BE Epitaxy Semiconductor Technology Co Ltd · TPEX:7415
BE Epitaxy Semiconductor Technology — H1 2026 Earnings Presentation
14 slides from BE Epitaxy Semiconductor Technology's earnings presentation, Sep 9, 2026
Slide 1: 2026 H1 Operations Report
元澄半導體科技股份有限公司 ( 7415 ) BE Epitaxy Semiconductor Technology ( b.e.s.t. ) 2026 H1 Operations Report Presenters: Dr. Tian One Chiu 2026/9/9 BE Semiconductor Semiconductor Technology Technology Confidential Confidential 1
Slide 2: Disclaimer & Forward-Looking Statements
Disclaimer & Forward-Looking Statements The business financial information and predictive data published in this presentation are derived from internal and external sources. Actual future operating results and financial conditions may differ materially from these explicit or implied forward-lookin
Slide 3: Company Profile
Company Profile December 2020: Established in Hsinchu July 2024: Relocated to Kaohsiung April 16, 2026: GISA Listing on TPEx June 17, 2026: Emerging Stock Board (ESB) Listing on TPEx Stock Code: 7415, Semiconductor Industry) Current Products & Services: A. Customized silicon photonics comp
Slide 4: Balance sheet _Assets 2026Q2 vs 2025Q2
Balance sheet _Assets 2026Q2 vs 2025Q2 2026Q2 2025Q2 NT$K Account Amount Amount Diff % Note Current assets Cash and cash equivalents 1,187,780 26,877 1,160,903 4319.27% Prepayments 45,876 5,666 40,210 709.67% Total current assets 1,274,647 71,639 1,203,008 1679.26% A Non-current assets Equity invest
Slide 5: Balance sheet _ Liabilities & Equity 2026Q2 vs 2025Q2
Balance sheet _ Liabilities & Equity 2026Q2 vs 2025Q2 2026Q2 2025Q2 NT$K Account Amount Amount Diff % Note Total current liabilities 47,003 13,497 33,506 248.25% E Total non-current liabilities 9,203 8,650 552 6.39% Total liabilities 56,206 22,147 34,059 153.79% Total equity 1,646,248 205,321 1,440,
Slide 6: Statement of comprehensive income 2026Q2 vs 2025Q2
Statement of comprehensive income 2026Q2 vs 2025Q2 NT$K Account 2026Q2 2025Q2 Diff 2025Q4 Operating revenue 94,493 64,135 30,358 136,667 Operating costs (39,368) (11,044) (28,323) (32,114) Gross profit 55,125 53,091 2,034 104,553 Operating expenses (63,305) (41,035) (22,271) (157,787) Operating inco
Slide 7: Revenue breakdown by major customer
Revenue breakdown by major customer Customers 2024 2025 2026年H1 Scope of Collaboration A company Co-developing next-generation GPU/APU 100% 89.56% 64.81% 2024/11 Signed packaged optical interconnects M company Developing low-power modulation chips — 10.44% 35.19% 2025/09 Signed dedicated to 51.2T+ o
Slide 8: Cash Capital Increase Overview
Cash Capital Increase Overview 單位: 千元 Item Amount Description 2025_ 01 125,000 Establishment of initial R&D capacity 2025_ 12 45,000 Conversion of employee stock options Next-phase capital expenditure and talent 2026_ 03 1,100,000 deployment plan Participation of Lead and Co-Advisory 2026_ 05 172,80
Slide 9: 2026-2029 Funding Allocation Plan
2026-2029 Funding Allocation Plan The largest expenditure items are concentrated on building a "high-end R&D talent" moat, supplemented by capital expenditures to establish high-specification laboratories and cover wafer foundry tape-out expenses, ensuring the technical roadmap is successfully achie
Slide 10: Core Technology and Strategy: OCS
核心技術與策略 目前策略方案 目前策略方案 下㇐代解決方案 中期策略方案(NPO SiPho 晶片) Design Service (Product) OCS 800G NPO 800G/1.6T 2024.Sep. A** 2028.JUNE 2026~2027 2028.~2030 2026.JUNE 2027.JUNE BEST-OBO-1.6T 2025.Nov. M** BE-NPO-001 O C S MEMS BEST-P-800G BEST-P-1.6T BEST-OBO-3.2T O C S SiPho BE Semiconductor Technology Confiden
Slide 11: Transceiver / OE Engine Product Roadmap
核心技術與策略 Transceiver / OE Engine Product Roadmap O C S SiPho 2029+ O C S MEMS 2028-2030 NPO/CPO Chip Multi-wavelength >800Gbps /fiber NRZ 2028 NPO / CPO Chip 1310nm 8/16 - wavelength >200Gbps/λ PAM4 800Gbps /fiber NRZ 2027 1.6T OSFP / CPO Chip 1310nm 8/16-wavelength 200Gbps/λ PAM4 2026 400Gbps/fiber
Slide 12: Application Layer of Technical Services
Application Layer of Technical Services (Using NVIDIA Spectrum as an example)) CPO Chip System and Device design (Existing technology ) Silicon Photonics Applications ) • Inter-Server Rack / Switch Connections (Scale-Out Networks) • Intra-Server & Board-Level Interfaces (Scale-Up Networks) Optical e
Slide 13: Contact Information
聯絡方式 • Kaohsiung Headquarter Hsinchu Office • +886-7-2692857 +886-7-2692857 •21F-2,No. 29, Haibian Rd.,Lingya Dist., 8F-3,No.32, Gaotie 2nd Rd., Zhubei Kaohsiung City 802, Taiwan City, Hsinchu County 302, Taiwan Sales Service [email protected] BE Semiconductor Technology Technology Confidential Co
Slide 14: Thank You for Listening
Thank You for Listening B BEE Semiconductor S emiiccoonndduuccttoorr TTechnology echhnnoollooggyyCCoo nnfifdideenntitaial l Confidential 14
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