Himax Technologies, Inc. · NASDAQ:HIMX
Himax Technologies — Technical Presentation (July 2003)
29 slides from Himax Technologies's technical presentation, Jul 22, 2003
Slide 1: Quality Policy Statement
Quality Policy Statement Himax commits ourselves to achieve total customer satisfaction through continuous improvement of our business. Quality Policy Embraces … 1) 達成全面性客戶滿意 To achieve customers’ overall satisfaction. 2) 持續改善是我們日常工作 Continuous improvement is our routine. PAGE 1
Slide 2: Quality Goal
Quality Goal Quality Goal （品質目標 ） 1 、 Defect rate of customer return is less than 300 DPPM for 2003 2500 2000 2000 PPM 1500 PPM 1500 1000 PPM 1000 500 PPM 500 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2 、 The frequency of customers’ complaints shall not exceed three cases per month where the
Slide 3: Quality Assurance Organization
QUALITY ASSURANCE ORGANIZATION QA Dept. QC/SQE QC/QAS RA * SUPPLIER AUDIT/ * QUALITY SYSTEM * Customer Complaint Management MANAGEMENT AUDIT * FAILURE ANALYSIS * QUALITY SYSTEM * Reliability Test * SUPPLIER UPGRADE/MAINTENANCE QUALITY * QUALITY SYSTEM IMPROVEMENT DIAGNOSIS & * NONCONFORM PREVENTION
Slide 4: Quality System Improvement Plan For Y2003
Quality System Improvement Plan For Y2003 Supplier Based Management Supplier In Process Quality – Supplier Quality Eng Team (SQE Team) – Gauge Repeatability & Reproducibility (R&R) – Monthly CIP Meeting – New Product Process Readiness (NPPR) – External System Audit – Tooling Management Customer S
Slide 5: Quality Enhancement Plan
Quality Enhancement Plan PAGE 5
Slide 6: Quality Enhancement Plan
Quality Enhancement Plan • Supplier Quality Eng Product • Phase Review Supplier Based Team (SQE Team) Process (PrP) Development • Design for X Management • Supplier New Product (DFX) Process Readiness (SNPPR) • Supplier Performance Ranking Quality Enhancement Plan •Monthly Quality • SPC Control Cust
Slide 7: Product Development
Product Development PAGE 7 LY
Slide 8: IC New Product Development Control Procedure
IC New Product Development Control Procedure PAGE 8
Slide 9: IC New Product Development Control Procedure
IC New Product Development Control Procedure PAGE 9
Slide 10: Supplier Based Management (SBM)
Supplier Based Management (SBM) PAGE 10
Slide 11: Implementation of SBM
Implementation of SBM Organization Enhancement ( 組織加強 ) SQE Based Organization Foundry Gold Bumping TAB tape Assembly House 晶圓廠 Bumping 廠 TAB tape 廠 封裝測試廠 SQE SQE SQE SQE PAGE 11
Slide 12: Supplier Quality Management
Supplier Quality Management SQPR Supplier Annual Source Audit Monthly Supplier Quality ASL on Review Quality System Meeting Management Quality New Product Abnormal Release C Notice Procedure D A Supplier Quality Goal P PAGE 12
Slide 13: New Supplier Survey
New Supplier Survey Yearly Follow How to become to Himax Up Audit Is Needed Certificated Supplier Perspective Best Supplier Supplier Questionnaire Supplier Fill Out Questionnaire Himax Audit Team Quarterly Supplier Perform Audit for Performance Ranking the 1st Time. T,Q,C,D,S Supplier Make For Certi
Slide 14: Supplier Sourcing
Supplier Sourcing New Supplier Audit Categories Management Delivery Quality New Supplier Service Audit Categories Environment Cost Technology PAGE 14
Slide 15: ASL
ASL on System ASL Login & Logout New Supplier Sourcing NG Evaluation OK ASL CIP OK OK SQP R、 Conditiona Quality Annu l Approval Improve al Audit NG NG Disqualif y End PAGE 15
Slide 16: Prospective Supplier Profile Questionnaire
Prospective Supplier Profile Questionnaire The questionnaire consists of eleven parts( 此問卷調查是由十二個部份所組成 ): 1) Supplier Evaluation Summary ( 供應商評估總表 ) 2) Company Profile ( 公司簡介 ) 3) Location & Address ( 公司地址 ) 4) Technology ( 技術方面 ) 5) Quality ( 品質方面 ) 6)Manufacturing Capability ( 製造能力方面 ) 7)Delivery
