Infineon Technologies Ag · XETR:IFX
Infineon Technologies — Non-Deal Roadshow (May 2006)
31 slides from Infineon Technologies's roadshow presentation, May 2006
Slide 1: Half Year Roadshow April / May 2006
Half Year Roadshow April / May 2006 Infineon Dr. Wolfgang Ziebart President and CEO Peter J. Fischl Executive Vice President and CFO Presentation for Q2 FY06 June Quarter 2006 Slide - 1 -
Slide 2: Disclaimer
Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that
Slide 3: Contents
Contents Financials Financials and and Outlook Outlook AIM AIM Review Review COM COM Review Review Qimonda Qimonda Review Review Presentation for Q2 FY06 June Quarter 2006 Slide - 3 -
Slide 4: Financials and Outlook
Financials Financials and and Outlook Outlook AIM AIM Review Review COM COM Review Review Qimonda Qimonda Review Review Presentation for Q2 FY06 June Quarter 2006 Slide - 4 -
Slide 5: Results Overview
Results Overview [EUR m] Q2 Q2 FY06 FY06 Q1 Q1 FY06 FY06 Q2 Q2 FY05 FY05 Net sales 1993 1,674 1606 Gross margin 26% 19% 27% R&D expenses 306 311 355 in % of sales 15% 19% 22% SG&A expenses 179 173 164 in % of sales 9% 10% 10% EBIT 28 (122) (117) EBIT excluding one-off’s 28 (122) (44) in % of sales 1
Slide 6: Maintaining a Net Cash Position
Maintaining a Net Cash Position [EUR m] Q2 Q2 FY06 FY06 Mar. Mar. 31, 31, 2006 2006 [EUR m] Operating Gross Net Total cash flow 194 cash cash debt 2,064 40 2,024 Capex (314) 691 Other investments (1) 7 594 Free cash flow (113) 739 5.00% convertible due June 2010 Other long-term debt Presentation for
Slide 7: Business Group Q3 FY06 Outlook as of April 26th
Infineon Business Group Q3 FY06 Outlook as of April 26th ! AIM revenues to remain broadly unchanged qoq with automotive and AIM industrial flat and an expected normalization in chipcard sales from very high Q2 FY06 levels. ! AIM EBIT to be driven by top line prior to inclusion of certain corporate o
Slide 8: AIM Review
Financials Financials and and Outlook Outlook AIM AIM Review Review COM COM Review Review Qimonda Qimonda Review Review Presentation for Q2 FY06 June Quarter 2006 Slide - 8 -
Slide 9: Automotive, Industrial & Multimarket Q2 FY06 Update
Business Group Automotive, Industrial & Multimarket Q2 FY06 Update Revenue share Revenues and EBIT margin Q2 FY06 [EUR m] 733 669 708 631 634 626 652 606 625 37% 13% 8% 11% 8% 6% 8% 10% 4% 4% Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 FY04 FY05 FY06 ! Revenue +12% qoq. Main drivers: power semiconductors for consume
Slide 10: Infineon Technologies: Business Groups and Business Units
Infineon Technologies: 2 Business Groups and 14 Business Units Automotive, Industrial Communication & Multimarket Solutions Microcontroller Feature Phones Automotive Power Entry Phones Sense & Control Mobile Software Power Management & Drive RF Engine Chipcard & Security ICs Access Discrete Semicond
Slide 11: Automotive Semiconductor Market by Applications
Ww Automotive Semiconductor Market by Applications; Safety is the Largest and the Fastest Growing Segment + 7.9 % 25 19,769 CAGR 20 18,680 17,589 Market in bill. US$ 16,260 4,205 7.6 % 14,994 3,933 13,631 3,711 15 3,400 12,546 3,167 2,708 2,.892 5,885 6,362 6,785 10.2 % 10 5,.303 4,739 4,205 3,781 3
