Infineon Technologies Ag · XETR:IFX

Infineon Technologies — Technical Presentation (July 2020)

46 slides from Infineon Technologies's technical presentation, Jul 23, 2020

1. Slide 1: Die Attach 5 Project

   © BOSCH 47 nexperia Die Attach 5 Project

2. Slide 2: Updates to last version from 01.12.2019

   Updates to last version from 01.12.2019  Following slides were updated: slide 4, 5, 15, 16, 21, 41, 44 2 23 July, 2020

3. Slide 3: Agenda

   Agenda  Motivation: Environmental and health endangerment by lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 3 23 J

4. Slide 4: Sustainability Efforts I

   Sustainability Efforts I Infineon: We understand sustainability as the symbiosis between economy, ecology and social engagement. At Infineon, we responsibly manage the handling of hazardous materials to safeguard human health and environmental protection. As part of Infineon Group Policy for Environ

5. Slide 5: Sustainability Efforts II

   Sustainability Efforts II Bosch: For the Bosch Group, sustainability means securing the company’s long-term success while at the same time protecting the natural resources on which present and future generations depend. The strategic imperative “Invented for life” thus expresses the aim to make mobi

6. Slide 6: Examples for Environmental Protection

   Examples for Environmental Protection CRI Powertrain Innovative electro-tools Photovoltaic with Li-Ion technology Saving energy in basestations Energy efficient Wind energy (gears) Solar thermal appliances ESP Power plant More efficient SSL Household/Office Smart grid lighting 6 23 July, 2020

7. Slide 7: Lead: Environmental and Health Endangerment

   Lead: Environmental and Health Endangerment  Environmental dangers  Health dangers:  Poisonous substance  Neurotoxin  Accumulates in soft tissues & bones  Damage to nervous system  Causes brain disorder  Causes blood disorder in mammals 7 23 July, 2020

8. Slide 8: Agenda

   Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 8 23 J

9. Slide 9: Use of Lead in Electronics

   Use of Lead in Electronics Exemption Expiry / Review Date Lead in soldering on PCB, the components and their finishes E/2015 Lead in solder for other application, not on PCB or glass E2010 Lead in finishes of Al-Capacitors E/2012 example IC packages Lead in soldering on glass for mass-flow sensors 2

10. Slide 10: Use of Lead in Electronics

    Use of Lead in Electronics  Use of Lead containing Solders in PCB  PbSn63 or PbSn62Ag2 are & have been used for soldering components onto a printed circuit board (PCB)  Leadfree alternative solders known & implemented  E.g. SnAg3.8Cu0.7 (SAC)  Use of high Lead containing Solders as chipsolders

11. Slide 11: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) °C in °C 300 300 Temperature in Temperature 250 250 200 200 150 150 100 100 n Ag Ag Ag b b b n Sn

12. Slide 12: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting Melting temperature temperature of of solder solder alloys 400 400 Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) Temperature in °C 300 300 250 250 200 200 150 150 100 100 nn bb 2S Ag Ag Ag bb b n SSnn

13. Slide 13: Materials for Die Attach: Solder Alloys

    Materials for Die Attach: Solder Alloys Melting temperature Melting temperature of of solder solder alloys 400 400 Tem perature load & lead-free Tem perature load 350 350 ( d ur ing sub seq uent assemb ly p r o cesses & p cb - so ld er ing ) °C in °C 300 300 Temperature in Temperature 250 250 200 20

14. Slide 14: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 14 23

15. Slide 15: Legislation I

    Legislation I  European End-of-Life Vehicle (ELV) Directive (2000/53/EG) mandates conversion to environmentally friendly materials  Annex II (2010/115/EU, exemptions 8(e-j) ELV 9th Adaptation  In the last review of this exemption in 2018/19 under the ELV Directive in 2019 the consultants conclude

16. Slide 16: Legislation II

    Legislation II  European RoHS Directive (2011/65/EU) restricts the use of hazardous substances in electrical and electronic equipment  RoHS exemptions allow temporary use of restricted substances. See Annex III in 2011/65/EU (RoHS-2) for exemptions.  RoHSII recast went into force 1st of July 2011

17. Slide 17: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & its use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 17 23

