Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Investor Day (November 2003)
41 slides from Asml Holding Nv's investor day presentation, Nov 13, 2003
Slide 1: Immersion Lithography
Immersion Lithography Jos Benschop 13 Nov 2003 / Slide 1
Slide 2: Safe Harbor
Safe Harbor “Safe Harbor” Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed during this presentation include forward-looking statements that are subject to risks and uncertainties including, but not limited to, economic conditions, product and pricing,
Slide 3: Outline
Outline l Immersion principle: l What is immersion l Why immersion l Why is ASML TWINSCAN ideally suited for immersion l Existing lenses can easily be converted l Dry metrology position l ASML immersion program: l Achievements to date l Next steps l Conclusions / Slide 3
Slide 4: Immersion: liquid between lens and wafer
Immersion: liquid between lens and wafer dry immersion lens gas liquid resist wafer / Slide 4
Slide 5: Why immersion
Why immersion dry immersion Convert existing lens to immersion K Resolution remains same J Increased Depth of Focus • Larger process window => increased yield • Decrease double exposure layers, lower cost per wafer dry immersion Develop new NA>1 immersion lens J Increased resolution Delay wavelength
Slide 6: Existing system, same NA and resolution (1)
Existing system, same NA and resolution (1) same resolution unchanged lens aperture only rays in the vicinity of the wafer change / Slide 6
Slide 7: Existing system, same NA and resolution (2)
Existing system, same NA and resolution (2) same resolution unchanged lens aperture only rays in the vicinity of the wafer change / Slide 7
Slide 8: Existing lens, immersion increases DoF (1)
Existing lens, immersion increases DoF (1) DoF / Slide 8
Slide 9: Existing lens, immersion increases DoF (2)
Existing lens, immersion increases DoF (2) smaller angles Increased DoF ~ refractive index liquid / Slide 9
Slide 10: New lens, increased NA and resolution (1)
New lens, increased NA and resolution (1) new lens with • increased NA • improved resolution / Slide 10
Slide 11: New lens, increased NA and resolution (2)
New lens, increased NA and resolution (2) Hyper NA (NA>1): no imaging without water, only reflection / Slide 11
Slide 12: Benefits of immersion
Benefits of immersion Example: 400 193 nm, k1 = 0.3, k2 = 1 Increase DOF with converted lens DOF [nm] 200 Increased resolution with new NA>1 lens n=1 n=1.43 0 40 60 80 100 Resolution 1/2 pitch [nm] / Slide 12
Slide 13: Outline
Outline l Immersion principle: l What is immersion l Why immersion l Why is ASML TWINSCAN ideally suited for immersion l Existing lenses can easily be converted l Dry metrology position l ASML immersion program: l Achievements to date l Next steps l Conclusions / Slide 13
Slide 14: Not all lenses can be converted to immersion
Not all lenses can be converted to immersion Non flat last lens element Flat last lens element Note: ASML lenses have flat last lens element and can thus be converted to immersion / Slide 14
Slide 15: Dry vs Wet focus sensing
Dry vs Wet focus sensing Air Water Resist Resist Wafer Wafer Process induced focus shift [nm] 100 0 dry -100 -200 -300 Wet -400 -500 -600 0 100 200 300 400 500 600 700 800 resist thickness [nm] / Slide 15
Slide 16: Dry vs Wet focus sensing
Dry vs Wet focus sensing Air Water Resist Resist Wafer Wafer Process induced focus shift [nm] 100 0 Single stage requires wet-focus sensor: dry -100 new and more difficult process qualification -200 -300 Dual stage uses dry-focus sensor: Wet -400proven technology and known process qualification -500
Slide 17: Outline
Outline l Immersion principle: l What is immersion l Why immersion l Why is ASML TWINSCAN ideally suited for immersion l Existing lenses can easily be converted l Dry metrology position l ASML immersion program: l Achievements to date l Next steps l Conclusions / Slide 17
Slide 18: Immersion in 3 steps
Immersion in 3 steps Q2 Q4 2003 2003 step 1 step 2 step 3 basic experiments proof-of-concept commercial tools l fluid definition l fluid containment l edge scan effects l fluid effects l pressure l bubbles l chemical effects l resist l hyper NA imaging l NA l Illumination l platform / Slide 18
Slide 19: Partners in step
Partners in step 1 ASML ASML ASML Philips Zeiss material ISMT VhV Wilton TDC R&D suppliers l fluid definition 157nm l fluid containment l edge scan effects Immersion concepts Platform concepts l fluid effects Resist interfacing High NA imaging Optics concepts l pressure l bubbles l chemical effects
Slide 20: Immersion 193nm fluid H2O
Immersion 193nm fluid H2O / Slide 20
Slide 21: Immersion 157nm fluid
Immersion 157nm fluid / Slide 21
Slide 22: Fluid thickness and scan speed limitations
