost Reduction Is Also a Key Priority
Materials Cost Reduction Is Also a Key Priority Material costs are significant = ~35% of revenue Supply Chain Actions • 80% of material now purchased in Asia • Increased outsourcing of modules and high level systems • Vendor consolidation and volume discounts • Increased common parts • Increased Asi
Slide 38: Flexible Production Model Has Generated Consistent Gross Margins
Flexible Production Model Has Generated Consistent Gross Margins in Market Cycles Revenue Gross Margin 180 170 100% 159 161 Current Downturn 160 153 155 90% 140 80% 120 117 109 110 € millions Gross Margin % 100 93 93 93 70% 94 90 90 79 81 80 58.7% 58.0% 55.7% 57.3% 56.3% 56.5% 56.5% 56.4% 55.9% 56.0
Slide 39: Flexible Asian Workforce Has Significantly Enhanced Scalability
Flexible Asian Workforce Has Significantly Enhanced Scalability Fixed Headcount 2,000 85% 1,724 1,692 1,626 1,800 1,605 1,489 1,549 1,546 75% 1,600 • Headcount adjusted consistent with 73% 72% 72% 71% 71% 1,400 67% 65% Headcount 64% 1,200 downturn: 1,000 800 55% • 23.5% reduction realized from peak
Slide 40: Overhead Tightly Controlled Creating Significant Operating Leverage
Overhead Tightly Controlled Creating Significant Operating Leverage Operating Expenses (€ millions) Q3-16 Q3-17 Q3-18 Q3-19 High Low Average Base Line Opex 24.6 27.1 26.3 23.3 27.1 23.3 25.3 Other Opex* 3.6 3.3 2.8 0.9 3.3 0.9 2.7 Total 28.2 30.4 29.1 24.2 30.4 24.2 28.0 * Includes short-term and lo
Slide 41: Besi Strategic CSR Objectives
Besi Strategic CSR Objectives Safeguard safe and healthy CSR Activities 2018 working conditions Maintain best Responsible practices tax practices environmental in all and ethical jurisdictions behavior Improvement in KPI metrics for supply chain activities Reduce Reduce packaging, waste, CSR environ
Slide 42: IV. Financial Update and Summary
IV. FINANCIAL UPDATE AND SUMMARY 22 November 2019 42
Slide 43: Attractive Profit and Margins Maintained in Downturn
Attractive Profit and Margins Maintained in Downturn Q2-19/Q3-19 YTD-18/YTD-19 Revenue Net Margin Revenue Net Margin 100 100% 450 € 432.7 100% € 92.7 - 3.2% € 89.7 90% 400 90% - 39.0% 80 80% 80% 350 Gross Margin Gross Margin € 263.8 -0.9 points 70% 56.9% - 1.2 points 55.7% 70% 56.0% 55.1% 300 OPEX O
Slide 44: Liquidity Trends
Liquidity Trends Cash and Deposits Net Cash 600 571.0 € 174.0 MM Dividend 507.5 500 2017 475.5 € 122.4 MM Dividend Q3-19 vs. Q2-19 443.5 2018 • Net cash increased by € 20.8 million (+24.2%) to 395.5 383.7 € 106.9 million 400 361.7 € millions Q3-19 cash movements • +€ 38.8 million cash provided by op
Slide 45: Guidance Q4-19
Guidance Q4-19 Revenue Gross Margin Operating Expenses -5% € 89.7 MM to 55.1% 54%-56% € 24.2 MM 5% - 10% +5% Q3-19 Q4-19 Q3-19 Q4-19 Q3-19 Q4-19 -15% 22 November 2019 45
Slide 46: Summary
Summary Long term Assembly market Market presence secular trends Disciplined ever more critical has grown via drive continued strategic focus step in key IDM advanced has created an semiconductor customers and packaging industry leader value chain supply chains growth Successful Asian Tech leadershi
