Inspire Semiconductor Hldgs Inc. · OTC:INSSF

Inspire Semiconductor Hldgs — Inspire Semiconductor Holdings — Investor Presentation (September 2023)

22 slides from Inspire Semiconductor Hldgs's investor presentation, September 2023

  1. Slide 1: Breakthrough computing accelerator: Investor Overview September 2023

    Breakthrough computing accelerator: Blistering speed, versatility, energy efficiency and affordability for HPC, AI graph analytics, & blockchain applications Investor Overview September 2023 TSXV: INSP © Inspire Semiconductor, Inc. – All Rights Reserved © InspireSemi | TSXV: INSP

  2. Slide 2: Disclaimer

    Disclaimer This presentation contains statements which constitute “forward-looking information” within the meaning of applicable securities laws, including statements regarding the plans, intentions, beliefs and current expectations of InspireSemi with respect to future business activities and opera

  3. Slide 3: InspireSemi Addresses $168B Datacenter Accelerator Market

    InspireSemi Addresses $168B Datacenter Accelerator Market Growing at 25.6% CAGR Initial focus on HPC market • Large HPC market segment • $5-10B TAM of early tech adopters • Fast-growing 25.6% CAGR, 2X in 3 years • Highly compute-intensive • Leverage open-source software • Install in own datacenters

  4. Slide 4: Company Overview

    Company Overview Product Offering • High performance compute accelerator on a card Year Founded • Easy-to-deploy PCIe add-in card form factor 2020 • >7,000 high performance 64-bit CPU cores • Innovative high speed interconnect fabric provides Headquartered high bandwidth and low latency between core

  5. Slide 5: Investment Opportunity in Breakthrough High Performance Computing (HPC)

    Investment Opportunity in Breakthrough High Performance Computing (HPC) Attractive Addresses $168B data center accelerated computing market with 25.6% CAGR Market AI acceleration alone does not solve this problem Leading Accelerated computing solution with >7,000 high performance 64-bit CPU cores /

  6. Slide 6: The Third Wave of Accelerated Computing is Here

    The Third Wave of Accelerated Computing is Here Thunderbird for HPC, AI, Graph Analytics 1980 2007 2023+ Math Coprocessor GPU, FPGA Thunderbird • Purpose-built​ widely applicable​ • Limited applications benefit • Built for HPC open software ecosystem​ • Proprietary software model • Versatile & open

  7. Slide 7: Addressing the Need to Accelerate All HPC & AI Software

    Addressing the Need to Accelerate All HPC & AI Software What customers always wanted…not “yet another GPU” Financial simulations Datacenter GPUs Geology: Seismic Financial Trading & Graph Analytics Energy: Reservoir Modeling & Sim InspireSemi Genomics, Pharma, Thunderbird Life Sciences CAE/Computati

  8. Slide 8: More Applications, High Utilization, and Low Latency

    More Applications, High Utilization, and Low Latency • Thunderbird designed to deliver real world application benefits • Software friendly, all CPU architecture (double precision FP64 RISC-V cores) will work with all HPC & AI software • High speed, low latency core-to-core communications for determi

  9. Slide 9: Thunderbird for Real-Time, Real-Safe Computing

    Thunderbird for Real-Time, Real-Safe Computing Reproducibility Determinism/Predictability • Results verification • Safety and component functions • Performance optimization • Efficiency optimization • Troubleshooting • Known timing behavior • Quality assurance • Quality assurance Thunderbird support

  10. Slide 10: Thunderbird Addresses ALL HPC & AI Customer Needs

    Thunderbird Addresses ALL HPC & AI Customer Needs InspireSemi CPU GPU FPGA AI Accelerators Architecture Many programs, Few programs, Few programs, Programmable Single program, many data streams few data streams many data streams logic elements many data streams Performance High for broad range Slow,

  11. Slide 11: Open Software Ecosystem Solves Customer Porting Challenges

    Open Software Ecosystem Solves Customer Porting Challenges • Leverages established RISC-V software ecosystem • Eliminates need for proprietary software stacks • Uses standard CPU-style programming models • No need for CUDA, ROCM, SYCL, etc. that GPUs require • Standard compiler, OpenMP, MPI, etc. ap

