Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Investor Presentation (November 2013)

57 slides from Infineon Technologies's investor presentation, Nov 12, 2013

  1. Slide 1: Company Presentation

    Company Presentation November 12, 2013

  2. Slide 2: Table of Contents

    Table of Contents  Market and Business Development Fourth Quarter FY 2013  Business Focus  Segments, Products and Technology  General Company Information 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 2

  3. Slide 3: Table of Contents

    Table of Contents  Market and Business Development Fourth Quarter FY 2013  Business Focus  Segments, Products and Technology  General Company Information 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 3

  4. Slide 4: Positive Growth Outlook for Global Semiconductor Market

    Positive Growth Outlook for Global Semiconductor Market Global Semiconductor Market w/o Memory, w/o Microprocessor in Billion US-Dollar 2012: $ 292 bn 34% Memory & MPU 214 66% 197 ToMM1 206 189 194 193 194 163 169 156 149 144 135 123 107 84 90 91 90 78 1997 1998 1999 2000 2001 2002 2003 2004 2005 20

  5. Slide 5: Infineon Holds Top Positions in All Target Markets

    Infineon Holds Top Positions in All Target Markets Automotive Power Chip Card #2 #1 #1 Renesas 14% Infineon 12% Infineon 24.1% Infineon 9% Toshiba 7% NXP 23.8% STMicro 8% Mitshubishi 7% Samsung 22% Freescale 7% STMicro 6% STMicro 17% NXP 6% Fairchild 6% SHHIC 6% Automotive semiconductors in Power se

  6. Slide 6: Infineon at a Glance

    Infineon at a Glance The Company  Infineon provides semiconductor and system solutions, focusing on three central needs of our modern society: Energy Efficiency, Mobility and Security  Revenue in FY 2013: € 3.843 billion  26,725 employees worldwide (as of September 2013)  Strong technology portf

  7. Slide 7: Infineon Group Results for FY 2013 vs FY 2012

    Infineon Group Results for FY 2013 vs FY 2012 Revenues Net Income in € Million 2012 2013 -2% 3,904 3,843 Revenues 3,904 3,843 Segment Result (SR) 527 377 427 SR Margin 13.5% 9.8% 272 FY12 FY13 FY12 FY13 Net Income 427 272 Free Cash Flow -219 235 Investments 890 378 Net Cash 1,940 1,983 Market capita

  8. Slide 8: Infineon Group Results for Q4 FY13 vs Q3 FY13

    Infineon Group Results for Q4 FY13 vs Q3 FY13 Revenues Net Income in € Million Q3 13 Q4 13 +3% 1,022 1,053 Revenues 1,022 1,053 Segment Result (SR) 117 148 142 77 SR Margin 11.4% 14.1% Q3 FY13 Q4 FY13 Net Income 77 142 Free Cash Flow 135 156 Gross Cash Position 2,137 2,286 Net Cash 1,835 1,983 2013-

  9. Slide 9: Infineon Group Results for Q4 FY13 vs Q4 FY12

    Infineon Group Results for Q4 FY13 vs Q4 FY12 Revenues Net Income Q4 12 in € Million Q4 13 +7% 982 1,053 Revenues 982 1,053 Segment Result (SR) 116 148 138 142 SR Margin 11.8% 14.1% Net Income 138 142 Q4 FY12 Q4 FY13 Free Cash Flow 47 156 Gross Cash Position 2,235 2,286 Net cash 1,940 1,983 2013-11-

  10. Slide 10: Infineon Segment Revenues Q4 FY13 vs Q3 FY13

    Infineon Segment Revenues Q4 FY13 vs Q3 FY13 Revenue* in € Million Share of Total Q3 FY13 459 ATV -1% 43% Q4 FY13 455 Q3 FY13 173 IPC +14% x% 197 19% Q4 FY13 Q3 FY13 266 PMM +2% x% 44% Q4 FY13 271 26% Q3 FY13 119 CCS +8% Q4 FY13 129 12% *Total Revenue (Q3 FY13: 1,022m €; Q4 FY13: 1,053m €) includes

