Infineon Technologies AG · XETR:IFX
Infineon Technologies — DA5 Consortium — Technical Presentation (December 2021)
42 slides from Infineon Technologies's technical presentation, Dec 15, 2021
Slide 1: DA5 Consortium Customer Presentation
DA5 Consortium Customer Presentation
Slide 2: Updates to last version from 18.08.2021
Updates to last version from 18.08.2021 • Slides number 7, 12, 17, 35, 39 and 40 updated • Workshop summary slide number 36 added 15/12/21 (c) 2021 DA5 Consortium 2
Slide 3: Agenda
Agenda • Motivation: Environmental and health endangerment by lead • Status on legislation • Situation: Lead & the use in Electronics • DA5 Structure and Project: • Cooperations and partners • Requirements, Applications and Approaches for possible solutions • Results • Timeline and Conclusion 15/12/
Slide 4: Lead: Environmental and Health Endangerment
Lead: Environmental and Health Endangerment • Environmental dangers: • Poisoning of water, air and soil • Health dangers: • Neurotoxin • Accumulates in soft tissues & bones • Damage to nervous system • Causes brain disorder • Causes blood disorder in mammals • Further information can be found at: ht
Slide 5: Agenda
Agenda • Motivation: Environmental and health endangerment by lead • Status on legislation • Situation: Lead & the use in Electronics • DA5 Structure and Project: • Cooperations and partners • Requirements, Applications and Approaches for possible solutions • Results • Timeline and Conclusion 15/12/
Slide 6: Legislation I
Legislation I • European End-of-Life Vehicle (ELV) Directive (2000/53/EG) mandates conversion to environmentally friendly materials. It sets clear targets for their reuse, recycling and recovery and aims to prevent and limit waste from end-of-life vehicles and their components and to improve the env
Slide 7: Legislation II
Legislation II • European RoHS Directive (2011/65/EU) restricts the use of certain hazardous substances in electrical and electronic equipment • RoHS exemptions allow temporary use of restricted substances. See Annex III in 2011/65/EU (RoHS-2) for exemptions • RoHS II Directive entered into force 21
Slide 8: Agenda
Agenda • Motivation: Environmental and health endangerment by lead • Status on legislation • Situation: Lead & the use in Electronics • DA5 Structure and Project: • Cooperations and partners • Requirements, Applications and Approaches for possible solutions • Results • Timeline and Conclusion 15/12/
Slide 9: Use of Lead in Electronics
Use of Lead in Electronics • Use of Lead containing Solders on PCB-level • PbSn63 or PbSn62Ag2 are & have been used for soldering components onto a printed circuit board (PCB) • Lead-free alternative solders known & implemented • E.g. SnAg3.8Cu0.7 (SAC) • Use of high Lead containing Solders on packa
Slide 10: Materials for Die Attach: Solder Alloys
Materials for Die Attach: Solder Alloys Melting temperature of solder alloys Melting temperature of solder alloys 400 400 Tem perature load & lead-free Tem perature load 350 ( d ur ing sub seq uent assemb ly p r o cesses 350 & p cb - so ld er ing ) Temperature in °C Temperature in °C 300 300 250 250
Slide 11: Agenda
Agenda • Motivation: Environmental and health endangerment by lead • Status on legislation • Situation: Lead & the use in Electronics • DA5 Structure and Project: • Sustainability Efforts • Cooperations and partners • Requirements, Applications and Approaches for possible solutions • Results • Timel
Slide 12: Sustainability Efforts I
Sustainability Efforts I Infineon: We understand sustainability as the symbiosis between economy, ecology and social engagement. At Infineon, we responsibly manage the handling of hazardous materials to safeguard human health and environmental protection. As part of Infineon Group Policy for Environ
Slide 13: Sustainability Efforts II
Sustainability Efforts II Bosch: For the Bosch Group, sustainability means securing the company’s long-term success while at the same time protecting the natural resources on which present and future generations depend. The strategic imperative “Invented for life” thus expresses the aim to make mobi
Slide 14: DA5 Project at a Glance
DA5 Project at a Glance • 04/2009: Decision to form DA5 consortium: STMicroelectronics, NXP Semiconductors, Infineon Technologies, Robert Bosch, and Freescale Semiconductors • DA5 = Die-Attach 5 • ELV Annex2, exemption 8(e) and RoHS 7(a) cover the use of lead in high melting temperatures type solder
