Infineon Technologies AG · XETR:IFX
Infineon Technologies — Lehman Brothers Wireless, Wireline and Media Conference 2006
24 slides from Infineon Technologies's conference presentation, May 23, 2006
Slide 1: Lehman Brothers Wireless, Wireline and Media Conference
Lehman Brothers Wireless, Wireline and Media Conference New York, May 23, 2006 Prof. Dr. Hermann Eul Member of the Infineon Management Board Business Group Communication Solutions Lehman Brothers W3 New York, May 23, 2006 Copyright © Infineon Technologies 2006. All rights reserved. Slide 1
Slide 2: Disclaimer
Disclaimer Please note that while you are reviewing this information, this presentation was created as of the date listed, and reflected management views as of that date. This presentation contains certain forward-looking statements that are subject to known and unknown risks and uncertainties that
Slide 3: Infineon Communication Solutions: A Diversified and Leading Player in the Communication Market
Infineon Communication Solutions: A Diversified and Leading Player in the Communication Market Infineon Communication Solutions FY05 revenue: EUR 1.4bn Mobile Phone Broadband RF Solutions Platforms ! Broadband Access ! RF Engine (3G, 2G) ! Feature Phone (3G, 2G) ! Broadband CPE ! Connectivity ! Entr
Slide 4: What Has Changed During Last Year
What Has Changed During Last Year Major changes ! Achieved profitability in Broadband driven by successful restructuring and revenue growth ! Maintained no. 1 position in RF for mobile phones with approximately 200 million RF chips sold in CY05 Introduced new important products, for example: ! ! ! !
Slide 5: Four Hot Topics in the Communication Market – Infineon Drives Them All
Four Hot Topics in the Communication Market – Infineon Drives Them All HSDPA Cellular ULC ! ULC ("Ultra-Low-Cost") ! HSDPA enabled mobile phones to represent 12% of phones to increase from 10 worldwide mobile phone sales million in 2007 to more than 300 million by 2010* by 2010 compared to 1% in 200
Slide 6: Infineon Communication Solutions Segments
Infineon Communication Solutions Segments Broadband RF Solutions Mobile Phone Platforms Lehman Brothers W3 New York, May 23, 2006 Copyright © Infineon Technologies 2006. All rights reserved. Slide 6
Slide 7: Growth Driver: Broadband Access
Growth Driver: Broadband Access DSL market development Infineon's position Triple play services and network VDSL2 leadership replacement drive DSL demand ! We offer the first fully standard For example: compliant VDSL2 chip solution ! Deutsche Telekom intends to ! Deutsche Telekom will base the prov
Slide 8: Infineon Powers Germany's New VDSL2 Network
Infineon Powers Germany’s New VDSL2 Network May 2005 March 2006 Infineon introduces Infineon powers world’s first VDSL2 solution Germany’s VDSL2 network Infineon’s VINAX™ Solution Powers Germany’s VDSL-2 Rollout in 10 Cities: Deutsche Telekom Becomes the First Carrier Worldwide to Deploy VDSL2 with
Slide 9: Growth Driver: Broadband CPE
Growth Driver: Broadband CPE Market development Infineon's position ! DSL CPE market to grow from 57 ! Infineon broadband gateway million units in 2005 to 85 million units content: by 2009 –ADSL2/2+ / VDSL2 transceiver ! Major growth drivers are VDSL2 and –Switch / router ADSL2/2+ broadband gateways
Slide 10: Growth Driver: VoIP
Growth Driver: VoIP VoIP market development Infineon's position ! New residential VoIP subscribers to Successfully addressing all major increase from 10 million in 2005 to 64 VoIP applications: million in 2009 ! VoIP CO line cards: Design wins at ! This generates a VoIP enabled several major OEMs ma
Slide 11: Infineon Communication Solutions Segments
Infineon Communication Solutions Segments Broadband RF Solutions Mobile Phone Platforms Lehman Brothers W3 New York, May 23, 2006 Copyright © Infineon Technologies 2006. All rights reserved. Slide 11
Slide 12: Growth Driver: RF Transceiver
Growth Driver: RF Transceiver Market development Infineon's position ! 3G phones to grow from 44 million ! No. 1 in RF with approximately 200 in 2005 to almost 350 million in million RF chips sold in CY05 2009 ! Leading the transition to RF CMOS ! EDGE phones to grow from 77 Infineon introduced: mil
