Infineon Technologies Ag · XETR:IFX
Infineon Technologies — CeBIT 2005
29 slides from Infineon Technologies's conference presentation, Mar 10, 2005
Slide 1: CeBIT 2005: Implementing Profitable Growth
CeBIT 2005 March 10, 2005 – Hannover Implementing Profitable Growth Peter Bauer Member of the Management Board CeBIT Presentation Peter Bauer, Member of Infineon Technologies the Management Board 2005-03-10 Slide - 1 -
Slide 2: Disclaimer
Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that
Slide 3: Infineon Technologies as of December 31, 2004: 4 Business Groups; 14 Business Units
Infineon Technologies as of December 31, 2004: 4 Business Groups; 14 Business Units Memory Memory Secure Secure Mobile Mobile Wireline Wireline Automotive Automotive & & Products Products Solutions Solutions Communications Communications Industrial Industrial DRAM DRAM Mobile Mobile Solutions Soluti
Slide 4: Changes in Memory Products
Changes in Memory Products Memory Products SGRAM, SGRAM, DDR DDR SDRAM, SDRAM, DDR2 DDR2 SDRAM SDRAM DRAM DRAM Computing Computing DRAM DRAM Graphics Graphics DRAM DRAM embedded embedded DRAM DRAM Consumer Consumer // Mobile Mobile Mobile-RAM, Mobile-RAM, Flash Flash Flash Flash CellularRAM, Cellula
Slide 5: Changes in Secure Mobile Solutions
Changes in Secure Mobile Solutions Secure Mobile Solutions Communications Mobile Mobile Solutions Solutions Feature Feature Phone Phone Entry Entry Phone Phone RF RF Engine Engine Short Short Range Range Wireless Wireless Wireless Wireless Infrastructure Infrastructure Security Security CeBIT Presen
Slide 6: Wireless Communication: Cont'd to gain market share in RF transceiver in 2004
Wireless Communication: Cont‘d to gain market share in RF transceiver in 2004 Worldwide Worldwide Cell Cell Phone Phone Market Market 2000 2000 to to 2004 2004 [units m] 660 700 600 520 500 407 401 423 400 300 200 100 0 CY 00 CY 01 CY 02 CY 03 CY 04 IFX RF transceiver IFX baseband Infineon‘s market
Slide 7: Successful integration of RF CMOS into baseband: sampling RF baseband system-on-chip
Successful integration of RF CMOS into baseband: sampling RF baseband system-on-chip for GSM/GPRS Infineon’s Infineon’s single-chip single-chip Integrated: ! RF transceiver: SMARTi SD2 demo-phone demo-phone atat 3GSM 3GSM 2005 2005 ! Baseband: E-GOLDlite Advantages over 2-chip solution: ! 30% less b
Slide 8: Transition of complete RF transceiver portfolio to CMOS
Transition of complete RF transceiver portfolio to CMOS: Paving the way for GSM/UMTS single-chip solutions ! Better ! Better cost cost efficiency efficiency BiCMOS BiCMOS ! Lower ! Lower power power CMOS CMOS consumption consumption Coming Coming next: next: UMTS UMTS SMARTi 3G Q4 2002 Exp. mid 2005
Slide 9: E-GOLDradio enables the world's most integrated GSM/GPRS entry phone platform
E-GOLDradio enables the world’s most integrated GSM/GPRS entry phone platform BP2 Platform Key components: ! Redu BP3 Platform c ! Smal ed System ler C Software ! L ess C PCB Size ost Key components: ompl exity CellularRAM / Flash Software MCP Power Mgmt. CellularRAM / Flash E-POWERlite MCP Power Mg
Slide 10: Changes in Secure Mobile Solutions
Changes in Secure Mobile Solutions Secure Mobile Solutions Communications Mobile Mobile Solutions Solutions Feature Feature Phone Phone Remainder: Remainder: moved moved on on July July 1st, 1st, 2004. 2004. Entry Entry Phone Phone Including: Including: Diodes, Diodes, transistors, transistors, Tune
Slide 11: Leverage leading position in digital terrestrial TV into mobile TV
Leverage leading position in digital terrestrial TV into mobile TV ! Infineon is market leader in the fast growing digital terrestrial tuner market (DVB-T standard) ! Our tuner IC products are used in most digital terrestrial standard TV sets, Set- Top-Boxes and world's first PCMCIA card for TV rece
Slide 12: Changes in Wireline Communications
Changes in Wireline Communications Wireline Communications Communications Carrier Carrier Access Access Wireline Wireline Access Access Plastic Plastic Optical Optical Fiber Fiber (POF) (POF) ADMtek ADMtek Cust. Cust. Premises Premises Equip. Equip. Optical Optical Networking Networking Optical Opti
Slide 13: Changes in Automotive & Industrial
Changes in Automotive & Industrial Automotive & Industrial Autom., Ind., Multimarkets Microcontroller Microcontroller Automotive Automotive Power Power Sense Sense & & Control Control Power Power Mgmt Mgmt & & Supply Supply High High Power Power (Eupec) (Eupec) Discrete Discrete Semicond. Semicond.