18. Slide 18: DA5 Project at a Glance

    DA5 Project at a Glance  04/2009: Decision to form DA5 consortium: STMicroelectronics, NXP Semiconductors, Infineon Technologies, Robert Bosch, and Freescale Semiconductors.  DA5 = Die-Attach 5  ELV Annex2, exemption 8e and RoHS 7a cover the use of lead in high melting temperatures type solders i

19. Slide 19: DA5 Approach

    DA5 Approach Press Release (Q2/2010) Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-le

20. Slide 20: DA5 Project Objectives

    DA5 Project Objectives  Joint development by semiconductor suppliers to address and mutually define the direction of Pb-free solder d/a-technology  DA5 is working together with suppliers to find feasible alternative solutions for lead-free die-attach  Evaluate available and potential alternatives

21. Slide 21: DA5 Setup for Pb-free Power Die Attach

    DA5 Setup for Pb-free Power Die Attach DA5  Major material suppliers from Europe, US and Asia were assessed  17 major material suppliers have been identified  Continuous contact is established. (some stopped to offer relevant materials)  DA5 is continuously looking for further suppliers offering

22. Slide 22: Targeted Applications

    Targeted Applications  Power Modules  Smart Power ASICs  Power MOS-FETs & IGBTs in SMD packages  Power MOS-FETs & IGBTs in Through-Hole packages (THT)  Different applications have different specifications and may require Pictures not to scale different lead-free solutions 22 23 July, 2020

23. Slide 23: Examples of reliability requirements

    Examples of reliability requirements *  AEC-Q100/-Q101 Grade 0  Typical Tjunction 175°C; max. up to 200°C  Thermal/electrical properties  Same or better than existing solutions with lead solder  Reflow 260°C (SMD)  Moisture sensitivity level MSL3 or better (SMD)  Wire bonding temp. up to 260°

24. Slide 24: Materials

    Materials  4 different material “classes” are in discussion DA 5 * Transient Liquid Phase Sintering 24 23 July, 2020

25. Slide 25: Conductive Adhesives I

    Conductive Adhesives I  Principle  High electrical and thermal conductivity of adhesives is achieved by an increased silver filler content with very dense packing of filler particles. Reduction of particle size to micro and nano scale stimulates a sintering of the silver particles during the resin

26. Slide 26: Conductive Adhesives II

    Conductive Adhesives II  Advantages  Organic resin improves adhesion to different types of chip backside metals and leadframe platings.  Same or better mechanical, thermal, and electrical properties compared to solder, similar to sintered silver.  Commonly used die bond equipment can be used for

27. Slide 27: Conductive Adhesives III

    Conductive Adhesives III  Limitations  Materials contain solvents to improve rheology for dispensing. This requires careful handling and control of the manufacturing process. It also bears a risk of leadframe and die surface contamination.  Material cost is higher compared to standard adhesives a

28. Slide 28: Ag Sintering I – Overview

    Ag Sintering I – Overview  Principle  Ag-sinter pastes: Ag particles (µm- and/or nm-scale) with organic coating, dispersants, & sintering promoters  Dispense, pick & place die, pressureless sintering in N2 or air in box oven  Resulting die-attach layer is a porous network of pure, sintered Ag 

29. Slide 29: Ag Sintering II – Assembly

    Ag Sintering II – Assembly  Dispensability and staging time are improving, long run workability data not available  Voiding is improving  Process control issue: C-SAM scans are difficult to interpret  Bond line density differences should be Die edge Die center improved  Reduction of un-sintered

30. Slide 30: Ag Sintering III – 0-hr & Reliability Results

    Ag Sintering III – 0-hr & Reliability Results  Oxidation and/or delamination of interfaces is common, even Die Delamination at 0-hr, lowering adhesion and electrical & thermal performance. Potential solutions (not yet proven):  Reduce oxygen content in atmosphere during curing  Change paste formu

31. Slide 31: TLPS materials I

    TLPS materials I  Advantages  Fulfills many of the drop-in replacement requirements for a paste  Better cost position compared to Ag sintering solutions  Good electrical performance on Ag-plated leadframes  Disadvantages  Medium metal content in die attach  Medium space rate, filled with Epox