Slide 13: Expanding RF Transceiver Customer Base
Expanding RF Transceiver Customer Base Samsung selects Infineon’s EDGE CMOS transceiver Samsung Selects RF Transceiver from Infineon for EDGE Mobile Phones; Chip Reduces Number of Components and Board Space 20 Apr 2006 Munich, Germany – April 20, 2006 – Infineon Technologies AG (FSE/NYSE: IFX) today
Slide 14: Growth Driver: Connectivity
Growth Driver: Connectivity Growth driver Infineon's position Increasing demand for connectivity in mobile phones: Bluetooth ! Customers: BenQ, Panasonic 70% [% of worldwide mobile ! Bluetooth 2.0 + EDR solution phone shipments] sampling since early 2005 60% ! New design wins at BenQ and OEM to ramp
Slide 15: Growth Driver: Digital Terrestrial TV and Mobile TV
Growth Driver: Digital Terrestrial TV and Mobile TV Digital terrestrial TV Growth Drivers: Infineon's Position: ! Introduction of digital ! Leading share worldwide in terrestrial TV in many tuners for digital terrestrial regions TV ! Analog terrestrial TV to ! Infineon tuners are fully be switched o
Slide 16: Growth Driver: Digital Cordless
Growth Driver: Digital Cordless Growth driver Infineon's position ! Main growth driven by ultra low- ! More than 180 million digital cost segment cordless modems shipped so far ! Replacement of corded phones ! Infineon plans to regain market and analog standards leadership with digital cordless ! 2.
Slide 17: Infineon Communication Solutions Segments
Infineon Communication Solutions Segments Broadband RF Solutions Mobile Phone Platforms Lehman Brothers W3 New York, May 23, 2006 Copyright © Infineon Technologies 2006. All rights reserved. Slide 17
Slide 18: Infineon Provides All Key Elements For 7.2 Mb/s HSDPA
Infineon Provides All Key Elements For 7.2 Mb/s HSDPA HSDPA multimedia baseband S-GOLD 3H ! One-chip HSDPA / WCDMA / EDGE solution ! 7.2 Mbit/s baseband ! ! Video telephony and streaming without companion ! Status: Sampling HSDPA RF CMOS transceiver SMARTi 3GE ! World's first one-chip six-band WCDMA
Slide 19: Leadership in GSM/GPRS Single-Chip Solutions
Leadership in GSM/GPRS Single-Chip Solutions February 2005 Q1 2006 May 2006 Infineon announced Infineon begins Infineon achieved 1st gen. RF/BB 1st gen. single-chip call on air with single-chip volume shipments 2nd gen. single-chip EGOLDvoice: EGOLDradio: RF + Baseband RF + Baseband + Power Manageme
Slide 20: Expanding Mobile Phone Platform Customer Base
Expanding Mobile Phone Platform Customer Base Complete offering Design wins from 2G to 3.5G Software Ramp- Customer Platform up APOXI reference MMI Applications APOXI framework OEM GSM ULC In production ! Protocol stack ODM GSM ULC 2H CY06 Realtime operating Hardware driver system ODM GSM ULC 2H CY0
Slide 21: Significant Progress in 65nm
Significant Progress in 65nm Achieved call on air with 65nm mobile phone IC Advanced 65nm mobile phone chip works first time - 30 million transistors integrated on one cell phone key 12 May 2006 Munich, May 12, 2006 – Infineon Technologies AG announced today that the first cell phone chips equipped
Slide 22: Infineon is in a Strong Position to Drive the Convergence of Voice, Video and Data
Infineon is in a Strong Position to Drive the Convergence of Voice, Video and Data Towards Seamless Communication For example … Broadband gateways Mobile phones Potential Infineon content: Potential Infineon content: " ADSL2/2+ / VDSL2 " 3G / 2G RF CMOS transceiver transceiver " Switch / router " 3G
Slide 23: Summary
Summary Mobile Phone Broadband RF Solutions Platforms ! Top 3 position in overall ! Market leader in RF ! Major player in wireline access IC trans-ceiver and digital baseband market terr. tuner ! Complete system ! Complete broadband ! Top 3 position in several solution offering from and VoIP product
Slide 24: Never stop thinking.
Never stop thinking. Lehman Brothers W3 New York, May 23, 2006 Copyright © Infineon Technologies 2006. All rights reserved. Slide 24
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