Iei Integration Corporation · TWSE:3022

Iei Integration — Investor Presentation (March 2006)

16 slides from Iei Integration's investor presentation, Mar 28, 2006

  1. Slide 1: WAFER-LX: Small, Efficient and Power-saving

    WAFER-LX Small, Efficient and Power-saving 6W only ! 3.5” Embedded platform Solution! James Yang

  2. Slide 2: WAFER-LX 3.5" AMD Geode LX800 SBC

    WAFER-LX 3.5” AMD® Geode LX800 SBC with Onboard , SATA RAID 0,1,JBOD function support Ideal Thin Client Solution! 6 Watt only ! LX-800 CS5536 Abundant Capabilities within Small Form Factors The IEI WAFER LX series is built within a 3.5” form factors measured 146x102mm with complete system functional

  3. Slide 3: Powerful capabilities with small WAFER-LX form factor

    Powerful capabilities with small WAFER-LX form factor Powerful Capabilities within Small Form Factors IEI WAFER LX series Small yet well beyond the confinement of the 3.5” layout, the WAFER LX sets a new standard for low consumption, Approximate dimensions are 146mm x 102mm. performance, and reliabi

  4. Slide 4: Geode Link Interconnect

    WAFER-LX Complete NB Integrated Solution WAFER-LX Geode Link Bus Architecture V.S. Traditional PC Bus CPU Processor Memory Processor Geode Link Interconnect Memory Controller Controller Graphic North Bridge Memory Display DDR Display DDR333/400 333/400 Display PCI PCI Graphics South Bridge Graphics

  5. Slide 5: 6 Watt only! Real-Time Power Consumption/Thermal Test

    WAFER-LX Real-Time Power Consumption/Thermal Test Average low heat surface ! To ensure system reliability, Real Time Thermal Test it's imperative to keep all Without Heatsink !!! components operating within safe temperature limits. 1 CM 3.3 CM 3.3 CM 1 CM height heatsink ! Real time Power Consumptio

  6. Slide 6: Extra Data Security!

    WAFER-LX Extra Data Security ! DVR + KIOSK + POS all in one solution 188% RAID Function Protection Performance Difference Single disk RAID 0 RAID 1 (disk stripping) (disk mirroring) 250GB 500GB 250GB 250GB General mode RAID 0 mode RAID-1 mode (capacity 250GB*2) (capacity 250GB) (capacity 250GB*2) Sy

  7. Slide 7: Storage Performance with Protection

    Storage Performance WAFER-LX System Performance Test with Protection System Configuration IEI SATA RAID Storage Technology provides RAID capability, Memory :PC 133 SO-DIMM 512MB enabling faster storage performance with data striping with HDD :Western Digital 120GB protecting against data loss from a

  8. Slide 8: Thin Client From Office to Cruel Environment

    Thin Client WAFER-LX From Office to cruel environment Why Thin Client? Special working environment applications demanded Size , Temp, User Account, Security, Cost sensitivity WAFER LX Advantages • Small Size 146 x 102 mm • Low Power 6W • Low Thermal Fanless solution • Wide temp range support 0~60℃ •

  9. Slide 9: Restaurant thin client application

    Thin Client WAFER-LX Restaurant thin client application Menu order System I. Hardware Advantages: • Simple hardware structure • Small size for space saving Ordering • 0 to 60℃ wide temp range • Ease of maintenance • Ease of management by adding or removing Ordering System client WAFERs from the netw

  10. Slide 10: Restaurant thin client application

    Thin Client WAFER-LX Restaurant thin client application Purchasing System Inventory System Purchasing by inventory stock status II. Software Advantages II. Software Cost Advantages •Client-Server embedded software instead of individual OS •Saves you more with more accounts, more users, and more soft

  11. Slide 11: Restaurant thin client application

    Thin Client WAFER-LX Restaurant thin client application Reservation System System Ordering System Menu order System Architecture POS System Client Segment 1 Expands the number of users using the same working system Order Coming IT management Client Segment 2 Central Server Preparing Real time inform

  12. Slide 12: Free Thin Client Administration Tool

    Free Thin Client WAFER-LX Administration Tool ICP RMT (Remote Management Tools) Ver. 1.0 Terminal Services Function •Applications run entirely on the Terminal Server. •The Remote Desktop client performs no local execution of application software. •The server transmits the graphical user interface to

  13. Slide 13: WIN CE / WIN XPE Client Tool Options

    WIN CE / WIN XPE WAFER-LX Client Tool Options Specialties: Benefits: Specialties: Benefits: •Extra Client Applications demands •Shares server loading •Operation relies on Server •Simple architecture •Multi-language support •Quick response action •Web-based application system •Reduces software cost •

  14. Slide 14: AMD Solution Update

    WAFER-LX AMD Solution Update Current Solution Entry- Entry-Level Solution Advanced Solution Model WAFER-5823 WAFER-GX466 WAFER-LX800 Name Form 3.5" 3.5" on ! 3.5" Factor i n g So CPU AMD GX1-300 m Co AMD GX466 AMD LX800 CPU 300 MHz 333 MHz 500 MHz Speed NB AMD GX1-300 AMD GX466 AMD LX800 SB AMD CS55

  15. Slide 15: Specification

    WAFER-LX Specification Specification CPU Audio AMD® Geode LX-800 processor AC’97 Codec Realtek ALC202A Cache Memory Display 64K I/ 64k D L1 cache, 128K L2 cache CRT integrated in AMD® Geode LX800 System Chipset TTL/ LVDS AMD® CS5536 18-bit single channel LCD integrated in AMD Geode LX800 BIOS Watchd

  16. Slide 16: Packing List and Ordering Information

    WAFER-LX Packing List 1 x WAFER-LX single board computer 1 x SATA power cable ( P/N: 32100-086600-RS) 1 x Mini jumper pack 1 x Audio cable ( P/N: 32000-072100-RS) 1 x IDE flat cable 44p/40p/40p ( P/N: 32200-000009-RS) 1 x Second serial port cable ( P/N: 32200-000061-RS) 1 x Keyboard/ PS2 mouse cable

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