32. Slide 32: TLPS materials II

    TLPS materials II  The hybrid material showed a 1:1 metal-to- resin ratio. The spaces between metal structures are filled with epoxy resin material.  The reflow process is very critical and has to be further optimized, the reflow profile seems to be product-specific  Low maturity, more reliabilit

33. Slide 33: Alternative Solders I: Properties to be considered

    Alternative Solders I Properties to be considered  Robust manufacturing process  Repeatable solder application Zn based alloy reference  Stable wetting angle  Surface compatibility (chip backside, lf finish)  Reliability  Voiding / cracking / disruption after stress  Growth of brittle interme

34. Slide 34: Alternative Solders II

    Alternative Solders II  Zn-based Alloys  Material currently only available in wire form  Low wettability makes the use of special equipment necessary (capability for mass production open)  Process temperature very high (above 410 °C) => high risk for incompatibility with chip technologies  Grow

35. Slide 35: Key Performance Indicators I

    Key Performance Indicators I Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to best tested material in class • DA5 assessment only valid for die

36. Slide 36: Key Performance Indicators II

    Key Performance Indicators II Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to best tested material in class • DA5 assessment only valid for die

37. Slide 37: Key Performance Indicators III

    Key Performance Indicators III Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to best tested material in class • DA5 assessment only valid for di

38. Slide 38: Key Performance Indicators IV

    Key Performance Indicators IV Comparison of competing Technologies • DA5 now uses a new rating system with revised criteria (Pb based solder reference set to 5 for all criteria) for the technology comparison • DA5 assessment refers to best tested material in class • DA5 assessment only valid for die

39. Slide 39: Agenda

    Agenda  Motivation: Environmental and health endangerment of lead  Situation: Lead & the use in Electronics  Status on legislation  DA5 Structure and Project:  Cooperations and partners  Requirements, Applications and Approaches for possible solutions  Results  Timeline and Conclusion 39 23

40. Slide 40: DA5 Timeline (Overview/Milestones) I

    DA5 Timeline (Overview/Milestones) I 12th F2F Technology review & Supplier feedback Neubiberg 1st F2F 2ndF2F 3rd F2F 4th F2F 5th F2F 6th F2F 7th F2F 8th F2F 9th F2F 10th F2F 11th F2F 13th F2F Sibiu Reutlingen Agrate Regensburg Munich Munich Nijmegen Reutlingen Agrate Regensburg Munich Nijmegen Gener

41. Slide 41: DA5 Timeline (Overview/Milestones) II

    DA5 Timeline (Overview/Milestones) II Technology review & Supplier feedback 29th F2F 30th F2F 31st F2F 32nd meeting 33rd F2F Reutlingen Munich Nijmegen MS Teams Regensburg General project activities 06.-09.07.20 23.-26.11.20 last meeting next meeting Supplier meetings with potential material freeze

42. Slide 42: Material freeze DA5 - Automotive (ELV)

    Substitute DA5 Material(s) for - Automotive High-LeadProcess(ELV) Release Solders DA Material Semiconductor Electronic Package Vehicle Technology Technology Component Control Unit chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Lead-free Material Technology Component ECU Vehicle Mat

43. Slide 43: Material freeze DA5 - Industrial (RoHS)

    Substitute DA5 Material(s) - Industrial for High-Lead Release Solders Process(RoHS) DA Material Package Semiconductor Customer Application Technology Technology Component chain Lead-free Lead-free Die Attach Package Lead-free Lead-free Material Technology Component Product Material freeze Prototype

44. Slide 44: Conclusion I

    Conclusion I  Today’s lead-free material technologies for semiconductor applications (die attach) are not ready to substitute Leaded High Melting Temperature Solders as drop-in solution.  Substantial development efforts have been running for more than 11 years. Over 100 materials from more than 13

45. Slide 45: Conclusion II

    Conclusion II  Customer qualifications (TIER1 and OEM) and supply chain conversion / ramp can only begin after package technology and semiconductor component qualification.  No single drop-in lead-free solution is in sight! Different applications will need different solutions. It’s likely that som

46. Slide 46: Contact Information

    Contact Information Speaker of the DA5 consortium: Bodo Eilken Infineon Technologies AG Email: [email protected] DA5 customer presentation: http://www.infineon.com/da5customerpresentation The full specification document “DA5 Die-Attach Material Requirement Specification” is available upon req

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