Slide 47: V. Appendix
V. APPENDIX 22 November 2019 47
Slide 48: Revenue and Gross Margin Cycles Since 2006
Revenue and Gross Margin Cycles Since 2006 € millions Revenue Gross Margin 700 60% 56.8% 55.5% 600 51.1% 50% 500 -32.7% 39.5% 40% 424 400 34.1% -7.8% -6.9% 593 30% 4 year 525 averages 300 302 354 379 20% 200 -12.9% 351 164 10% 100 191 0 0% 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Slide 49: Baseline Operating Expense Trends
Baseline Operating Expense Trends Base Opex Other Opex 45 39.1 40 34.2 35 7.4 31.8 30.7 3.0 1.0 29.1 30 25.9 26.8 2.8 5.4 24.2 25 0.2 2.1 0.9 20 15 31.2 31.7 30.7 26.3 25.7 25.3 24.7 23.3 10 5 0 Q4-17 Q1-18 Q2-18 Q3-18 Q4-18 Q1-19 Q2-19 Q3-19 Baseline Opex 31.2 31.7 30.7 26.3 25.7 25.3 24.7 23.3 As
Slide 50: Net Income Trends
Net Income Trends Net Income Variable Compensation (a) Net Margin 60% 51.0 50 47.9 47.1 3.8 4.3 50% 10.0 40 40% € millions 43.6 29.3 30 3.1 26.2 37.1 29.3% 30% 28.4% 3.5 22.4 22.3 47.2 25.1% 24.0% 24.5% 3.5 3.1 20 15.9 20.4% 21.4% 20% 26.2 6.4 22.7 10 11.7% 19.2 18.9 10% 9.5 0 0% Q4-17 Q1-18 Q2-18 Q
Slide 51: Currency Exposure Trends
Currency Exposure Trends Revenue Expenses 2018 ∆ 2018 ∆ 2016 Currency Exposure 2017 (2015) 2018 2016 2017 2018 vs. €* Forex Financial Impact vs. €* Euro 25% 18% 33% 26% 21% 29% US dollar 74% 82% 67% 5% 9% 9% Swiss franc - - - 21% 19% 12% Malaysian ringgit - - - 30% 31% 31% Chinese renminbi - - - 11%
Slide 52: Cash Generation Trends
Cash Generation Trends € millions Total Cash Flow from Operations As % of Revenue % of Revenue 200 184.1 180 168.2 160 140 127.5 120 98.7 83.8 100 35.0% 86.5 31.8% 80 73.3 28.4% 29.0% 26.3% 24.8% 60 19.3% 40 20 0 2014 2015 2016 2017 2018 YTD-18 YTD-19 22 November 2019 52
Slide 53: Share Repurchase Activity
Share Repurchase Activity 45 42.6 30.0 40 35.5 25.0 € 23.74 € 23.98 35 € 21.86 30 20.0 Avg Cost per Share € millions 25 22.4 22.8 15.0 20 € 12.44 15 10.0 € 8.93 10 5.0 5 4.0 0 0.0 2015 2016 2017 2018 YTD* Share Repurchases Average Cost per Share * Through October 31, 2019 • 3.0 million shares bought
Slide 54: Dividend Trends
Dividend Trends Dividend (€) Dividend Yield(a) 3.00 12% Cumulative dividends: € 6.70/per share since 2011 2.50 2.32 10% 9.0% 2.00 8.1% 8% 6.6% 1.67 6.5% 1.50 6% 5.5% 1.00 0.87 4% 0.75 0.60 0.50 2% Payout Ratio (b): 77% 79% 93% 100% 91% 0.00 0% 2014 2015 (c) 2016 (c) 2017 2018 Dividend Total Dividend
Slide 55: Dividend Yield vs. Peers
Dividend Yield vs. Peers* 6.0% 5.1% 5.0% 4.0% 3.1% 3.0% 2.5% 2.2% 2.0% 2.0% 2.0% 1.4% 1.3% 1.3% 0.9% 1.0% 0.0% * Current quarterly dividend (annualized)/current stock price. As of October 31, 2019 Source: Morningstar 22 November 2019 55
Slide 56: Besi Shareholder Information
Besi Shareholder Information Symbol/ • BESI Avg. Daily Volume & Liquidity Index • Euronext Midcap AMX Avg Vol * Avg Price (€ thousands) 1000 25,000 Volume (thousands) 800 20,000 Market Market • € 2.4 billion 600 15,000 Cap* ($ 2.7 billion) Profile 400 10,000 200 5,000 Dividend • Pay out 40-100% of 0
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