Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Mobile World Congress 2008

17 slides from Infineon Technologies's conference presentation, Feb 12, 2008

  1. Slide 1: Infineon Wireless Solutions

    Infineon Wireless Solutions MWC, Barcelona, February 12, 2008 Prof. Dr. Hermann Eul Executive Vice President and Member of the Management Board President Business Group Communication Solutions

  2. Slide 2: Disclaimer

    Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that

  3. Slide 3: Key Cellular Industry Trends and Success Factors

    Key Cellular Industry Trends and Success Factors Key trends Key success factors Strong growth in low-cost phones Integration Share of low-cost phones1) „ RF/Mixed signal integration capabilities to 28% enable single-chip 16% solutions migrating from ULC phones to 2007 2010 feature phones Strong grow

  4. Slide 4: Leading Provider of Single-Chip Solutions, EDGE/3G Platforms, Mobile Software and RF ICs

    Infineon is a Leading Provider of Single-Chip Solutions, EDGE/3G Platforms, Mobile Software and RF ICs Feature and Entry phone Mobile Smartphone RF engine platforms software platforms „ GSM/GPRS and EDGE „ EDGE and 3G/ „ Protocol stack: „ RF transceiver: single-chip solutions HSxPA baseband † GSM/GP

  5. Slide 5: Strengthened its Position in the Wireless Market during 2007

    Infineon Strengthened its Position in the Wireless Market during 2007 Successful platform ramp at Further expansion of leading new customers customer base „ LG Electronics „ Nokia (GSM/GPRS single-chip and EDGE Selected our X-GOLDTM101 GSM/GPRS platform) single-chip for future entry level phones „ E

  6. Slide 6: Infineon Serves the Top-5 Mobile Phone OEMs

    Infineon Serves the Top-5 Mobile Phone OEMs OEM and market share1) Infineon’s position „ Major RF-supplier Nokia 40.2% „ Design win with single-chip platform XMMTM1010 for entry-level phones 9 „ Supplier of EDGE RF and 3G RF Samsung 14.0% „ Major supplier for GSM/GPRS and EDGE platforms 9 Motorola 1

  7. Slide 7: IFX COM Revenues and EBIT Strongly Improved

    IFX COM Revenues and EBIT Strongly Improved IFX COM revenue and EBIT development Drivers: [EUR m] 356 318 „ Strong mobile platform ramp drives 297 improvement following insolvency 259 236 238 of BenQ's German subsidiary in Q4 FY06 „ Consolidation of LSI Mobility Products Group since Oct. 24, 2007 „

  8. Slide 8: Next Steps: Continue Our Successful Strategy

    Next Steps: Continue Our Successful Strategy 1 Execution on design wins in RF and platforms 2 Grow share within existing customers 3 Continue to leverage our core strength in: „ RF „ Single-chip solutions „ Complete mobile platform offering „ Innovative architectures MWC, Feb. 12, 2008 Copyright © I

  9. Slide 9: Achieved Design Win at Tier 1 with HSUPA RF SMARTi UE+

    Achieved Design Win at Tier 1 with HSUPA RF SMARTi™ UE+ In production Sampling IFX position SMARTi SMARTi WiMAX LTE WiMAX/ „ Sampling to top tier LTE customers SMARTi UE SMARTi „ DW at Motorola ramping UE+ HSUPA HSPA/ HSPA/ 2H 2008 EDGE EDGE „ Achieved DW at another Rx Div. tier 1 OEM SMARTi 3G SMAR

  10. Slide 10: Drives Integration from GSM to HSPA

    Infineon Drives Integration from GSM to HSPA In production Ramp 2008 Sampling/R&D MP-EU XMM6080 XMM… SMARTi 3G SMARTi3GE … 3G/HSxPA SMARTi PM X-PMU611 … Sampling PMU X-GOLD608 HSUPA 1H 2008 WCDMA BB HSDPA 65nm Ramping S-GOLD2 90nm 1H 2008 WCDMA 130nm XMM2080 SMARTi PM Single-chip Ramping solutions X

  11. Slide 11: Music and Mobile Internet for Emerging Markets: 65nm Single-Chip Solutions

    Music and Mobile Internet for Emerging Markets: Introducing 65nm Single-Chip Solutions 65nm single-chip solution Benefits X-GOLD™ 213 Lowest-Cost Browsing & Messaging FM radio Audio „ Web browser, MMS, Java PMU „ FM stereo RDS receiver EDGE X-GOLD213 RF „ Audio and video player Baseband EDGE „ Camer

  12. Slide 12: Proven 3G Platform Solution – HSDPA Ramp Planned in 1H 2008

    Proven 3G Platform Solution – HSDPA Ramp Planned in 1H 2008 Infineon successfully ramped Ramp of HSDPA platform its 3G platform MP-EU planned in 1H 2008 3 3 HSDPA/EDGE Baseband baseband 3 3 Power Power management management 3 HSDPA/EDGE 3 RF CMOS transceiver RF CMOS transceiver 3 Dual-mode 3 HSDPA/E

  13. Slide 13: World's First Satellite / Cellular Mobile Platform Based on SDR Technology

    Infineon Introduces World’s First Satellite / Cellular Mobile Platform Based on SDR Technology Current multi-standard Infineon’s SDR-based multi- approach standard solution Base- X-GOLD Cellular band RF Initially XMMTM SDR20 SMARTi supported SDR 200 BB + PMU SR2 Base- Satellite band RF XMMTM SDR 200

  14. Slide 14: GPS ICs are Used by Leading PND and Mobile Phone Customers

    Infineon’s GPS ICs are Used by Leading PND and Mobile Phone Customers GPS market development Infineon’s position in GPS [units m] In production R&D 383 Hammer- Hammer- … head I head II Other GPS GPS GPS 65nm 279 Portable Media Player (PMP) Infineon GPS highlights: 198 Digital Camera „ Hammerhead I i

  15. Slide 15: Sampling Innovative Mobile TV IC Solutions

    Infineon is Sampling Innovative Mobile TV IC Solutions Mobile TV market Infineon’s Mobile TV products Multiple applications OMNIVIA™ TUS 9090 „ Mobile phones Highlights: „ SoC integrates: „ Laptops TUS 9090 „ Multi-band RF tuner „ PDAs „ DVB-H/T demodulator DVB-H/T „ PNDs SoC „ Memory „ Mobile Media

  16. Slide 16: Has All it Takes to Further Grow the Wireless Business

    Infineon Has All it Takes to Further Grow the Wireless Business „ Strong position in single-chip solutions: † Shipped more than 50 million single-chip solutions † IFX is world’s first to ramp EDGE single-chip solution † Sampling 65nm single-chip solutions for GSM/GPRS and EDGE markets 3 „ Strong mom

  17. Slide 17: ae > FS

    ae > 41 FS ci | We parune! We ¢) aate vaiue. Cinfineon Never stop thinking

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