  11. Slide 11: Infineon Segment Results Q4 FY13 vs Q3 FY13

    Infineon Segment Results Q4 FY13 vs Q3 FY13 Segment Result* (SR) in € Million SR Margin Q3 FY13 52 11% ATV Q4 FY13 57 13% Q3 FY13 13 8% IPC Q4 FY13 33 17% Q3 FY13 46 17% PMM Q4 FY13 49 18% Q3 FY13 10 8% CCS Q4 FY13 12 9% *Total Segment Result (Q3 FY13: 117m €; Q4 FY13: 148m €) includes Other Operati

  12. Slide 12: Revenue Split by Segments

    Revenue Split by Segments FY 2013 Revenue: € 3,843m Automotive IPC ATV IPC € 1,714m € 651m CCS PMM € 463m € 987m Chip Card & Security PMM OOS+ C&E* € 28m * Other Operating Segments; Corporate & Eliminations. 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 12

  13. Slide 13: Proportional Revenue Infineon Group by Regions

    Proportional Revenue Infineon Group by Regions: FY 2013 and FY 2012 44% 41% 38% 40% 12% 13% 6% 6% therein: 23% 21% therein:16% 18% Americas Germany China Japan Asia / Pacific Europe, Middle East, Africa (EMEA) FY 2012 FY 2013 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved.

  14. Slide 14: Table of Contents

    Table of Contents  Market and Business Development Fourth Quarter FY 2013  Business Focus  Segments, Products and Technology  General Company Information 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 14

  15. Slide 15: We Focus on Our Target Markets

    We Focus on Our Target Markets Focus Areas Core Competencies  Energy Efficiency  Analog/Mixed Signal  Mobility  Power  Security  Embedded Control  Manufacturing Competence Our Target Markets  Automotive  Industrial Electronics  Information and Communications Technology  Security 2013-11-1

  16. Slide 16: We Focus on Three Areas with Highly Attractive Future Perspectives

    We Focus on Three Areas with Highly Attractive Future Perspectives Energy Efficiency Mobility Security Automotive Industrial Power Control Power Management & Multimarket Chip Card & Security 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 16

  17. Slide 17: Energy Efficiency

    Energy Efficiency Key Trends  Soaring total energy demand across the globe amid dwindling fossil energy resources  Strong CO2 policies to achieve climate goals  Tapping renewable energies as sustainable energy sources  Electrification of the drivetrain of commercial and passenger vehicles Our Co

  18. Slide 18: Mobility

    Mobility Key Trends  Rigid CO2 regulations and rising oil price  Increasing rules on safety, focusing on preventive measures  Rising new requirements in cars for emerging markets  Urbanization, globalization and demographic change  Strong investments in local and long distance public transporta

  19. Slide 19: Security

    Security Key Trends  Secure communication everywhere utilizing mobile phone and internet  Move to electronic identification of documents and products  Contactless cards for payment and electronic tickets  Increased electronics in cars, calling for secure data handling  Introduction of smart gri

  20. Slide 20: Table of Contents

    Table of Contents  Market and Business Development Fourth Quarter FY 2013  Business Focus  Segments, Products and Technology  General Company Information 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 20

  21. Slide 21: Tight Customer Relationships are Based on System Know-how and App Understanding

    Tight Customer Relationships are Based on System Know-how and App Understanding ATV IPC PMM CCS Distributors 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 21

  22. Slide 22: Market-Oriented Business Structure

    Market-Oriented Business Structure Segments Core Applications Powertrain; Hybrid and electric vehicles; Chassis and Automotive comfort electronics; Safety Renewable energy generation; Energy transmission; Customers Industrial Power Control Uninterruptable power supplies; Industrial drives; Industria

  23. Slide 23: Product Range

    Product Range Automotive Industrial Power Power Management Chip Card & Security (ATV) Control (IPC) & Multimarket (CCS)  Microcontrollers  IGBT module (PMM)  Contact-based (8-bit, 16-bit, 32-bit) solutions incl. IGBT  Discrete high-voltage security controller  Software development stacks power