Slide 15: DA5 Approach
DA5 Approach Press Release (Q2/2010) at start of DA5 project Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of
Slide 16: DA5 Project Objectives
DA5 Project Objectives • Joint development by semiconductor suppliers to address and mutually define the direction of Pb-free solder die-attach technology • DA5 is working together with material suppliers to find feasible alternative solutions for lead-free die-attach • Evaluate available and potent
Slide 17: DA5 Setup for Pb-free Die-Attach
DA5 Setup for Pb-free Die-Attach • Major material suppliers from Europe, US and Asia were assessed • 20 major material suppliers have been identified • Continuous contact is established. (some stopped to offer relevant materials) • DA5 is continuously looking for further suppliers offering suitable
Slide 18: Challenges/ requirements
Challenges/ requirements • Potential die-attach materials have to withstand the 260°C temperature during second level soldering on PCBs (no re-melting or delamination after 3 times reflow) • Potential die-attach materials have to support • Thin die usage (thickness < 120µm, fillet height control) •
Slide 19: Materials
Materials • 4 different material “classes” are evaluated DA 5 * Transient Liquid Phase Sintering 15/12/21 (c) 2021 DA5 Consortium 19
Slide 20: Conductive Adhesives I
Conductive Adhesives I • Principle • High electrical and thermal conductivity of adhesives is achieved by an increased silver filler content with very dense packing of filler particles. Reduction of particle size to micro and nanoscale stimulates a sintering of the silver particles during the resin
Slide 21: Conductive Adhesives II
Conductive Adhesives II • Advantages • Organic resin improves adhesion to different types of chip backside metals and lead frame platings • Same or better mechanical, thermal, and electrical properties compared to solder, similar to sintered silver. Commonly used die bond equipment can be used for d
Slide 22: Conductive Adhesives III
Conductive Adhesives III • Limitations • Materials contain solvents to improve rheology for dispensing. This requires careful handling and control of the manufacturing process. It also bears a risk of lead frame and die surface contamination • Material cost is higher compared to standard adhesives a
Slide 23: Metal Sintering I – Overview
Metal Sintering I – Overview • Principle • Ag- or Cu-sintering pastes: Ag or Cu particles (µm- and/or nm-scale) with organic coating, dispersants, & sintering promoters • Dispense, pick & place die, pressure-less sintering under N2 or air inside box oven • Resulting die-attach layer is a porous netw
Slide 24: Metal Sintering II – Assembly
Metal Sintering II – Assembly • Dispensability and staging time are improving, long run workability data not available • Voiding is improving • Process control issue: C-SAM scans are difficult to interpret • Bond line density differences should be improved Die edge Die center • Reduction of un-sinte
Slide 25: Metal Sintering III – 0-hr & Reliability Results
Metal Sintering III – 0-hr & Reliability Results • Oxidation and/ or delamination of interfaces is common, even Die Delamination before reliability testing, lowering adhesion and electrical & thermal performance. Potential solutions (not yet proven): • Reduce oxygen content in atmosphere during sint
Slide 26: TLPS materials I
TLPS materials I • Principle of Transient Liquid Phase Sintering (TLPS) • TLPS paste in general is a mixture of a high melting metal powder (for example Cu or Ag) and a Pb-free solder powder (for example Sn based) in an organic flux • After curing a matrix of pure Cu, CuSn alloy (melting temp. > 400
Slide 27: TLPS materials II
TLPS materials II • Quality & Reliability Risks • Risk of overflow on top of die in clip bonding causing shorts between gate and source • High risk of Cu oxidation if oxygen concentration exceeds 300ppm during sintering under nitrogen • Delamination and die crack risk (for larger die sizes) due to h
Slide 28: Alternative Solders I
Alternative Solders I Properties to be considered • Robust manufacturing process • Repeatable solder application Zn based alloy reference • Stable wetting angle • Surface compatibility (chip backside, LF finish) • Reliability • Voiding / cracking / disruption after stress • Growth of brittle interme
