Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Technical Presentation (August 2014)

41 slides from Infineon Technologies's technical presentation, Aug 1, 2014

1. Slide 1: Die Attach 5

   OSCH NO Infineon dy Die Attach 5 1 August, 2014

2. Slide 2: Agenda

   Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 2 1 Au

3. Slide 3: Sustainability Efforts

   Sustainability Efforts Bosch: Just about half of Bosch’s 2013 research and development budget (4.5 billion euros) focused on the environment and on products designed to conserve resources. It is here that the challenge of the next century lies. Our objective: to develop innovative, useful, and excit

4. Slide 4: Examples for Environmental Protection

   Examples for Environmental Protection CRI Powertrain Innovative electro-tools Photovoltaic with Li-Ion technology Saving energy in basestations Energy efficient Wind energy (gears) Solar thermal appliances ESP Power plant More efficient SSL Household/Office Smart grid lighting 4 1 August, 2014

5. Slide 5: Lead: Environmental and Health Endangerment

   Lead: Environmental and Health Endangerment  Environmental dangers  Health dangers:  Poisonous substance  Neurotoxin  Accumulates in soft tissues & bones  Damage to nervous system  Causes brain disorder  Causes blood disorder in mammals 5 1 August, 2014

6. Slide 6: Agenda

   Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 6 1 Au

7. Slide 7: Use of Lead in Electronics

   Use of Lead in Electronics Exemption Expiry / Review Date Lead in soldering on PCB, the components and their finishes E/2015 Lead in solder for other application, not on PCB or glass E2010 Lead in finishes of Al-Capacitors E/2012 example IC packages Lead in soldering on glass for mass-flow sensors 2

8. Slide 8: Use of Lead in Electronics

   Use of Lead in Electronics  Use of Lead containing Solders in PCB  PbSn63 or PbSn62Ag2 are & have been used for soldering components onto a printed circuit board (PCB)  Leadfree alternative solders known & implemented  E.g. SnAg3.8Cu0.7 (SAC)  Use of high Lead containing Solders as chipsolders

9. Slide 9: Materials for Die Attach: Solder Alloys

   Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) in °C °C 300 300 Temperature in Temperature 250 250 200 200 150 150 100 100 n Ag Ag Ag b b b n Sn

10. Slide 10: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of of solder solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) Temperature in °C 300 300 250 250 200 200 150 150 100 100 nn bb 2S Ag Ag Ag b b n SSnn I

11. Slide 11: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of of solder solder alloys 400 400 Tem perature load & lead-free Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) °C in °C 300 300 Temperature in Temperature 250 250 200 20

12. Slide 12: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 12 1 A

13. Slide 13: Legislation

    Legislation  European End-of-Life Vehicle (ELV) Directive (2000/53/EG) mandates conversion to environmentally friendly materials  Annex II (2010/115/EU, exemptions 8a-j) ELV Rev.5  Exemption may be cancelled if an alternative is available and proven  For 8e (lead in HMT solder) revision 6 starte

14. Slide 14: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 14 1 A

15. Slide 15: DA5 Project

    DA5 Project  Decision to form DA5 consortium in 04/2009  DA5 focus on the use of high melting solder in semiconductor applications, especially for die attach in power packages.  Other applications covered in ELV Annex2, exemption 8e are out of DA5 scope and might have other requirements.  DA5 =

16. Slide 16: DA5 Approach

    DA5 Approach Press Release (Q2/2010) Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-le

17. Slide 17: DA5 Project Objectives

    DA5 Project Objectives  Joint development of semiconductor suppliers to address and mutually define the direction of Pb-free solder d/a-technology development  DA5 is working together with suppliers to find feasible solutions for lead-free die-attach  Suppliers are encouraged to approach DA5 with

18. Slide 18: DA5 Setup for Pb-free Power Die Attach

    DA5 Setup for Pb-free Power Die Attach DA5  Major material suppliers from Europe, US and Asia were assessed  13 Preferred material suppliers were identified  Continuous contact is established.  6 Selected material suppliers out of 13 were chosen  To work out specific solutions within the DA5 pr

19. Slide 19: Targeted Applications

    Targeted Applications  Power Modules  Smart Power ASICs  Power MOS-FETs & IGBTs in SMD packages  Power MOS-FETs & IGBTs in Through-Hole packages (THT)  Different applications have different specifications and may require Pictures not to scale different leadfree solutions 19 1 August, 2014

20. Slide 20: Reliability Requirements

    Reliability Requirements *  AEC-Q100/-Q101 Grade 0  Typical Tjunction 175°C; max. up to 200°C  Thermal/electrical properties  Improvement compared to existing solutions needed  Reflow 260°C (SMD)  Moisture sensitivity level MSL3 or better (SMD)  Wire bonding temp. up to 260°C  Physics of fai

21. Slide 21: Materials

    Materials  4 different material “classes” are in discussion DA 5 21 1 August, 2014

22. Slide 22: Conductive Adhesives I

    Conductive Adhesives I  Principle  High electrical and thermal conductivity of adhesives is achieved with an increased silver content and very dense packing of filler particles.  The development of very high conductivity adhesives is heading towards a further reduction of filler particle size, th

23. Slide 23: Conductive Adhesives II

    Conductive Adhesives II  Advantages  Good adhesion to different types of chip backside and leadframe plating.  Good thermal and electrical performance.  Common production methods and equipment can be used for the application of the material and placement of the chip.  Curing in box ovens under