  12. Slide 12: World Class Supply Chain Partners

    World Class Supply Chain Partners • TSMC - Wafer fab • World’s largest semiconductor foundry • Developing the most advanced process nodes • ASE – Chip package & test • Worlds largest and highest quality OSAT (Outsourced Semiconductor Assembly and Test) • Leading edge package design • Imec: Value Cha

  13. Slide 13: Fundamental Capabilities Proven with TSMC 5nm Test Chip

    Fundamental Capabilities Proven with TSMC 5nm Test Chip • De-risks plan for follow-on 4nm Thunderbird II • Validated team’s ability to deliver designs on leading-edge TSMC process node • Worked first time, met performance and power targets • Including full-custom layout optimized at every level • So

  14. Slide 14: Robust HPC & AI Roadmap

    Robust HPC & AI Roadmap To Support Demanding Applications Chip Tapeout Customer Shipment Thunderbird First Chips from Fab Ramp Production FPGA Prototype 12nm 2023 2024 2025 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Thunderbird • Addresses complex HPC applications • e.g.- CAE/CFD, energy/reservoir modeling & sim, weat

  15. Slide 15: Robust Thunderbird HPC & AI Roadmap

    Robust Thunderbird HPC & AI Roadmap To Support Demanding Applications Chip Tapeout Customer Shipment Thunderbird First Chips from Fab Ramp Production FPGA Prototype 12nm 2023 2024 2025 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Ramp Production Thunderbird II Receive & Analyze 5nm Test chip Design Start Physical Design

  16. Slide 16: Early Adopter Program Signals Strong Market Traction

    Early Adopter Program Signals Strong Market Traction Decision Maker Responses: 4 Committed Contracts "Consider us your go-to-market partner. Tell all prospects you talk to." $50,000 to participate "The combination of your custom designed RISC-V 'sea of cores' plus high-speed interconnect fabric is v

  17. Slide 17: Accomplished Leadership Team

    Accomplished Leadership Team Ron Van Dell, CEO Thomas Fedorko, COO • 40 years experience and an exceptional track record of success • 35+ years hands-on technical and business leadership in and proven leadership skills in early-stage, turn-around and semiconductor operations in both large IDM and st

  18. Slide 18: Investment Opportunity in Breakthrough High Performance Computing (HPC)

    Investment Opportunity in Breakthrough High Performance Computing (HPC) Attractive Addresses $168B data center accelerated computing market with 25.6% CAGR Market AI acceleration alone does not solve this problem Leading Accelerated computing solution with >7,000 high performance 64-bit CPU cores /

  19. Slide 19: Thank you!

    Breakthrough computing accelerator: Blistering speed, versatility, energy efficiency and affordability for HPC, AI graph analytics, & blockchain applications Information Contacts: Thank you! Inspire Semiconductor Holdings Inc. John Kennedy KCSA Strategic Communication Investor Relations Chief Financ

  20. Slide 20: Finance Industry Opportunities

    Finance Industry Opportunities • HFT (High Frequency Trading) • Thunderbird can support this because of deterministic, predictable performance (GPUs cannot) • Crypto currencies • Thunderbird excellent for alt-coin mining • Large Monte Carlo Simulations have been primary workload • Used in corporate

  21. Slide 21: Energy Industry Opportunities

    Energy Industry Opportunities • The new imperative in the energy industry is solving the energy trilemma • Energy security, affordability, and sustainability • Energy company venture arms investing in tech companies to accelerate • Major large-scale projects and investments in CCUS underway by all m

  22. Slide 22: Thunderbird Technology Overview

    Thunderbird Technology Overview Core Interconnect Fabric Top 64-bit superscalar RISC-V CPU cores: Manhattan street grid of 32-lane • 1,792 CPU cores, SMP or HPC superhighways: cluster-on-a-chip • Custom InspireSemi hi-perf design • Full utilization of precious routing area • Network fabric extensibl

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