Amkor Technology, Inc. · NASDAQ:AMKR

Amkor Technology — Investor Presentation (June 2003)

21 slides from Amkor Technology's investor presentation, June 2003

  1. Slide 1: Amkor Technology, Inc. Corporate Presentation June 2003

    Amkor Technology, Inc. Enabling a Microelectronic World™ Corporate Presentation June 2003

  2. Slide 2: Safe Harbor Disclaimer

    Safe Harbor Disclaimer This presentation may contain forward-looking statements that involve risks and uncertainties that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the company’s results is detailed in the company’s filings wi

  3. Slide 3: Amkor is the World's Largest Provider of Contract Semiconductor Assembly and Test Services

    Amkor is the World’s Largest Provider of Contract Semiconductor Assembly and Test Services Our job is to ensure that advances in semiconductor technology . . . . . . Reach the system level. © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  4. Slide 4: Outsourced Assembly & Test: Poised for Sizable Growth

    Outsourced Assembly & Test: Poised for Sizable Growth 2002 2005 Outsourced $5.7 B $10.5 B Internal Internal $22 B Total Assembly & Test Market $35 B Source: Prismark Partners and Amkor estimates © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  5. Slide 5: Amkor's End Market Exposure

    Amkor’s End Market Exposure Q1 2003 Consumer Entertainment Audio / Video ‘Digi-gadgets’ Other Automotive Medical 20% Avionics 15% Automation 25% 40% Computing PC’s Peripherals Communications Servers / storage Cellular phones WLAN Broadband © 2003 Amkor Technology, Inc. Enabling a Microelectronic Wor

  6. Slide 6: Diversified Customer Base

    Consumer Diversified Customer Base Agilent Q1 2003 Mediatek Conexant Auto and Other Sony Bosch Toshiba Analog Devices TI ST Micro Infineon Maxim All under 4%, except Toshiba Computing Atmel Communications Sony Altera RFMD Intel Agere Intersil Infineon Conexant Philips LSI Logic ST Intel ST Micro TI

  7. Slide 7: Revenue Growth Comparisons

    Revenue Growth Comparisons ASE ChipPac SPIL Amkor 140% 130% 120% 110% 100% 90% Dec. 31 1Q02 2Q02 3Q02 4Q02 1Q03 ‘01 © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  8. Slide 8: Hot Applications

    Hot Applications 3-D Packaging ) Cell phones and other handheld applications Flip Chip ) Graphics, chipsets, PLD and ASIC MicroLeadFrame ) RF, wireless and standard applications System-in-Package ) Phones and other portable electronics are going “modular” CMOS Image sensors ) Cell phones, PCs and di

  9. Slide 9: Penetrating the Cell Phone

    Penetrating the Cell Phone System-in-Package MEMS Vision Memory Cards Stacked Die MicroLeadFrame™ © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  10. Slide 10: What's Hot! MicroLeadFrame

    What’s Hot! MicroLeadFrame™ • Amkor’s most successful new product 750 • A critical package for Unit cellular & WLAN shipments 600 (millions) • Amkor: #1 market share 450 • Capacity: Increasing to 20MM per week 300 • More than 60 customers 150 forecasting over 200 MLF designs 0 '99 '00 '01 '02 '03 E

  11. Slide 11: What's Hot! System-in-Package

    What’s Hot! System-in-Package RF & Wireless Consumer/Business • Digital Cellular • DC/DC Converters - RFPA’s • Switch modules for internet routers - Front End Modules • ADSL - Transceivers - LNA • Fingerprint Sensors - Baseband • WLAN 802.11b/g/a Memory and I/O Cards - Integrated Front Ends • MMC an

  12. Slide 12: SiP Product Family

    SiP Product Family ChipArray® Flip Chip Ceramic ChipArray® Leveraging Amkor’s MMC/SD Wirebonded Core Competencies in Cards Processes and Packaging Stacked PBGA Super Flip Chip © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  13. Slide 13: What's Hot! Stacked CSP

    What’s Hot! Stacked CSP “Chip Scale Package” Penetration of Stacked Total CSP Million units CSP in Handsets Market Growth 14,000 Million units 700 12,000 600 10,000 500 8,000 400 6,000 300 4,000 200 100 2,000 0 0 '02 '03 '04 2002 2003 2004 2005 2006 S-CSP Phones Source: Prismark Source: Electronic T

  14. Slide 14: What's Hot! Vision

    What’s Hot! Vision CMOS Image Sensor Market Source: Cahners InStat 160 Total Cell phone, PDA, Handheld 140 PC, Security cameras 120 Digital still cameras Auto, Toys, other 100 Million Units 80 60 40 20 0 2000 2001 2002 2003 2004 2005 Cell phones will become primary market for CMOS image sensors afte

  15. Slide 15: What's Hot! MEMS

    What’s Hot! MEMS TI’s DLP™ Program Applications • Projector for PC & Cinema • Home Entertainment System • Amkor is exclusive outsourced partner • MEMS micro-mirror technology • Proprietary customer process • We are ramping production and expanding capacity DLP™ is a trademark of Texas Instruments ©

  16. Slide 16: What's Hot! Flip Chip

    What’s Hot! Flip Chip Quarterly shipments Last 4 Q's shipments 1600 6000 Amkor Shipments of Flip 1400 Chip Packages 5000 1200 Units (000’s) 4000 1000 800 3000 600 2000 400 1000 200 0 0 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 2000 2001 2002 2003 © 2003 Amkor Technology, Inc. Enabling a Microelectronic

  17. Slide 17: Revenue History

    Revenue History Quarterly Assembly & Test Revenue $ millions 450 400 350 300 250 200 150 100 50 0 Q1 01 Q2 01 Q3 01 Q4 01 Q1 02 Q2 02 Q3 02 Q4 02 Q1 03 Q2 03 E © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  18. Slide 18: Gross Margin History

    Gross Margin History Quarterly Gross Margin 25% 17.0% 19% 20% 15.6% 13.6% 15% 11.5% 10% 5% 2.3% 3% -3.5% -2.4% -4% 0% Q1 01 Q2 01 Q3 01 Q4 01 Q1 02 Q2 02 Q3 02 Q4 02 Q1 03 Q2 03 E -5% © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  19. Slide 19: Enhancing our Liquidity: One Year Ago

    Enhancing our Liquidity $ millions One Year Ago . . . 800 700 Convertible 600 notes 500 Senior notes 400 Cash @ Senior notes Mar. 31 300 2002 200 9.25% $97 MM 100 Term loan 0 2002 2003 2004 2005 2006 2007 2008 2009 © 2003 Amkor Technology, Inc. Enabling a Microelectronic World™

  20. Slide 20: Enhancing our Liquidity: One Year Later

    Enhancing our Liquidity $ millions One Year Later . . . 600 Cash @ 500 Mar. 31 * 400 Convertible Senior notes notes 7.75% 300 200 $170 MM Term loan 100 0 2002 2003 2004 2005 2006 2007 2008 2009 2013 * Pro forma with new credit facility completed April 22 © 2003 Amkor Technology, Inc. Enabling a Micr

  21. Slide 21: Amkor Financial Profile

    Amkor Financial Profile • Strong liquidity • Debt is manageable • Cash flow should build through 2003 and 2004 • Capex sufficient to support customer needs • Maintaining investments in R&D • Streamlining the organization & sharpening our focus • Committed to reducing debt as market conditions allow

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