Ebara Corporation · TSE:6361

Ebara — Investor Day (July 2026)

13 slides from Ebara's investor day presentation, Jul 14, 2026

  1. Slide 1: The Precision Machinery Company's Medium- to Long-Term Strategy and Technological Capabilities

    EBARA IR Day 2026 <Session 3> The Precision Machinery Company's Medium- to Long-Term Strategy and the Technological Capabilities Supporting the Evolution of Semiconductors July 14, 2026 Isao Nambu Executive Officer President, Precision Machinery Company Division Executive, Equipment Division

  2. Slide 2: Precision Machinery: E-Plan 2028 Business-Specific Strategy

    E-Plan 2028 Business-Specific Strategy E-Vision 2035 Business Vision Global Business Segments ⚫ By empowering rapid innovation and efficient production in the semiconductor industry, we will help Precision advance cutting-edge technologies, support customers’ energy savings and decarbonization, and

  3. Slide 3: EBARA Products: Widely Used in Semiconductor Plants

    EBARA Products: Widely Used in Semiconductor Plants Our company is the world's only manufacturer that provides a wide range of products that contribute to every level of semiconductor manufacturing Semiconductor plant Devices that use temperature management to support semiconductor quality Roof floo

  4. Slide 4: About the Business to Be Explained Today

    About the Business to Be Explained Today Today’s presentation will focus primarily on semiconductor manufacturing equipment (CMP systems) and the devices (Components), which support semiconductor manufacturing equipment Semiconductor Manufacturing Equipment Devices That Support Semiconductor Manufac

  5. Slide 5: CMP: History of Problem Solving

    CMP: History of Problem Solving We have successfully commercialized the world's first dry-in/dry-out process that integrates polishing and drying into a single process The invention of the dry-in/dry-out process The CMP process was difficult to use in a allows the CMP process to be brought into a cl

  6. Slide 6: CMP: Current Position of the Planarization Process

    CMP: Current Position of the Planarization Process The planarization process using the CMP is an essential step in semiconductor manufacturing processes, and the number of processes using it is expected to increase in the future • CMP is a process that chemically and mechanically polishes wafers (se

  7. Slide 7: CMP: A Driver for the Future Expansion of Flattening Needs

    CMP: A Driver for the Future Expansion of Flattening Needs We offer a wide range of solutions to meet the needs in the areas of logic, memory, and advanced packaging Market Trends (Evolution of Semiconductors) Ebara's Value Proposition (Solutions) Logic: Ultrafine Process / Wafer Bonding (Lamination

  8. Slide 8: CMP: Examples of Technological Contributions to Advanced Semiconductors

    CMP: Examples of Technological Contributions to Advanced Semiconductors Leveraging the precision control technology cultivated in front-end processes, we also provide solutions for the middle-end processes that are essential for advanced semiconductors Hybrid Cu Bonding Mid-end process BS-PDN Mid-en

  9. Slide 9: Components: Providing Solutions for the Sub-fab Area

    Components: Providing Solutions for the Sub-fab Area We provide space-saving and energy-saving solutions to address customer challenges such as insufficient sub-fab space and increased power consumption Challenges of Sub-fabrication Ebara's Strengths Solutions • Miniaturization and high integration

  10. Slide 10: Thoughts as Head of Precision and Electronics Business

    Thoughts as Head of Precision and Electronics Business Leveraging the strengths we have cultivated to date, we aim to realize E-Vision 2035/E-Plan 2028 with passion and a focus on results, we strive for the growth of our business, people, and organization, and to contribute to society ⚫ We provide d

  11. Slide 11: Appendix: E-Plan 2028 - Market Share Expansion

    Appendix: E-Plan 2028 - Market Share Expansion Thanks to advancements in cutting-edge semiconductors, the scope of applications for our products is expanding dramatically Semiconductor manufacturing process Coverage area of ​our equipment Component Device Group CMP Systems As semiconductor devices c

  12. Slide 12: Appendix: E-Plan 2028 Business-Specific Strategy

    Appendix: E-Plan 2028 Business-Specific Strategy Precision Machinery Profitability Growth Drivers Growth Investment Expected Effects Improve Profitability Start of operations at the new ⚫ Increased revenue through the development and expansion of sales of equipment development new value-based functi

  13. Slide 13: Disclaimer

    Disclaimer This release contains forward-looking statements that involve certain risks and uncertainties that could cause actual results to differ materially from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements, which are valid only as of the da

Ebara — Investor Day (July 2026) on 6ix