  24. Slide 24: New Era: Driving Demand for Power Semiconductors

    New Era: Driving Demand for Power Semiconductors '90 – '10 '10 – '30 Changes  Electrification in cars with Internal Combustion Engine as well as the trend towards emobility drives the demand for Courtesy: Tesla power semiconductors.  Shift towards renewable energies requires significantly more hig

  25. Slide 25: Automotive Overview

    Automotive Overview Product Range  Sensors: pressure, magnetic, wireless control ICs, radar  Microcontrollers: 8-bit, 16-bit, 32-bit  Power: MOSFETs, IGBTs, smart power ICs: voltage regulators, bridges, driver ICs, CAN / LIN / FlexRay™ transceiver*, DC-DC converters, power system ICs, system-on c

  26. Slide 26: We Focus on Future Business Making Cars Clean

    We Focus on Future Business Making Cars Clean Market Trends ■ Dwindling energy resources ■ Urbanization ■ Stricter CO2 emission legislations ■ Growing environmental awareness Infineon's Opportunities  Infineon components are key for CO2 reduction: total improvement of CO2 emission ~23 g/km.  We of

  27. Slide 27: Target Applications for Electric Drive Train

    Target Applications for Electric Drive Train Product Portfolio Application Product Solutions 100kW 90kW Bare Die: IGBTs, Diodes, MosFETs IGBTs, MosFETs 80kW Discrete solutions: IGBTs, Inverter / Generator for 70kW HybridPACKTM 2 Full Hybrids and Electric Power Diodes, MosFETs Vehicles 60kW 50kW Driv

  28. Slide 28: BMW and Infineon: Working together to shape the future of electro mobility

    BMW and Infineon: Working together to shape the future of electro mobility Power module  75 semiconductors ensure a highly efficient electric drive in the BMW i3, e.g. Microcontroller AUDO Future, IGBT Power Module HybridPACK™ 2, EiceDRIVER™ Products, CoolMOS™ High voltage MOSFETs.  Further compon

  29. Slide 29: Industrial Power Control Overview

    Industrial Power Control Overview Product Range  IGBT modules and stack assemblies  IGBT chips and discretes  Driver ICs and Driver Boards ( EiceDRIVER™) Core Competencies/ Market Positions Value Proposition  High quality products and services  No.1 in Bipolar High Power Thyristor/Rectifier wit

  30. Slide 30: Power Components for Drive Control of Train Systems

    Power Components for Drive Control of Train Systems High-Speed Trains Metro Trains Infineon Parts  Power: 5 to 10MW per train  Power: 0.5 to 1MW per train  80 to 120 IGBT modules per train  25 to 50 IGBT modules per train  Semiconductor content:  Semiconductor content: ~EUR 100,000 per train ~

  31. Slide 31: Power Management & Multimarket Overview

    Power Management & Multimarket Overview Product Range  Power Discretes and Driver ICs  Power ICs, Digital Power Management  LED Drivers  RF Diodes and Transistors, RF Power  Chips for Silicon MEMS Microphones, TVS Diodes  ASIC design solutions for authentication and battery management Core Com

  32. Slide 32: Power Components for Servers and RF Devices for Cellular Infrastructure

    Power Components for Servers and RF Devices for Cellular Infrastructure Energy Efficient Server Cellular Infrastructure Infineon Components  Efficiency values of 95% and higher  Applicable for all standard frequencies  Technology leadership in silicium and of 2G, 3G, 4G (450 MHz to 2.7 GHz) silic

  33. Slide 33: Social Networks and Cloud Computing Driving Demand for Highest Efficient Power Supplies

    Social Networks and Cloud Computing Driving Demand for Highest Efficient Power Supplies Digital Power Management (DPM) Gaining Traction in Server Market  Globally, we see one new data center per week with up to 100 MW of power consumption.  Efficiency of power supply (AC/DC, DC/DC) of utmost impor