Slide 17: QSA Performance
QSA Performance Management Responsibility SHB (F4.1) al ne Quality Systems Requirements: RAR BR (#4.2, 44.17) Customer Service/Contract Review'Control of Supplied Product Personnel Training and Certification SP RB SMHS HM can Bh (#43, #47, #4.19) Control of Quality Records ~~ Gh ACHES Eth) (4.16) /
Slide 18: Supplier New Product Process Readiness
Supplier New Product Process Readiness Supplier Early Involvement F.S. WS ES CS 工程實驗 小量試產 MP 可行性評估 設計階段 量產 階段 階段 Himax Supplier choice from ASL side SNPPR review Supplier Design input & output side Design verification & validation Design change SNPPR execute Note: FS: Feasibility Study WS: Working S
Slide 19: Implementation of SNPPR
Implementation of SNPPR Supplier New Product Process Readiness (SNPPR) Suppl iers Suppliers Himax New Product SQE On Development Site Check Effectively Supplier SNPPR Execute Item Confirm PAGE 19
Slide 20: Monthly Quality Meeting
Monthly Quality Meeting Himax Total Quality Commitment To Our Customers Total Quality Commitment Supplier To Himax’s Customers Total Quality Commitment To Himax Supplier Quality Meeting 1. Failed to Achieve Quality Target: CIP Activities Review Items ◣ Fair Quality: Once per Month 1) Yield ◣ Poor Qu
Slide 21: Quality Abnormal Notice System
Quality Abnormal Notice System QAN System Issue • Register QAN A Performance Index QAN System • QAN On-Time Issue • Reply Date Reply Rate Action Plan • Action Plan No Create QC Review QAN Summary Yes Audit by QC Release QAN No Conformity A Yes Close PAGE 21
Slide 22: Supplier Quality Performance Ranking
Supplier Quality Performance Ranking Quality Cost 25% 25% Performance Ranking 100% Tech. Delivery 25% 25% Weighted Average Winner PAGE 22
Slide 23: Process of Product Quality Control
Process of Product Quality Control PAGE 23
Slide 24: Process of Product Quality Control
Process of Product Quality Control Sponsor Input Procedure Output Foundry IC Design WAT 資料 Bumping Bumping OQC QA WAT 資料 report IC Design CP Test CP test record Tape Maker PE Tape OQC report Related Tape OQC COG Others Assembly/ Dept. report Assembly TCP,COF FT test record PE Assembly house FT test
Slide 25: Reliability Test
Reliability Test @eeeoeeeeeeeghcehmUMMmUMOMDUh HUM WU OHDUMOCOHD6UCUCODCLCODCLO C@ C® PAGE 25 4»
Slide 26: New Product Reliability Test Items
New Product Reliability Test Items Change Item Test Items Package Level Wafer Level HTST LTST THT TCT PCT ESD LU HTOL Change Fab X X X X X V V V Process Generation X X X X X V V V change Process/Material of V V V V V X X X Tape Process/Material of V V V V V X X X Bump Process of Inner Lead V V V V V
Slide 27: Test Items - Device Level
Test Items-------Device Level Test Item Test condition Duration Sample Pass Criterion Reference size Standard ESD Machine Model: - 3 ≧ (±)200V EIA / 1.Equivalent Capacitance JESD22- (Electro-Static A115-A C=200pF Discharge) 2.Equivalent Resistance R=0Ω Latch-up Pulse current injection - 3 ≧ (±)200 m
Slide 28: Test Items - Package Level
Test Items-------Package Level Test Item Test condition Duration Sample size Reference Standard HTST 1250C ±50C 1000 hrs 22 EIAJED- (High Temperature 4701B-111 Storage Test) LTST -650C 1000 hrs 22 EIAJED- 4701B-112 (Low Temperature Storage Test) THT Condition C: 22 EIAJED- 1000 hrs 4701B-121 (Temper
Slide 29: On-going Reliability Test Item (I)
On-going Reliability Test Item (I) Device reliability monitor will be watched by process parameter per month and yield trend chart per week. (Report will keep watch internally) Will do ESD/Latch-up test per quarter. Test Item Test condition Duration Sample size Report Sponsor Process WAT key paramet
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