Mersen Sa · EURONEXT:MRN
Mersen Sa — Investor Day (September 2012)
15 slides from Mersen Sa's investor day presentation, September 2012
Slide 1: Semiconductor fab equipment
SEMICONDUCTOR fab equipment
Slide 2: Before, growth in the electronics market was driven by computers
BEFORE, GROWTH IN THE ELECTRONICS MARKET WAS DRIVEN BY THE INCREASING USE OF COMPUTERS Silicon-based microprocessor 6 Investor Day 2012
Slide 3: Today, it is being led by three main factors
TODAY, IT IS BEING LED BY THREE MAIN FACTORS …TO BE JOINED IN THE MOBILE DATA ENERGY FUTURE BY NETWORKS EFFICIENCY A FOURTH COMMUNICATIONS Flat screens Data storage Low-energy lighting Smartphones, Computing Tablets power Electricity grids HYBRID Wireless Cloud computing AND/OR connectivity Speed dr
Slide 4: The wireless communication market is just beginning to expand
THE WIRELESS COMMUNICATION MARKET IS JUST BEGINNING TO EXPAND Global wireless data traffic +92% CAGR (exabytes p.a.) 6.3 EB 3.8 EB 2.2 EB 1.2 EB 3G, 4G networks 0.6 EB 0.2 EB 2010 2011 2012 2013 2014 2015 EB: exabytes =1018 Source: Cisco VNI Mobile, 2011 8 Investor Day 2012
Slide 5: Data storage capacity is rising sharply
DATA STORAGE CAPACITY IS RISING SHARPLY Global data center traffic (zettabytes p.a.) +37% CAGR Reduction in data storage costs 4.8 3.7 2.9 2.1 1.5 1.0 High-speed data transfers 2010 2011 2012 2013 2014 2015 Zettabytes = 1021 Source: Cisco and Mersen estimates 9 Investor Day 2012
Slide 6: Energy efficiency is becoming a driving force in every market
ENERGY EFFICIENCY IS BECOMING A DRIVING FORCE IN EVERY MARKET (in billion of units) 70 +45% CAGR A mass market LED lighting goes mainstream 11 cv 2010 2011 2012 2013 2014 2015 Source: Strategies Unlimited and Piper Jeffray Research A highly technical (USD billion) +8% market CAGR 15 AC speed control
Slide 7: Mersen's role in semiconductor fabrication
MERSEN’S ROLE IN SEMICONDUCTOR FABRICATION 11 Investor Day 2012
Slide 8: Continuously improved technologies, from silicon to new materials
CONTINUOUSLY IMPROVED TECHNOLOGIES, FROM SILICON TO NEW MATERIALS MATURE MARKET EMERGING TECHNOLOGIES Raw material/ Silicon GaN/Sapphire SiC GaN GaAs InP substrate Chip Power Micro- RF Components processor components incl. LEDs components Optronics RAM IGBTs Renewable End market Networks and PCs Spe
Slide 9: Major upgrades in production processes
MAJOR UPGRADES IN PRODUCTION PROCESSES INCREASINGLY PURE 0.01 PPB PRODUCTION PROCESS REQUIREMENTS INCREASINGLY INCREASINGLY BIG HOT AND CORROSIVE 450MM 2,500°C IMPROVE THE COST-EFFECTIVENESS OF OUR CUSTOMERS’ NEW COMPONENTS AND ENSURE NEW DEVELOPMENTS 13 Investor Day 2012
Slide 10: Processes to meet increasingly exacting purity standards
PROCESSES TO MEET INCREASINGLY EXACTING PURITY STANDARDS Development of purification Supply increasingly pure products: and ultra-pure deposit Impurities < 1ppm processes Ultra-pure material solutions for ingot pulling in Si, Sapphire, SiC, and other 14 Investor Day 2012
Slide 11: Processes to produce bigger and bigger wafers
PROCESSES TO PRODUCE BIGGER AND BIGGER WAFERS Align the offering with the Supply outsized products: need for large blocks for E.g. 1,500 mm Ø isostatic graphite ingot pulling (450mm wafers) blocks Equipment for large Si, Sapphire, SiC and other crystal pulling furnaces 15 Investor Day 2012
Slide 12: Increasingly hot and corrosive processes
INCREASINGLY HOT AND CORROSIVE PROCESSES High temperature epitaxy: A very corrosive process Tantalum carbide (TaC) coatings: Development of new protective coatings against increasingly hot The equipment can resist the process for and corrosive environments several hundreds of hours (versus several h
Slide 13: Current challenges
CURRENT CHALLENGES Business challenges Support the development of the MOCVD market in Asia (LED market growth) Technical challenges Contribute to performance improvements in high- temperature epitaxy processes Support advances (size/yield) in the ingot growth processes (silicon, SiC, sapphire, etc.)
Slide 14: Capabilities to serve market needs
CAPABILITIES TO SERVE MARKET NEEDS Customized offerings An extensive range Expertise in materials: for the major OEMs graphite + insulator + coatings High-precision machining Global sales coverage serving major OEMs: Applied Materials, GT, etc. Manufacturing facilities specialized in semiconductors
Slide 15: Going forward
GOING FORWARD DEVELOPMENT OF POWER COMPONENTS ON SIC SUBSTRATES $340 m +21% CAGR R&D and other Rail UPS Communications Renewable Energies Converteur EV/HEV $72 m 2012 2013 2014 2015 2016 2017 2018 2019 2020 Source: Yole 2012 19 Investor Day 2012