  34. Slide 34: Chip Card & Security Overview

    Chip Card & Security Overview Product range  Contactless and contact-based security products for Communication, Payment, Government ID, Transport, Access, Object ID, Entertainment and Platform Security  Extensive packaging and service portfolio  Innovative solutions from basic security RFID and m

  35. Slide 35: Security Chips for Taiwan's Electronic Passport Program

    Security Chips for Taiwan's Electronic Passport Program "Integrity Guard" is the preferred solution for electronic passports and IDs  Infineon is the only supplier and has started shipping security chips of the SLE78 product family based on the digital security technology "Integrity Guard".  Taiwa

  36. Slide 36: Chips for the World's First ePassports of the Newest Generation

    Chips for the World's First ePassports of the Newest Generation Kosovo's ePassports incorporate the Supplemental Access Control (SAC) protocol  Infineon supplies security chips of the SLE 78 product family with "Integrity Guard," which offers the highest level of data security over the long term an

  37. Slide 37: Advancing Trusted Computing with New OPTIGA TPM Family

    Advancing Trusted Computing with New OPTIGA™ TPM Family Security Chips serve Industrial/Embedded Environments and Support Next Generation TPM 2.0 Firmware  Infineon introduced a new family of Trusted Platform Modules (TPM) that broaden the application base for trusted computing and mark the first a

  38. Slide 38: Semiconductor Technology Portfolio

    Semiconductor Technology Portfolio Technology portfolio fits needs of logic and power applications Analog Bipolar: DOPL, Ax, BIPEP, B4C DMOS: Low Voltage Trench Power/Analog Analog BiCMOS: B6CA, B6CA-CT, B7CA, SPT170 MOSFET (OptiMOS™) 500 - 350nm HV-CMOS-SOI HV-DMOS: Superjunction MOSFET Smart Power

  39. Slide 39: Package Technology Portfolio

    Package Technology Portfolio IC Power Wafer Level Laminate Leadframe Packages, based based Chip Card Discretes Sensors High Power Power Bare Die Packages Packages Surface SMD Through Mold on LF SMD leaded Through Power Through Hole Mount  OCCN 1,2) Hole  P-MCCx  SOT Hole Modules  TO, DIP Technol

  40. Slide 40: Recent Awards: Automotive

    Recent Awards: Automotive Pinnacle Award for Technology (September 2013) Honoring Infineon for its innovation, which provides "Delphi with significant competitive advantage", and the "excellent customer service. Infineon is the first semiconductor supplier ever to receive the technology award." Inno

  41. Slide 41: Recent Awards: Industrial Power Control and Power Management & Multimarket

    Recent Awards: Industrial Power Control and Power Management & Multimarket Bombardier Sustainability Award (July 9, 2013) "Bombardier Transportation has presented Infineon Technologies AG with its Supplier Sustainability Award 2013. Infineon won the prize for reaching the sustainability goals it had

  42. Slide 42: Recent Awards: Chip Card & Security

    Recent Awards: Chip Card & Security German Prize for IT Security (November 29, 2012) "Infineon's research project "Cryptographic Protocol with Inherent Side-Channel Resistance" was honored with the 1st prize. The innovative encryption scheme offers data security for price-sensitive mass market produ

  43. Slide 43: Table of Contents

    Table of Contents  Market and Business Development Fourth Quarter FY 2013  Business Focus  Segments, Products and Technology  General Company Information 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 43

  44. Slide 44: Decisive Competitive Advantage: Quality at Infineon

    Decisive Competitive Advantage: Quality at Infineon  Preferred partner for our customers  Smooth production and delivery Our  We focus on stability and the aspiration 100 percent fulfillment of our commitments  Integrated approach along the entire value chain Our path  Proactive Quality Managem

  45. Slide 45: 26,725 Employees Worldwide

    26,725 Employees Worldwide USA 499 employees 172 East Coast 327 West Coast Europe Asia/Pacific 12,587 employees 13,639 employees 71 Great Britain 1831 Singapore 3058 Austria 1918 Indonesia 8520 Germany 234 India 90 Portugal 7709 Malaysia 35 France 1615 China* 97 Italy 122 Japan 184 Romania 89 Korea

