Adlink Technology Inc. · TWSE:6166
Adlink Technology — Technical Presentation (2003)
48 slides from Adlink Technology's technical presentation, 2003
Slide 1: PICMG 3.0
PICMG 3.0 Jeff Munch CTO [email protected] Advance technologies; Automate the world. 1
Slide 2: Next Generation of Standards
Next Generation of Standards Market growth might be slowing, but standards still need to evolve to meet future demands Advance technologies; Automate the world. 2
Slide 3: What is Driving the Next Generation of Standards?
What is Driving the Next Generation of Standards? • Bandwidth – Existing standards are primarily bus based architecture • Only 1 Blade can talk at a time – Bandwidth does not scale • Same if 2 Blades or 8 Blades – What to do to increase available bandwidth? • Star X X PCI Bus Advance technologies; A
Slide 4: Star Architecture in CompactPCI
Star Architecture in CompactPCI • Overlays a packet based switching architecture on top of CompactPCI • The CompactPCI Packet Switching Backplane Switch provides a redundant, switched Ethernet network within a Compact PCI chassis providing connectivity between all slots using a star topology. Advanc
Slide 5: What are the market drivers for next generation standards?
What are the market drivers for next generation standards? • Scalable capacity to 2Tb/s • Scalable system availability to 99.999% • Multi-protocol support for interfaces up to 40Gb/s • High levels of modularity and configurability • The ability to host large pools of DSPs, processors, and storage Ad
Slide 6: Other Drivers for Next Generation Standards?
Other Drivers for Next Generation Standards? • Power dissipation – Next generation silicon will require form factors that can handle 150 – 200 Watts per card • Board size – Silicon is getting larger and larger, Need bigger board sizes • Rear I/O – Difficult to handle fibre based rear I/O in existing
Slide 7: PICMG 3.0
PICMG 3.0 • Advanced Telecommunications and Compute Architecture (ATCA) • Specification being developed under PCI Industrial Computer Manufacturers (PICMG) • Major Contributors are ADLINK, Force, H-P, Intel, Lucent, Motorola, Nortel, Radisys Advance technologies; Automate the world. 7
Slide 8: Advanced Telecommunications and Compute Architecture (AdvancedTCA)
Advanced Telecommunications and Compute Architecture (AdvancedTCA) • ATCA is intended to provide the next step in the evolution of PICMG specifications • Technology has advanced – High performance architectures moving away from parallel buses – Point-to-point switch fabrics are becoming real – Amoun
Slide 9: Specification Numbering
Specification Numbering • PICMG 3.0 Base Specification • PICMG 3.1 Ethernet/Fibre Channel Fabric • PICMG 3.2 InfiniBand Fabric • PICMG 3.3 StarGen/PCI-Express Advanced Switching Fabric Advance technologies; Automate the world. 9
Slide 10: PICMG 3.0 Form Factor
PICMG 3.0 Form Factor • Board – 8U x 280mm, 1.2” pitch – 140 In2 of board space – 150 - 200 Watts power dissipation – -48V DC power • Shelf (typical 19”) – 13U high – 437mm wide – 420mm deep – 14 Slots (2 switch, 12 payload) Advance technologies; Automate the world. 10
Slide 11: Quick Comparison
Quick Comparison AdvancedTCA CompactPCI 6U x 160mm 8U x 280mm 0.8” pitch 1.2” pitch 57 in2 140 in2 35-50 Watt 150-200 Watts OC-12/OC48 OC192/OC768 Advance technologies; Automate the world. 11
Slide 12: 3-D Perspective of PICMG 3.0 Chassis
3-D Perspective of PICMG 3.0 Chassis Advance technologies; Automate the world. 12
Slide 13: AdvancedTCA Frame Level Mechanical Design
AdvancedTCA Frame Level Mechanical Design Shelf #1 – 13U Shelf #2 – 13U ETSI Cabinet – ~42U, 2000mm High Shelf #3 – 13U 500mm Aperture 600mm Deep 600mm Wide Advance technologies; Automate the world. 13
Slide 14: AdvancedTCA Board Mechanicals
AdvancedTCA Board Mechanicals 600mm 385 mm faceplate-to-faceplate 25 mm 90 mm 5 mm 280 mm 25 mm 70 mm 5 mm 75 mm 25 mm Zone 3 Front Access Door Rear Access Door 90mm 75mm Optical Metallic Cabling/ Cabling/ Front Board Zone 2 Air Air Plenum (8U x 280 mm) Rear Plenum (140 in2) Module (8U x 70 mm x 1.2
Slide 15: Backplane Connections
Backplane Connections • Backplane connectors broken down into Zones – Zone 1 • Power, Ring Voltage, System Management and Geographical address – Zone 2 • Data Fabric, Update Channel, and Timing Clocks – Zone 3 • User defined Advance technologies; Automate the world. 15
Slide 16: Zone 1
Zone 1 • Dual -48V power • Dual IPMB Busses • Geographical Addressing • Ring and Test Voltages Advance technologies; Automate the world. 16
Slide 17: Zone 2