Slide 14: AIM business focus
AIM business focus Automotive Industrial ! Broad spectrum of power ! Complete product cove- semiconductor technologies rage: Sensors, micro- for all kinds of voltages controllers, power ICs, ! Application-specific reference Plastic Optical Fiber designs ! Over 35 years of ! Technology leadership ena
Slide 15: Changes in Automotive & Industrial
Changes in Automotive & Industrial Automotive & Industrial Auto., Ind., Multimarkets Microcontroller Microcontroller Microcontroller Microcontroller Automotive Automotive Power Power Automotive Automotive Power Power Sense Sense & & Control Control Sense Sense & & Control Control Power Power Mgmt Mg
Slide 16: Infineon Automotive ranks No.2 worldwide by continuously outperforming the market
Infineon Automotive ranks No.2 worldwide by continuously outperforming the market Infineon Automotive 2003 Continuous Outperformance No. 2 World No.1 Europe No. 3 US Motorola 600 indexed Infineon 12.9% Automotive sales Others 500 33.8% Sales Growth 1994 - 2003 8.7% 400 CAGR 20% STM Automotive semico
Slide 17: The Road to 2010: 90% of all Automotive innovations will be driven by electronics
The Road to 2010: 90% of all Automotive innovations will be driven by electronics Production of 73 million light vehicles from 8 OEMs Electronic content: 35% (22% hardware + 13% software) Semiconductor content per car: ~ EUR 300 2010 2002 Production of 57 million light vehicles from 20 OEMs Electron
Slide 18: Longterm outlook offers continuous growth of automotive semiconductors
Longterm outlook offers continous growth of automotive semiconductors 8,2% CAGR 25 22,7 23,5 21,4 19,7 5,6 9,0% 20 17,8 5,3 5,0 15,8 4,6 15 4,1 5,7 7,9% 5,5 $ Billions 3,7 5,2 4,8 4,4 10 3,9 6,5 7,1 7,3 11,2% 5,1 5,9 4,3 5 3,9 4,2 4,4 4,6 4,8 4,8 4,3% 0 2004 2005 2006 2007 2008 2009 CeBIT Presentati
Slide 19: Longterm industry outlook forecasts moderate global light vehicle growth but dynamic automotive electronics
Longterm industry outlook forecasts moderate global light vehicle growth but dynamic automotive electronics and semi markets Market Market Perspective Perspective 2004 2004 2009 2009 CAGR CAGR Growth Growth Drivers Drivers •• Replacement Replacement of of hydraulics hydraulics and and Light Vehicle
Slide 20: Changes in Automotive & Industrial
Changes in Automotive & Industrial Automotive & Industrial Auto., Ind., Multimarkets Microcontroller Microcontroller Microcontroller Microcontroller Automotive Automotive Power Power Automotive Automotive Power Power Sense Sense & & Control Control Sense Sense & & Control Control Power Power Mgmt Mg
Slide 21: Infineon achieved worldwide market leadership for power semiconductors in 2003
Infineon achieved worldwide market leadership for power semiconductors in 2003 Rank Rank Supplier 2003 2001 Change 2003 2001 1 4 Infineon* 8,1% 6,6% 1,5% 2 2 IR 8,0% 7,6% 0,4% 3 6 STM 7,9% 6,3% 1,6% 4 3 Fairchild 7,4% 6,7% 0,7% 5 1 Toshiba 7,2% 8,6% -1,4% 6 5 Vishay 6,1% 6,3% -0,2% 7 Renesas 5,0% 8
Slide 22: Infineon's power logic fab locations
Infineon’s power logic fab locations Regensburg Production and development of Power, RF, BiCMOS, Sensors, Mixed-Signal Villach Production and development of Power, Mixed-Signal Mch-Perlach * and Discretes Production and development of Mixed-Signal, Bipolar RF, BiCMOS, Sensors, Discretes New Fab - Ku
Slide 23: Land plot of the new fab in Kulim High Tech Park
Land plot of the new fab in Kulim High Tech Park Total Area: 476 hectares Comprises of 45 IndustriaL Lots Status of Lease: Phase 1: 91% Phase 2: 38% Total Available Area: Phase 1: 33.6 acres Phase 2: 198.4 acres CeBIT Presentation Peter Bauer, Member of the Management Board 2005-03-10 Slide - 23 -
Slide 24: Why a new logic fab for AIM?
Why a new logic fab for AIM? ! Power semiconductors face a strong and stable long-term growth. ! In-house capacity increase is required for AIM due to volume growth and lack of vital external partnership model. ! Power semiconductors cannot be shrunk as fast as memory or standard logic technologies.
Slide 25: Key Figures of Malaysia fab for power semiconductors
Key Figures of Malaysia fab for power semiconductors Technology Technology ! feature sizes of 0.35µm, 0.5µm, 0.7µm and 1.0µm ! Capacity of about 100k WSPM on 200mm wafers Capacity Capacity & & ! 2 modules, each 5000 m2 clean room (class 10/Litho class 1) Facility Facility ! 1700 employees (1170 dire
Slide 26: Changes in Automotive & Industrial
Changes in Automotive & Industrial Automotive & Industrial Auto., Ind., Multimarkets Microcontroller Microcontroller Microcontroller Microcontroller Automotive Automotive Power Power Automotive Automotive Power Power Sense Sense & & Control Control Sense Sense & & Control Control Tuner Tuner Power P
Slide 27: Significant manufacturing cost reductions in Chipcard ICs
Significant manufacturing cost reductions in Chipcard ICs MicroSlim MicroSlim technology technology 130nm 130nm shrink shrink ! Volume ! Volume roll-out roll-out of of MicroSlim MicroSlim ! Volume ! Volume roll-out roll-out of of first first chipcard chipcard technology technology (66PE (66PE family
Slide 28: Infineon Technologies as of January 1, 2005: 3 Business Groups; 22 Business Units
Infineon Technologies as of January 1, 2005: 3 Business Groups; 22 Business Units Automotive, Automotive, Memory Memory Products Products Communication Communication Industrial Industrial & & Dr. Dr. Andreas Andreas von von Zitzewitz Zitzewitz Kin Kin Wah Wah Loh Loh Multimarket Multimarket Peter Pe
Slide 29: CeBIT Presentation Peter Bauer, Member of the Management Board
CeBIT Presentation Peter Bauer, Member of the Management Board 2005-03-10 Slide - 29 -