Slide 12: Automotive Electronics Need Full Spectrum of Semiconductor Technologies
Automotive Electronics Need Full Spectrum of Semiconductor Technologies Silicon Sensors Power Semis Sensor µC Actuator Microcontrollers •• Special Special processes processes •• High High current current •• High High precision precision •• High High voltage voltage •• Great Great robustness robustne
Slide 13: Automotive Semiconductor Product Segments
Automotive Semiconductor Product Segments Compute Compute Actuate Actuate Sense Sense •• 88 bit bit µCs µCs •• Transistors Transistors •• Pressure Pressure •• 16 16 bit µCs bit µCs •• MOSFETs MOSFETs •• Tire Tire Pressure Pressure •• 32 32 bit bit TriCore® TriCore® •• IGBTs IGBTs •• Temperature Temp
Slide 14: Market Share of Automotive Semiconductor Supplier
Market Share of Automotive Semiconductor Supplier 100% 90% others 80% Philips 70% NEC 60% Toshiba 50% Bosch 40% Renesas 30% STMicro 20% 7.9% 8.2% 8.7% 9.1% Infineon 10% Freescale 0% Presentation for Q2 FY06 June Quarter 2006 2001 Source: Strategy Analytics 2002 2003 2004 Slide - 14 -
Slide 15: The Industrial Market is Very Fragmented
The Industrial Market is Very Fragmented, Regarding Market Players, Applications and Requirements World World Semiconductor Semiconductor Market Market 2004 2004 Industrial Industrial Semiconductor Semiconductor Market Market 2004 2004 100% 100% 90% 90% 80% 80% 70% 70% 60% 60% 50% 50% 40% 40% 30% 30
Slide 16: Infineon Strengthened Market Leadership in Power Semis
Infineon Strengthened Market Leadership in Power Semis Power Semiconductor Market 2003 Rank2004 RankCompany Name 2003 2004 Change 1 1 Infineon 8.1% 8.4% 0.3% 2 2 IR 8.0% 7.8% -0.2% 4 3 Fairchild 7.6% 7.7% 0.1% 3 4 STM 6.7% 7.2% 0.5% 5 5 Toshiba 7.4% 6.7% -0.7% 6 6 Vishay 5.8% 5.9% 0.1% 7 7 Mitsubish
Slide 17: The Industry Business Segmentation
The Industry Business Segmentation Applications Growth Driver ! power ! power supplies supplies and and ! energy ! energy efficiency efficiency Power Power voltage voltage regulators regulators for for ! environment ! environment protection protection Management Management PC, PC, DVD, DVD, flat fla
Slide 18: Key Innovation: Induction Heating with Reverse Conducting IGBT
Key Innovation: Induction Heating with Reverse Conducting IGBT ! IGBT's based on Infineon TrenchStopTM ! TM technology with integrated backside diode lead to highest efficiency in induction applications. ! 600 / 900 / 200V families cover all used line voltages in the world. ! ! Market leader in the
Slide 19: Chip Card and Security Applications
Chip Card and Security Applications Contact-based Contact-based Contactless Contactless chip chip cards cards chip chip cards, cards, RFID RFID Communications Prepaid Mobile Payment Credit / Debit, e-purse Transport, Ticketing Identification ePassport, national ID Social, Access RFID, e-Government E
Slide 20: COM Review
Financials Financials and and Outlook Outlook AIM AIM Review Review COM COM Review Review Qimonda Qimonda Review Review Presentation for Q2 FY06 June Quarter 2006 Slide - 20 -
Slide 21: Communication Solutions Q2 FY06 Update
Business Group Communication Solutions Q2 FY06 Update Revenue share Revenues and EBIT margin Q2 FY06 [EUR m] 419 466 390 332 331 334 314 308 3% 1% -30% -6% -10% 15% 4% 0% (1) -30% -6% -16% -14% -10% -28% -43% Q2 Q3 Q4 Q2 Q3 Q4 Q1 Q2 FY04 FY05 FY06 ! COM revenue declined qoq despite strong broadband