  46. Slide 46: R&D Network in Europe

    R&D Network in Europe Warstein Regensburg Duisburg Dresden Bristol Linz Augsburg Graz Munich, Bucharest Neubiberg Padua Villach 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 46

  47. Slide 47: Worldwide R&D Network (Excluding Europe)

    Worldwide R&D Network (Excluding Europe) Beijing Seoul Shanghai Morgan Hill Singapore Torrance Malacca Bangalore Kulim 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 47

  48. Slide 48: Worldwide Manufacturing Sites Frontend and Backend

    Worldwide Manufacturing Sites Frontend and Backend Morgan Hill Dresden Kulim Beijing Wuxi Warstein Singapore Regensburg Villach Cegléd Malacca Batam Frontend Backend 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 48

  49. Slide 49: Sales Offices in Europe

    Sales Offices in Europe Stockholm, Rotterdam Duisburg Warstein Hanover Moscow Erlangen Kista Munich, Neubiberg Bristol Vienna Dublin Groß- Zurich ostheim Nuremberg Milan Stuttgart, Saint Denis Madrid Toulouse Marseille Ditzingen 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserv

  50. Slide 50: Sales Offices Worldwide (Excluding Europe)

    Sales Offices Worldwide (Excluding Europe) Lebanon Livonia Bangalore Seoul Wuxi Hong Kong Shenzhen Hayward Tokyo Milpitas Nagoya Kokomo Osaka Singapore Taipei Melbourne, São Paulo Blackburn 2013-11-12 Copyright © Infineon Technologies AG 2013. All rights reserved. Page 50

  51. Slide 51: Corporate Social Responsibility Our Commitment

    Corporate Social Responsibility Our Commitment United Nations Global Compact 10 Principles Human Rights Principle 1: support and respect the protection of internationally proclaimed human rights Principle 2: make sure they are not complicit in human rights abuses Labor Principle 3: uphold the freedo

  52. Slide 52: Corporate Social Responsibility Our Understanding

    Corporate Social Responsibility Our Understanding CSR at Infineon comprises our voluntary commitment and contributions in the areas: Environ- mental Sustain- Human ability Resources Occupational Management, Health and Human Safety Rights Corporate Social Responsibility at Infineon CSR Supply Citizen

  53. Slide 53: Corporate Social Responsibility Successful CSR Approach

    Corporate Social Responsibility Successful CSR Approach 2013 2013 since Continuous 2012 CSR Approach since Energy oekom 2010 Management classification Dow Jones System, as „Prime“ Sustainability integrated in Index IMPRES since since 2005 2011 Infineon Sustainability since IMPRES Yearbook 2004 (Infi

  54. Slide 54: Corporate Social Responsibility Environmental Sustainability

    Corporate Social Responsibility Environmental Sustainability Certifications Based on our efforts for resources management, safety and health standards, Infineon received the EN ISO 14001, OHSAS 18001 and ISO 50001* multi-site certification.  We consume 33% less water to manufacture 1sqcm wafer than

  55. Slide 55: Our CO2 Balance: Emission Reduction Enabled by Our Products

    Our CO2 Balance: Emission Reduction Enabled by Our Products and Solutions More than 1.2 15.8 million million tons tons Ratio CO2 burden1) CO2 savings2) 1:13 Net ecological benefit : more than 14.6 million tons of CO2 emission reduction 1) including manufacturing, transport, material, chemistry, emis

  56. Slide 56: Integrated Business Continuity Management

    Integrated Business Continuity Management Environmental Real Estate Affairs, Business & Loss & Fraud & Facility Sustainability & Operations Investigations Management Energy Support Management Business Continuity Security & Asset ISO 27001 BS 25999 Crisis Protection ISO 14001 OHSAS 18001 Management I

  57. Slide 57: Infineon

    Cinfineon Innovative semiconductor solutions for energy efficiency, mobility and security.

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