Zone 2 • Data Fabric, Update Channel, and Timing Clocks • Up to 3.125Ghz clock rates • Pins protected by ground shield from bending • Up to 5 connectors can be used on a backplane per slot Advance technologies; Automate the world. 17
Slide 18: Zone 3
Zone 3 • User defined • Can be: – Board to board connector (PICMG 2.0 style) – Direct connect to I/O (Fiber) – Cable to bulkhead mounted connector Advance technologies; Automate the world. 18
Slide 19: ATCA System Management
ATCA System Management • Made up of: – Shelf External System Manager • Management agent external to shelf, controls rack and possibly multiple sites – Shelf Manager • Responsible for management of shelf (power, cooling, and interconnects). Routes messages between System Manager and IPMB-0. Provides
Slide 20: Management aspects of an example AdvancedTCA Shelf
Management aspects of an example AdvancedTCA Shelf IPM Controller (IPMC) IPMC Shelf-External System Manager Shelf Management ShMC Controller (ShMC) AdvancedTCA Board Shelf Shelf Fan Power Power Manager Manager Entry Entry Field Replaceable Unit (Active) (Backup) Tray Module Module (FRU) Implementati
Slide 21: Shelf Manager Responsibilities
Shelf Manager Responsibilities • Responsible for – Electronic Keying • Board can power up if: – Power available – Ability to dissipate power • Fabric links enabled when: – Something to talk to – Protocol compatible Advance technologies; Automate the world. 21
Slide 22: IPM Controller Responsibilities in System Management
IPM Controller Responsibilities in System Management • Dual IPMBs for system management communication with Shelf Management Controller • Board reports power required, air flow impedance and fabric capabilities • Board may also support an IP based interface for System Management (RMCP) Advance techno
Slide 23: Multi-Tenancy
Multi-Tenancy • Usage model of dense Board based systems in internet data centers • Describes considerations that must be accommodated for the migration from discrete systems into a common shelf • Similar to the roles and rights of parties involved in multiple occupancy of real estate • PICMG 3.0 en
Slide 24: ATCA Data Transport
ATCA Data Transport • Each slot supports – Base Interface – Fabric Interface Advance technologies; Automate the world. 24
Slide 25: AdvancedTCA Full Mesh Backplane Routing
AdvancedTCA Full Mesh Backplane Routing Full Mesh Fabric Analog & Test Bus Update Channel System Management Bus Base Interface Power Advance technologies; Automate the world. 25
Slide 26: AdvancedTCA Backplane Routing Dual/Dual Star
AdvancedTCA Backplane Routing Dual/Dual Star Full Mesh Fabric Analog & Test Bus Update Channel System Management Bus Base Interface Power Advance technologies; Automate the world. 26
Slide 27: Base Interface
Base Interface • Provides IP based services • 16 Channels (1 for each slot) – Each channel is 4 differential pairs • 10/100/1000BASE-T signaling • Always connected as Dual Star with centralized Fabric Boards/Slot at logical slots 1 and 2 • Required on backplane, optional on Fabric and Node Boards Ad
Slide 28: Fabric Interface
Fabric Interface • LVDS (Low Voltage Differential Signaling) • AC coupled • 8 Differential pairs per channel • Up to 3.125 GHz each pair 8b/10b encoding • Protocol independent (protocol defined by subsidiary specifications) • Provides 1 channel of communication from a slot to every other slot (full
Slide 29: Star and Dual-Star Topology
Star and Dual-Star Topology • Each NODE Connected to Each of 2 FABRICS - Fault Tolerance, Bandwidth Aggregation Advance technologies; Automate the world. 29
Slide 30: Fabric Interface Topologies
Fabric Interface Topologies • PICMG 3.0 supports multiple Blade topologies – Star (140 Gb/sec in 8 slots) Blade Blade – Dual Star (280 Gb/sec) – Full Mesh (560 Gb/sec in 8 slots) Blade Blade • A 14 slot ATCA shelf could support data rates to 2.1Tb/s Blade Blade Data Throughput Blade 140 260 440 560
Slide 31: Fabric Possibilities
Fabric Possibilities • Channel is the connection • 1 Pair between two Boards. A channel • 1 Port is: – 2 Pairs – 8 pairs of 3.125 GHz • 1 Channel connections – 4 Ports – 4 ports make 1 channel • 8 Pairs • Port is 2 pairs • Port – Smallest unit of Fabric connectivity that Electronic Keying supports •
Slide 32: PICMG 3.1 (Ethernet / Fibre Channel) Port Allocation
PICMG 3.1 (Ethernet / Fibre Channel) Port Allocation Option Port0 Port1 Port2 Port3 Description 1 GbE One 1000BASE-BX 2 GbE GbE Two 1000BASE-BX 3 GbE GbE GbE GbE Four 1000BASE-BX 4 GbE FC One 1000BASE-BX One Fibre Channel Port 2 Port 3 5 GbE GbE FC Two 1000BASE-BX One Fibre Channel 6 GbE GbE FC FC T