Slide 22: Infineon Technologies: Business Groups and Business Units
Infineon Technologies: 2 Business Groups and 14 Business Units Automotive, Industrial Communication & Multimarket Solutions Microcontroller Feature Phones Automotive Power Entry Phones Sense & Control Mobile Software Power Management & Drive RF Engine Chipcard & Security ICs Access Discrete Semicond
Slide 23: Design Win at Deutsche Telekom for ADSL2+ and VDSL2 Rollout
Design Win at Deutsche Telekom for ADSL2+ and VDSL2 Rollout T-COM‘s VDSL2 network Central Office Deutsche Telekom introduced rollout is entirely based on „T-DSL 16000“ based on Infineon‘s VINAX chip-set. ADSL2+. More than 500K VDSL2 lines Infineon is the major supplier. shipped in FQ2. Street Cabine
Slide 24: Expanding RF Customer Base Through RF CMOS Leadership
Expanding RF Customer Base Through RF CMOS Leadership ! ! No. No. 11 in in RF RF with with approximately approximately 200 200 million million RF RF chips chips sold sold in in CY05 CY05 ! ! Design-win Design-win forfor EDGE EDGE (SMARTi (SMARTi PM) PM) at at Samsung; Samsung; ramp-up ramp-up in in
Slide 25: Competitive Mobile Phone Platforms Offering Leads to Several Design Wins
Competitive Mobile Phone Platforms Offering Leads to Several Design Wins Customer Platform Ramp-up Spezification BB + RF: E-GOLDradio OEM GSM ULC Now ! BB + RF: E-GOLDradio ODM GSM ULC 2H CY06 BB + RF: E-GOLDradio ODM GSM ULC 2H CY06 GSM/GPRS BB + RF: E-GOLDradio BenQ Entry phone 2H CY06 BlueMoon Un
Slide 26: Qimonda Review
Financials Financials and and Outlook Outlook AIM AIM Review Review COM COM Review Review Qimonda Qimonda Review Review Presentation for Q2 FY06 June Quarter 2006 Slide - 26 -
Slide 27: Qimonda Q2 FY06 Update
Q2 FY06 Update Revenue share Revenues and EBIT margin Q2 FY06 [EUR m] 928 811 807 766 768 665 633 659 678 21% 26% (1) 2% -6% 26% 3% 47% 18% -19%4% -17% 3% Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 FY04 FY05 FY06 ! Strong top line growth to second highest quarterly level since foundation of Infineon. ! Significant
Slide 28: FY05/06 and FY 06/07: Planned Measures
FY05/06 and FY 06/07: Planned Measures Graphics Graphics Ramp Ramp Consumer Consumer Ramp Ramp Grow Grow 300mm 300mm share share Grow Grow Non-€ Non-€ share share 90nm 90nm ramp ramp 75nm 75nm ramp ramp … Presentation for Q2 FY06 June Quarter 2006 01/06 12/06 12/07 Slide - 28 -
Slide 29: Share of Graphics DRAMs
Share of Graphics RAMs as of Total DRAM Bit Shipments 20% Share of Graphics DRAMs 15% 10% 5% 0% F1Q 04 F2Q 04 F3Q 04 F4Q 04 F1Q 05 F2Q 05 F3Q 05 F4Q 05 F1Q 06 F2Q 06 F3Q 06 F4Q 06 Qimonda Graphics DRAM share Presentation for Q2 FY06 June Quarter 2006 Source: Qimonda Slide - 29 -
Slide 30: DRAM Trench Technology Roadmap
DRAM Trench Technology Roadmap Optimizing for Performance, Power and Cost Existing universal platforms New dedicated platforms 10000 High Performance Low Power 512 Mbit per 300mm wafer Low Cost Low Invest 80nm 48nm 90nm 1000 110nm 58nm 75nm 140nm 170nm Litho KrF (DUV 248nm) ArF (193nm) ArF immersion
Slide 31: Never stop thinking.
Never stop thinking. Presentation for Q2 FY06 June Quarter 2006 Slide - 31 -