Egis Technology, Inc. · TPEX:6462

Egis Technology — 2025Q1 Investor Conference (May 2025)

18 slides from Egis Technology's conference presentation, May 9, 2025

  1. Slide 1: Egis Technology Inc. 2025Q1 Investor Conference

    Egis Technology Inc. 2025Q1 Investor Conference [email protected] 2025.05.09

  2. Slide 2: Egis Technology Group - Company Profile

    Egis Technology Group - Company Profile 1 Core Products 2 ASIC Design Services Established Patents PMU Founded in 2007 958 patents granted Public Company since 2015 Analog 431 patents pending 8 Public Companies as of 2024 Pixel MCU SPI Memory I/O Employees Offices 3 1300+ SPI I/O Taiwan (8), Korea (

  3. Slide 3: The Evolution of Chips (IC Design)

    The Evolution of Chips(IC Design) 3.0 ChipLet Multi-Die Design 2.0 SoC Single Die 1.0 CPU + Chipset GPU SENSOR GPU HBM 3/4/5nm 10nm MEMORY CPU CPU Chipset I/O PCIe CPU GPU HBM N 3/4/5nm 3/4/5nm 10nm S I/O7nm 7I/O nm I/O7 nm Moore’s Law More than Moore | © 2024 Egis Technology Inc. CONFIDENTIAL 3

  4. Slide 4: AI HPC Server Chiplet Architecture

    AI HPC Server Chiplet Architecture CoWoS Intel Xeon(CPU) + NVIDIA H100 (GPU) NVIDIA GH200 Grace Hopper Superchip NVLink Intel NVIDIA Xeon H100 PCIe/CXL PHY PCIe/CXL PHY PCIe/CXL PHY PCIe/ Ethernet ARM V2 PCIe Device • NVLink vs PCIe Gen5 bandwidth >7X Power consumption <20% | © 2024 Egis Technology

  5. Slide 5: Design Service: From ASIC to Chiplet Architecture Solution

    Design Service From ASIC to Chiplet Architecture Solution ASIC Design Service AI HPC Chiplet CPU NPU IO Memory | © 2024 Egis Technology Inc. CONFIDENTIAL 5

  6. Slide 6: Foundation of Chiplet

    Foundation of Chiplet UCIe CoWoS CoWoS-S：3.3x reticle (2831) CoWoS-R：4x reticle (3432) CoWoS-L：6x reticle (5148) | © 2024 Egis Technology Inc. CONFIDENTIAL 6

  7. Slide 7: AI HPC Server Chiplet Roadmap

    AI HPC Server Chiplet Roadmap Gen0. SoC Gen1. UCIe/CoWoS Gen2. UCIe/CoWoS/IO Die PCIe/CXL PHY PCIe/RDMA Mobius 100 Energon 100 Mobius 200 Energon 200 PCIe/CXL PHY Ethernet UCIe PCIe6 UCIe PCIe6/CXL/112G ethernet UCIe UCIe CSS V3 CSS V4 64 Cores LPU 128 Cores 64 Cores LPU 256 Cores CSS N2 UCIe UCIe U

  8. Slide 8: Chiplet in AI HPC Server / Automotive / Drone / Robotics

    Chiplet in AI HPC Server / Automotive / Drone / Robotics Automotive AI HPC Server Chiplet Alliance CPU NPU CPU UCIe NPU Subsystem Subsystem UCIe UCIe UCIe GPU DSP/VSP Subsystem Subsystem GPU UCIe DPU Safety Island HSM UCIe UCIe ISO 26262 ISO 21434 IO UCIe Memory ISP/Video I/O Die Subsystem Subsystem

  9. Slide 9: Egis IP & Arm CSS V3

    Egis IP & Arm CSS V3 多晶片間存取記憶體 UCIe 資料的一致性 Egis IP | © 2024 Egis Technology Inc. CONFIDENTIAL 9

  10. Slide 10: UCIe Advanced Package - CoWoS

    UCIe Advanced Package - CoWoS • 5/4nm (8 channel, 48Tx/48Rx per channel) • 3nm (8 channel, 64Tx/64Rx per channel) • 12.3Tbps data rate @16G per bit per PHY • 16.38Tbps data rate @16G per bit per PHY • Latency 3~4ns • Latency 3~4ns CONFIDENTIAL 10 | © Egis Technology Inc.

  11. Slide 11: Arm Total Design Partners

    Arm Total Design Partners | © 2024 Egis Technology Inc. CONFIDENTIAL 11

  12. Slide 12: Arm Total Design Partners

    Arm Total Design Partners | © Egis Technology Inc. CONFIDENTIAL 12

  13. Slide 13: Growth Momentum of ARM in the Server Market

    Growth Momentum of ARM in the Server Market Financial Forecast Analysis: Arm targets to achieve a 16%-20% market share in the server market by 2025. 30.00% 25.00% 20.00% 15.00% 10.00% 5.00% 0.00% 2023 2024 2025 2026 2027 2028 Gartner Omdia | © 2024 Egis Technology Inc. CONFIDENTIAL 13

  14. Slide 14: Global ARM-based Server Market

    Global ARM-based Server Market | © 2024 Egis Technology Inc. CONFIDENTIAL 14

  15. Slide 15: AI加速器規模快速成長

    AI加速器規模快速成長 2023~2028年全球資料中心AI加速器市場規模預估 5000 5,020 4,030 4000 3000 3,100 2000 1,520 1000 0 23e 24f 25f 26f 27f 28f 2023/6預估 2023/12預估 2024/10預估 資料來源: AMD、TNP、The Next Platform | © 2024 Egis Technology Inc. CONFIDENTIAL 15

  16. Slide 16: Business Strategy & Core Competency

    Business Strategy & Core Competency HBM • IP：UCIe (D2D), DDR5, PCIeGen6 AI Accelerator Die UCIe (Customization) • ASIC Design Service： (Product) HBM – Arm CSS V3 (3/4nm) – AI Accelerator Die Customization – CoWoS Turnkey Solution UCIe UCIe CPU Die – HBM Base Die Design Service (Product) • Chip：CPU c

  17. Slide 17: Go with Winner

    Go with Winner If I have seen further than others, it is by standing on the shoulders of Giants. and Go further on the way of Success | © 2024 Egis Technology Inc. CONFIDENTIAL 17

  18. Slide 18: Thanks

    Thanks 18 CONFIDENTIAL

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