Slide 29: Alternative Solders II
Alternative Solders II • Zn-based Alloys • Material currently only available in wire form • Low wettability makes the use of special equipment necessary (capability for mass production open) • Process temperature very high (above 410°C) => high risk for incompatibility with chip technologies • Growt
Slide 30: Key Performance Indicators I
Key Performance Indicators I • Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb-based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to the best material tested in its class • DA5 assessment only vali
Slide 31: Key Performance Indicators II
Key Performance Indicators II • Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb-based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to the best material tested in its class • DA5 assessment only val
Slide 32: Key Performance Indicators III
Key Performance Indicators III • Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb-based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to the best material tested in its class • DA5 assessment only va
Slide 33: Key Performance Indicators IV
Key Performance Indicators IV • Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb-based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to the best material tested in its class • DA5 assessment only val
Slide 34: Agenda
Agenda • Motivation: Environmental and health endangerment by lead • Status on legislation • Situation: Lead & the use in Electronics • DA5 Structure and Project: • Sustainability Efforts • Cooperations and partners • Requirements, Applications and Approaches for possible solutions • Results • Timel
Slide 35: Timeline
Timeline • DA5 meets the selected material supplier three times a year for a common update of the latest material evaluation results • In between alignment meetings between the material supplier and the DA5 work package leader (one DA5 company per selected material supplier) take place • Last DA5-su
Slide 36: Summary DA5-supplier workshop Nov 2021
Summary DA5-supplier workshop Nov 2021 • Six suppliers presented their latest activities on Pb replacement for die attach materials • The results have been discussed thoroughly during the meeting • DA5 provided detailed feedback related to the presented materials • Three new material candidates have
Slide 37: DA5 - Automotive Release Process (ELV)
DA5 - Automotive Release Process(ELV) DA Material Semiconductor Electronic Technology Package Component Control Unit Vehicle Technology chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Lead-free Material Technology Component ECU Vehicle Material freeze Prototype Supply typ. 2 years t
Slide 38: DA5 - Industrial Release Process (RoHS)
DA5 - Industrial Release Process(RoHS) DA Material Package Semiconductor Customer Application Technology Technology Component chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Material Technology Component Product Material freeze Prototype Supply typ. 1 ½ years typ. 1 ½ years type DA5
Slide 39: Conclusion I
Conclusion I • Today’s lead-free material technologies for semiconductor applications (die attach) are not ready to substitute Leaded High Melting Temperature Solders • Substantial development efforts have been running for more than 11 years. 150 materials from more than 13 suppliers were evaluated.
Slide 40: Conclusion II
Conclusion II • Customer qualifications (TIER1 and OEM) and supply chain conversion/ ramp can only begin after package technology and semiconductor component qualification • No single drop-in lead-free solution is in sight! Different applications will need different solutions • It’s likely that some
Slide 41: List of Abbreviations
List of Abbreviations Ag Silver DSS Die Shear Strength MSL Moisture Sensitivity RoHS Restriction of Level Hazardous Substances Au Gold ELV End-of-Life Vehicle N2 Nitrogen Sb Antimony Bi Bismuth EU European Union Ni Nickel Sn Tin C-SAM Scanning Acoustic EU COMM European Union O2 Oxygen TC Thermal Cyc
Slide 42: Contact Information
Contact Information Speaker of the DA5 consortium: Thomas Behrens Infineon Technologies AG Email: [email protected] DA5 customer presentation: http://www.infineon.com/da5customerpresentation The full specification document “DA5 Die-Attach Material Requirement Specification” is available up
DA5 Consortium — Technical Presentation (December 2021) on 6ix