Fluid thickness and scan speed limitations Optical issues l transmission loss l pupil apodization l temperature impact on focus and aberrations Hydro-dynamical issues l shear forces l laminar flow condition / Slide 22
Slide 23: Fluid thickness and scan speed limitations
Fluid thickness and scan speed limitations Optical issues 193 nm 157 nm − k *d l transmission loss T f = 10 k [/cm] 0.032 0.6 l pupil apodization l temperature impact on focus and aberrations Hydro-dynamical issues l shear forces l laminar flow condition / Slide 23
Slide 24: Fluid thickness and scan speed limitations
Fluid thickness and scan speed limitations Optical issues l transmission loss T = 10-kd θ l pupil apodization T = 10-(kd/cos θ) l temperature impact on focus and aberrations Hydro-dynamical issues l shear forces l laminar flow condition / Slide 24
Slide 25: Fluid thickness and scan speed limitations
Fluid thickness and scan speed limitations Optical issues l transmission loss l pupil apodization l temperature impact on focus and aberrations Hydro-dynamical issues F l shear forces A l laminar flow condition d v / Slide 25
Slide 26: Extensive resist screening
Extensive resist screening nonotop topcoat coat top topcoat coat Many existing resists with added top coat are immersion compatible / Slide 26
Slide 27: Static 80nm L/S images (160nm pitch)
Static 80nm L/S images (160nm pitch) / Slide 27
Slide 28: Immersion in 3 steps
Immersion in 3 steps Q2 Q4 2003 2003 step 1 step 2 step 3 basic experiments proof-of-concept commercial tools l fluid definition lConverted 1150 lens l fluid containment l Wavelength 193 nm l NA = 0.75 l edge scan effects l field 26 x 33mm l fluid effects l pressure lConverted AT platform l bubbles
Slide 29: Modules have been tested and integrated
Modules have been tested and integrated Layout / Slide 29
Slide 30: Intensity contours measured with image sensor
Intensity contours measured with image sensor Dry (NA=0.75, σ=0.55/0.85) Wet (NA=0.75, σ=0.55/0.85) DOF improvement in hydraulic image / Slide 30
Slide 31: AT:1150i, 90nm dense lines and spaces
AT:1150i, 90nm dense lines and spaces Dry Focus Wet -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 / Slide 31
Slide 32: AT:1150i 90nm dense lines&spaces: CD Uniformity
AT:1150i 90nm dense lines&spaces CD Uniformity CD Variations Reticle error corrected 3 sigma [nm] -0.1 0.004 DRY Best Focus 0.004 0.1 0.005 Through Focus 0.004 3 sigma [nm] -0.1 0.003 Best Focus 0.003 WET 0.1 0.003 Through Focus 0.003 CDU results wet as good as dry / Slide 32
Slide 33: AT:1150i 90nm dense lines&spaces: Size Linearity
AT:1150i 90nm dense lines&spaces Size Linearity dense size linearity, m6245 AT:1100 225nm TARF6111 on 37nm ARC28 with AQ6 Dry 300 280 260 240 CD REC-ed [nm] 220 200 180 160 V (0,0) 140 120 H(0,0) 90nm Dense lines Size Linearity 100 80 -10% 10% 225nm TARF6111 + TSP-3A Wet 320 60 300 60 80 100 120 140
Slide 34: AT:1150i, 90nm isolated line
AT:1150i, 90nm isolated line F-0.25 Dry Focus Wet -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 / Slide 34
Slide 35: AT:1150i 90nm isolated lines
AT:1150i 90nm isolated lines Exposure Latitude vs DOF at scanspeed wet dry / Slide 35
Slide 36: AT:1150i 90nm isolated lines: CD Uniformity
AT:1150i 90nm isolated lines CD Uniformity CD Variations Reticle error corrected 3 sigma [nm] -0.1 0.004 DRY Best Focus 0.004 0.1 0.003 Through Focus 0.004 3 sigma [nm] -0.1 0.003 Best Focus 0.004 WET 0.1 0.004 Through Focus 0.004 CDU results wet as good as dry / Slide 36
Slide 37: AT:1150i 90nm isolated lines: Size Linearity
AT:1150i 90nm isolated lines Size Linearity isolated size linearity, m6245 AT:1100 225nm TARF5068 on 37nm ARC28 with AQ6 Dry 300 280 260 240 CD REC-ed [nm] 220 200 180 160 V (0,0) 140 H(0,0) 120 90nm Isolated lines Size Linearity 100 -10% 225nm TARF5068 + TSP-3A Wet 80 10%320 60 300 40 280 60 80 100
Slide 38: AT:1150i, 130nm Iso Contact Hole
AT:1150i, 130nm Iso Contact Hole F0.1 F0.2 F0.3 F0.0 F0.4 F-0.4 F-0.3 F-0.2 F-0.1 F-0.5 F0.0 F0.50 F0.0 F0.0 F-0.6 F0.6 F-0.7 DOF: 1.200 µm F0.7 > 2x larger than dry AT:1150 F-0.8 F0.8 F-0.9 / Slide 38
Slide 39: Immersion in 3 steps
Immersion in 3 steps Q2 Q4 2003 2003 step 1 step 2 step 3 basic experiments proof-of-concept commercial tools l fluid definition lConverted 1150 lens l ArF immersion l fluid containment l Wavelength 193 nm l Convert existing lenses (.85 NA, >.9 NA) l NA = 0.75 l Process Development tools l edge scan
Slide 40: Conclusions
Conclusions l ASML understands the science, application and market opportunities for immersion lithography. l TWINSCAN platform is ideally suited for immersion: l Flat last lens element allows adaptation of existing lenses to immersion enabling process development. l Dry focus and overlay position.
Slide 41: Commitment
Commitment