24. Slide 24: Conductive Adhesives III

    Conductive Adhesives III  Limitations  Adhesive can contain solvents to improve rheology. This requires more careful handling and control of the manufacturing process. It also bears a risk of leadframe and die surface contamination.  Material cost is higher compared to standard adhesives and sold

25. Slide 25: Ag Sintering I – Overview

    Ag Sintering I – Overview  Principle  Ag-sinter pastes: Ag particles (µm- and/or nm-scale) with organic coating, dispersants, & sintering promoters  Dispense, pick & place die, pressureless sintering in N2 or air in box oven  Resulting die-attach layer is a porous network of pure, sintered Ag 

26. Slide 26: Ag Sintering II – Assembly

    Ag Sintering II – Assembly  Dispensability and staging time are improving, but issues persist  Voiding is improving  Process control issue: C-SAM scans are difficult to interpret  Bond line density differences and un- sintered material should be improved Die edge Die center  Unsintered Ag- part

27. Slide 27: Ag Sintering III – 0-hr & Reliability Results

    Ag Sintering III – 0-hr & Reliability Results  Oxidation and/or delamination of interfaces is common, Delamination Die even at 0-hr, lowering adhesion and electrical & thermal performance. Potential solutions (not yet proven):  Reduce oxygen content in atmosphere during curing  Change paste formu

28. Slide 28: TLPS materials I

    TLPS materials I  Advantages  Fulfills many of the drop-in replacement requirements for a paste  Better cost position compared to Ag sintering solutions  Good electrical performance on Ag-plated leadframes  Disadvantages  Medium metal content in die attach  High space rate, filled with Epoxy

29. Slide 29: TLPS material II

    TLPS material II  The hybrid material showed a very high space rate. The spaces are filled with epoxy material  The reflow process is very critical and has to be further optimized, the reflow profile seems to be product specific  Reliability results are contradictory. Results are package/leadfram

30. Slide 30: Alternative Solders I

    Alternative Solders I Properties to be considered  Robust manufacturing process  Repeatable solder application  Stable wetting angle Zn based alloyreference  Surface compatibility (chip backside, lf finish)  Reliability  Voiding / cracking / disruption after stress  Growth of brittle intermet

31. Slide 31: Alternative Solders II

    Alternative Solders II  Zn-based Alloys  Improved workability demonstrated  New formulations demonstrate lower mechanical stress and reduced die cracking, still further improvement required  Limited experience on reliability  Risk of Zn re-deposition can only be falsified in high-volume manufac

32. Slide 32: Key Performance Indicators I

    Key Performance Indicators I Comparison of competing Technologies Adhesives vs. Pb-solder 0-hr Performance (Electrical & Thermal) DA5 assessment refers to 5,0 best tested material in class Experience 4,0 MSL-Performance (long term) 3,0 2,0 Maturity (mass production) 1,0 Reliability 0,0 Surface Sensi

33. Slide 33: Key Performance Indicators II

    Key Performance Indicators II Comparison of competing Technologies Ag Sintering vs. Pb-solder 0-hr Performance (Electrical & Thermal) DA5 assessment refers to 5,0 best tested material in class Experience 4,0 MSL-Performance (long term) 3,0 2,0 Maturity (mass production) 1,0 Reliability 0,0 Surface S

34. Slide 34: Key Performance Indicators III

    Key Performance Indicators III Comparison of competing Technologies TLPS materials vs. Pb-solder 0-hr Performance (Electrical & Thermal) DA5 assessment refers to 5,0 Experience best tested material in class 4,0 MSL-Performance (long term) 3,0 2,0 Maturity (mass production) 1,0 Reliability 0,0 Surfac

35. Slide 35: Key Performance Indicators IV

    Key Performance Indicators IV Comparison of competing Technologies Alternative Solders vs. Pb-solder 0-hr Performance (Electrical & Thermal) DA5 assessment refers to 5,0 Experience best tested material in class 4,0 MSL-Performance (long term) 3,0 2,0 Maturity (mass production) 1,0 Reliability 0,0 Su

36. Slide 36: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 36 1 A

37. Slide 37: DA5 Timeline (Overview/Milestones)

    DA5 Timeline (Overview/Milestones) 12th F2F Technology review & Supplier feedback Neubiberg 1st F2F 2ndF2F 3rd F2F 4th F2F 5th F2F 6th F2F 7th F2F 8th F2F 9th F2F 10th F2F 11th F2F 13th F2F Sibiu Reutlingen Agrate Regensburg Munich Munich Nijmegen Reutlingen Agrate Regensburg Munich Nijmegen General

38. Slide 38: Material freeze DA5 – Automotive Process (ELV)

    Substitute DA5 Material(s) for - Automotive High-LeadProcess(ELV) Release Solders DA Material Semiconductor Electronic Technology Package Component Control Unit Vehicle Technology chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Lead-free Material Technology Component ECU Vehicle Mat

39. Slide 39: Material freeze DA5 – Industrial Process (RoHS)

    Substitute DA5 Material(s) - Industrial for High-Lead Release Solders Process(RoHS) DA Material Package Semiconductor Customer Application Technology Technology Component chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Material Technology Component Product Material freeze Prototype

40. Slide 40: Conclusion

    Conclusion  Today’s lead-free material technologies for semiconductor applications (die attach) are not ready to substitute high-lead solders in power applications  Substantial development efforts have been running for 5 years now and will be continued . Nevertheless the DA5 consortium does not fo

41. Slide 41: Contact Information

    Contact Information Speaker of the DA5 consortium: Bodo Eilken Infineon Technologies AG Email: [email protected] 41 1 August, 2014

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