Te Connectivity Plc · NYSE:TEL

Te Connectivity — Technical Presentation (2019)

17 slides from Te Connectivity's technical presentation, 2019

  1. Slide 1: Delivering 100 Gbps Solutions for Chip-to-Module and DAC Cable Implementations

    Delivering 100 Gbps Solutions for Chip-to- Module and Direct Attach Copper (DAC) Cable Implementations This session was presented as part of the DesignCon 2019 Conference and Expo For more information on the event, please go to DesignCon.com TE Connectivity Confidential & Proprietary. Do not reprodu

  2. Slide 2: Presentation Outline

    Presentation Outline • Introduction • Skew Impact on 𝑆𝑑𝑑21 & 𝑆𝑐𝑑21 • Mating Zone Reflections • Measured results of 112 Gbps DAC • Impact of skew and reflections • Measured results of 112 Gbps C2M • Impact of skew and reflections • Conclusion

  3. Slide 3: Introduction: Why 100G?

    Introduction: Why 100G? 100 Gbps rate enables reasonable port counts and aligns with roadmaps Number of Ports by Lane Rate and SerDes Bandwidth 25 Gbps per Lane 50 Gbps per Lane 100 Gbps per Lane 500 Port Count 250 30 8 4 60 15 8 120 30 15 63 31 125 63 3 TBPS 6 TBPS 12 TBPS 25 TBPS 50 TBPS Aggregate

  4. Slide 4: Skew Impact on Sdd21 & Scd21

    Skew Impact on 𝑆𝑑𝑑21 & 𝑆𝑐𝑑21 𝑆21 𝑒 𝑗𝜃21 + 𝑆43 𝑒 𝑗𝜃43 − 𝑆41 𝑒 𝑗𝜃41 − 𝑆23 𝑒 𝑗𝜃23 𝑆𝑑𝑑21 = 2 ∆𝜃 𝑗𝜃 ∆𝜃𝑋 𝑗𝜃 𝑆𝑑𝑑21 = 𝐼𝐿 𝑐𝑜𝑠 𝑒 21 − 𝑋 𝑐𝑜𝑠 𝑒 41 2 2 𝑆21 𝑒 𝑗𝜃21 − 𝑆43 𝑒 𝑗𝜃43 + 𝑆41 𝑒 𝑗𝜃41 − 𝑆23 𝑒 𝑗𝜃23 𝑆𝑐𝑑21 = Skew 2 ∆𝜃 ∆𝜃𝑋 0 ps (Pink) 𝑆𝑐𝑑21…

  5. Slide 5: Skew Impact on Sdd21 & Scd21 (Modifiers)

    Skew Impact on 𝑆𝑑𝑑21 & 𝑆𝑐𝑑21 Modifiers Lossy, 0 ps Skew ∆𝜃 𝑆𝑑𝑑21𝑀𝑜𝑑 = 𝑐𝑜𝑠 2 ∆𝜃 Lossless, 0 ps Skew 𝑆𝑐𝑑21𝑀𝑜𝑑 = −𝑗𝑠𝑖𝑛 2 - Lossless cases - 𝑆𝑑𝑑21 + 𝑆𝑐𝑑21 = 1 - For 0 ps of skew ∆𝜃 = 0 - For 9 ps of skew ∆𝜃 ≠ 0 - Lossy cases Lossy, 9 ps Skew - 𝑆𝑑𝑑21 + 𝑆𝑐𝑑21 ≠ 1…

  6. Slide 6: Mating Zone Impedance (Mating Zone Reflections)

    Mating Zone Impedance (Mating Zone Reflections) Impedance Form Factor (Ohms) - OSFP, lowest pad width-to-pitch ratio = 0.63 QSFP28 82 - 2D field solver used to calculate characteristic impedance of ONLY the mating pads acting as microstrip traces QSFP-DD 92 - 10% reduction in pad width b/w QSFP28 &

  7. Slide 7: Mating Zone Impedance: Measured results of mating zone

    Mating Zone Impedance (Mating Zone Reflections) Measured results of mating zone Modeled Measured Form (Plug-in card mated to Receptacle) Zo without Zdiff with ∆ Factor Rcpt (Ω) Rcpt (Ω) QSFP28 82 72 10 QSFP-DD 92 77 15 OSFP 101 86 15 - Largest impact on mating interface impedance comes from contact