Slide 33: Mixing the Ports in a Channel
Mixing the Ports in a Channel • Ports within a Channel can be mixed among different protocols • In the example below, 3.1, 3.2, and an OEM port are mapped into a single Channel Port 2 Port 3 PICMG 3.2 OEM Port 0 Port 1 PICMG 3.1 PICMG 3.1 Advance technologies; Automate the world. 33
Slide 34: More on Multi-Protocol Channels
More on Multi-Protocol Channels • E-Keying plays an important role • Fabric Ports are enabled if the ShMC determines that compatible protocols are used on both ends of a Port • An example: Port 2 Port 3 Port 2 Port 3 PICMG 3.2 OEM OEM OEM Port 0 Port 1 Port 0 Port 1 PICMG 3.1 PICMG 3.1 PICMG 3.1 PIC
Slide 35: Additional Signals
Additional Signals – Telephony Synchronization Clocks – Board to Board Update Port – Metallic test bus Advance technologies; Automate the world. 35
Slide 36: Synchronization Clocks
Synchronization Clocks • 3 redundant clocks – MLVDS (Multi-Drop Low Voltage Differential Signaling) • CLK1A + CLK1B – 8KHz – Shall be Stratum 4E may be Stratum 3 or 3E • CLK2A + CLK2B – 19.44MHz – Stratum 3, or 3E • CLK3A + CLK3B – User defined – < 100MHz Advance technologies; Automate the world. 36
Slide 37: Update Channel
Update Channel • 10 Differential Pairs • Connects two adjacent slots • Specification does not define usage • Possible uses include: – APS (Automatic Protection Switching) – High speed data transport Advance technologies; Automate the world. 37
Slide 38: Metallic Test Bus
Metallic Test Bus • 2 bused pairs – Each pair contains a tip and ring conductor – Allows up to +/- 200Volts, 1Amp – Up to 10MHz • Used to connect to external test equipment • POTS and DSL line card testing Advance technologies; Automate the world. 38
Slide 39: Ringing Generator Bus
Ringing Generator Bus • Provides distribution of ringing voltages from external ring generator • 2 redundant bused pairs – Up to +/- 230Volts typically 90VAC 20Hz Advance technologies; Automate the world. 39
Slide 40: Platform Technology Comparison
Platform Technology Comparison DUAL STAR FABRIC / PICMG2.16 • Core/Edge Platform • Fabric-based backplane $100/Mb CPCI / PICMG2.X • Bus-based backplane •Standard Form Factor • Standard Form Factor PICMG 3.X MESH FABRIC • Universal Convergence Platform $10/Mb • N2 Mesh-based fabric •Common cost becom
Slide 41: PICMG 3.0 Applications Server Farm
PICMG 3.0 Applications Server Farm Computing Blades Memory Ethernet Switches General Zone 2 General Purpose Purpose 10Gig Ethernet CPU CPU Fibre Channel General General Purpose Purpose Storage Blades Z1 CPU CPU Advance technologies; Automate the world. 41
Slide 42: PICMG 3.0 Applications Gateway
PICMG 3.0 Applications Gateway General Packet Processing Purpose Shelf to Shelf Processor Interconnect Network Processors Zone 2 Ethernet Switch Network Processors Storage Blades Z1 Switch Blades Advance technologies; Automate the world. 42
Slide 43: Convergence (cPCI) to Integration (ATCA)
Convergence (cPCI) to Integration (ATCA]Soft- Video Data Center Elements Web Firewall Switch Server E-Commerce Server Gateway Cache Server Filter PSTN Internet FTTH Term. ATM Switch WDM Terminal FTTH Term. WDM Terminal ATM Switch Fiber CMTS CMTS Cable IP Router Transport Elements IP Router DSLAM Cor
Slide 44: Specification Status
Specification Status • Final subcommittee vote on specification November 24, 2002 • Executive Committee to vote December 30, 2002 • Alpha Interoperability Workshop (AIW) schedule for Q1 2003 • More information: http://www.picmg.org/pdf/AdvancedTCA_Core_Draft_Short_Form_ Specification.pdf Advance tec
Slide 45: AdvancedTCA Sub-module Proposal
AdvancedTCA Sub-module Proposal Sub-Module Sub-Module Optimized for PICMG 3.0 – Front panel accessible – Hot Swap Capability Sub-Module – 4 per Module – 50% more front panel space PMC – 30% more component space – 100% more power – 800% more volume Advance technologies; Automate the world. 45
Slide 46: IXP2400 - Block Diagram
IXP2400- Block Diagram Advance technologies; Automate the world. 46
Slide 47: AdvancedTCA will meet the Market Requirements
AdvancedTCA will meet the Market Requirements • AdvancedTCA – Provides the bandwidth for next generation applications • 2.1Tb/s – Provides enough Blade space for next generation silicon • 140 in2 – Provides the thermal capacity for the future • 200 Watts per Blade – Enhanced availability through sys
Slide 48: ADLINK is your Partner of Choice
ADLINK is your Partner of Choice Advance technologies; Automate the world. 48 48