Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation (June 2010)
21 slides from Formfactor's technical presentation, June 2010
Slide 1: Benefits of Flip Chip Wafer Sort using MEMs Multi Site Capability
Lo Wee Tick, GLOBALFOUNDRIES Pascal Pierra and Robert Murphy, FormFactor Benefits of Flip Chip Wafer Sort using MEMs Multi Site Capability Lessons learnt June 6 to 9, 2010 San Diego, CA, USA
Slide 2: Outline
Outline • The Growing SOC Market • Test Vehicle and Test Parameters – Chuck Force Comparison – Probe Mark Comparison • Cleaning Considerations • Yield Comparison • Electrical Properties Comparison • Test Performance • Summary June 6 to 9, 2010 IEEE SW Test Workshop 2
Slide 3: GLOBALFOUNDRIES – Who Are We?
GLOBALFOUNDRIES – Who Are We? Global Manufacturing Operations Fab 2, 3, 3e, 5, 6 Mainstream 200mm manufacturing campus Woodlands, Singapore Tampines, Singapore Fab 8 Future leading-edge 300mm manufacturing Saratoga County, NY Fab 1 Leading-edge 300mm manufacturing campus Dresden, Germany Fab 7 Mains
Slide 4: Motivation for Vertical / MEMs Technology
Motivation for Vertical / MEMs Technology Source : TechSearch International Inc. June 6 to 9, 2010 IEEE SW Test Workshop 4
Slide 5: Test Vehicle Information
Test Vehicle Information • Application: Universal Mobile Telecommunication Chip • Technology Node: 65nm • Die Size: 3.4mm x 7.1mm • Pitch: 180um • Bump Material: Eutectic • Probe Count per Die: 278 • Multi‐Site: 2 x 4 Solid Array June 6 to 9, 2010 IEEE SW Test Workshop 5
Slide 6: Probe-card Chuck Force Comparison
Probe‐card Chuck Force Comparison Significant increase in chuck force needed for Vertical probe with higher pin count Test Vehicle 4448 probes Test Vehicle 2224 probes June 6 to 9, 2010 IEEE SW Test Workshop 6
Slide 7: Probe Mark Comparison (MEMS vs Vertical)
Probe Mark Comparison (MEMS vs Vertical) Characteristics of the probe marks MEMS probe marks Vertical probe marks June 6 to 9, 2010 IEEE SW Test Workshop 7
Slide 8: Impact of Higher Chuck Force on Higher Parallelism
Impact of Higher Chuck Force on Higher Parallelism Improper overdrive with Pressure of probe head at center of check excessive chuck force Chuck Z‐Force Pressure of probe head at edge of check Normal pin Chuck Z‐ Force Bent pin due to excessive overdrive Note : Need to change to a stronger chuck Jun
Slide 9: Overcoming the Impact : MicroForce™ Probing
Overcoming the Impact : MicroForce™ Probing What is MicroForce™ probing? It is a coordinated X‐Y‐Z probing motion 3 2 1 1 – Prober Chuck Moves in Z-axis 2 – Contact with Flip Chip Bump 3 – Chuck moves in X-Y-Z June 6 to 9, 2010 IEEE SW Test Workshop 9
Slide 10: Improvements on MEMS PC: Enhanced Self-Cleaning MicroForce™ Recipe
Improvements on MEMS PC : Enhanced Self‐Cleaning MicroForce™ Recipe F F is released F • F has been created during • Start XYZ Down motion • Start Z only Down motion the XYZ Up motion • Self Cleaning Phase 1 • Self Cleaning Phase 2 Impact: With self cleaning option, online cleaning frequency lowered
Slide 11: Impact of High Chuck Force on Online Cleaning (Vertical)
Impact of High Chuck Force on Online Cleaning (Vertical) Vertical Probe Head Construct MLO Upper Probe Die needle Probe Head Lower Die Cleaning sheet Cleaning block June 6 to 9, 2010 IEEE SW Test Workshop 11
Slide 12: Impact of High Chuck Force on Online Cleaning
Impact of High Chuck Force on Online Cleaning MEMS Probe Head Construct Cleaning Block June 6 to 9, 2010 IEEE SW Test Workshop 12
Slide 13: MEMs vs Vertical Probe Cards: Yield Comparison
MEMs vs Vertical Probe Cards Yield Comparison Implementation of self-cleaning Second Pass First Pass First Pass Second Pass Vertical Probe Card MEMs Probe Card June 6 to 9, 2010 IEEE SW Test Workshop 13
Slide 14: Impact of Self Cleaning : Yield
Impact of Self Cleaning : Yield Significant improvement in yield after implementing self‐cleaning Self-cleaning implemented June 6 to 9, 2010 IEEE SW Test Workshop 14
Slide 15: Impact of Self Cleaning : Contact Sensitive Failures
Impact of Self Cleaning : Contact Sensitive Failures Implementation of Reduction in contact related failures self-cleaning WWK Other Other ATPG CODEC SCAN_LV Other EFUSE MBIST_LV IDDQ IDDQ MBIST SCAN MBIST ON OFF June 6 to 9, 2010 IEEE SW Test Workshop 15
Slide 16: Electrical Properties Comparison
Electrical Properties Comparison Experienced timing delay for some functional test block (~15ns) MEMs Probe Card Vertical Probe Card June 6 to 9, 2010 IEEE SW Test Workshop 16
Slide 17: Test Performance Comparison
Test Performance Comparison Experienced better margin in some functional test block FFI-MEMS Vertical Type Freq vs. Low Vdd Freq vs. Low Vdd (95MHz vs. 1.62V) (95MHz vs. 1.62V) June 6 to 9, 2010 IEEE SW Test Workshop 17
Slide 18: MEMS PC : Caveats
MEMS PC : Caveats A tool is only as good as the skills of the user Improper setup leading to quality issue Normal Line Offset Line x=0 , y=0 Probe card Blade tip Wafer Bump Perfect Alignment Offset alignment June 6 to 9, 2010 IEEE SW Test Workshop 18
Slide 19: Summary
Summary Positive learning Better Yield stability over time Better Electrical performances Lower down time with implementation of online self-cleaning Experienced lower Z-force with MicroForce™ (ease into higher parallelism) MEMs architecture allows easy migration to higher multi sites te
Slide 20: Acknowledgements
Acknowledgements GLOBALFOUNDRIES: Bernardo Montemayor, Jeffrey Lam, Yeo Chak Huat FormFactor: Xin Ying Ng, John Kao, Kevin Chung, Robert Murphy, ChanPin Chong ASET: Chris Bunao, Jeofill Caballero, MJ Kuo Amkor: Orange Ou, Yeong Sun Lee SCT: Alli Su, Cass Chen, Chao Liang, Colin Chen Semics: Ralph Ya
Slide 21: THANK YOU Q & A
THANK YOU Q&A Trademark Attribution GLOBALFOUNDRIES, the GLOBALFOUNDRIES logo and combinations thereof are trademarks of GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. Other names used in this presentation are for identification purposes only and may be trademarks of their res