  8. Slide 8: Mating Zone Impedance (Mating Zone Reflections)

    Mating Zone Impedance (Mating Zone Reflections) - 56 Gbps OSFP connector modified by reducing contact lead-in (referred to as 112 Gbps connector moving forward) - 7 ohm improvement observed when contact lead- in is reduced - Following slides show impact of improved mating zone for 112 Gbps channels

  9. Slide 9: OSFP 112 Gbps DAC, Test Set-up

    Impact of Skew & Reflections, OSFP 112 Gbps DAC, Test Set-up OSFP Pin Map

  10. Slide 10: OSFP 112 Gbps DAC, Measurement Results

    Impact of Skew & Reflections, OSFP 112 Gbps DAC, Measurement Results Results at 26.56 GHz Conn Sdd21 PSXT 1.0 m 30 AWG 112 -16.38 -45.06 1.0 m 30 AWG 56 -18.26 -44.00 1.5 m 28 AWG 112 -17.73 -42.22 1.5 m 28 AWG 56 -19.41 -41.31 - Measurement results shown for - 1.0m 30 AWG Tx8 lane - 1.5m 28 AWG Tx8

  11. Slide 11: Impact of Skew & Reflections, OSFP 112 Gbps DAC

    Impact of Skew & Reflections, OSFP 112 Gbps DAC Added Sdd21 Scd21 Skew (dB) (dB) 1.0 m 30 AWG 0 ps -16.38 -49.10 1.0 m 30 AWG 3 ps -16.66 -28.39 1.0 m 30 AWG 6 ps -17.53 -22.71 1.0 m 30 AWG 9 ps -19.12 -19.68 1.5 m 28 AWG 0 ps -17.73 -37.08 1.5 m 28 AWG 3 ps -17.98 -29.36 1.5 m 28 AWG 6 ps -18.84 -2

  12. Slide 12: OSFP 112 Gbps DAC, COM Calculation

    Impact of Skew & Reflections, OSFP 112 Gbps DAC, COM Calculation - COM calculated using Version 2.51 COM script developed for IEEE 802.3ck specification - Results for 32 lanes (Tx7 & Tx8 lanes/30 & 28 AWG/ 56 & 112 Gbps Connector/ 0, 3, 6, and 9 ps added skew) - All instances pass COM Case 1 (shorte

  13. Slide 13: OSFP 112G VSR (C2M) Channel

    Impact of Skew & Reflections, OSFP 112G VSR (C2M) Channel Results at 26.56 GHz - 8.5” of 5.3-6.45-5.3 diff traces on host Conn Sdd21 PSXT - 1.5” of 6.3mil SE traces on module - MEGTRON 7N HVLP material used 112 -15.61 -47.74 - Host uses 12mil differential vias down to a 56 -16.51 -48.90 Layer 15 rou

  14. Slide 14: 112G VSR (C2M) Channel

    Impact of Skew & Reflections, 112G VSR (C2M) Channel Added Sdd21 Scd21 Skew (dB) (dB) 112 Gbps Conn 0 ps -15.61 -34.74 112 Gbps Conn 3 ps -15.84 -27.64 112 Gbps Conn 6 ps -16.70 -21.92 112 Gbps Conn 9 ps -18.29 -18.87 56 Gbps Conn 0 ps -16.51 -41.47 56 Gbps Conn 3 ps -16.78 -28.60 56 Gbps Conn 6 ps

  15. Slide 15: 112G VSR (C2M), COM Calculation

    Impact of Skew & Reflections, 112G VSR (C2M), COM Calculation - COM calculated using Version 2.41 COM script developed for IEEE 802.3ck specification - Results for 8 lanes (56 & 112 Gbps Connector/ 0, 3, 6, and 9 ps added skew) - All instances pass COM Case 1 & COM Case 2 - Unlike DAC channel, C2M d

  16. Slide 16: Conclusions

    Conclusions • Two main drivers in extending reach are skew and mating zone reflections • Skew, differential insertion loss, and mode conversion are interrelated • By minimizing skew, less differential energy is converted to common mode energy, and differential throughput can be maximized • For any d

  17. Slide 17: References

    References [1] S. Farrahi, V. Kunda, Y. Li, X. Zhang, G. Blando and I. Novak, "Does Skew Really Degrade SERDES Peformance," in DesignCon, Santa Clara, 2015. [2] R. Mellitz, "COM 2.41 with 100GEL Update," 2018. [Online]. Available: http://www.ieee802.org/3/ck/public/adhoc/aug15_18/mellitz_3ck_adhoc_0

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