Kinik Co. · TWSE:1560

Kinik — Q4 2024 Earnings Presentation

44 slides from Kinik's earnings presentation, Feb 26, 2025

Slide 1: 4Q24 Investor Conference
4Q24 Investor Conference Feb. 26 2025 1
Slide 2: Disclaimers
Disclaimers • The prospective statements released or mentioned in this presentation are based on our company’s data as well as the current situation. • The forward-looking statements contained in this presentation are affected by risks, uncertainties, and people’s inferences. As a result, actual res
Slide 3: Outline
Outline • Welcome William Lee, DBU President/Spokesperson Tony Pai, Vice President/Acting Spokesperson • Company overview • 4Q24 & 2024FY financial results • 2025 outlook • Q&A • Appendix: KINIK Visions/Missions, Products, Plants information 3 Copyright© KINIK COMPANY, All Rights Reserved.
Slide 4: Company Overview
Company Overview  Company established in 1953; Taiwan Stock Code 1560  Capital : 1,458M TWD (Dec. 31 2024)  Employees： ~2100 worldwide. (~1800 in Taiwan.) Product Introduction  2024 revenue 7,019M TWD, EPS=7.1  Main Products by 3 Business Units and Sales Ratio in 2023 ABU: Abrasives BU Subsidia
Slide 5: 4Q24 Consolidated Income statement
4Q24 Consolidated Income statement  4Q24 revenue 1,834M TWD(USD 56.8M), QoQ -1.4%, GM 30.9%(+0.8 ppt), EPS 1.62  1~4Q24 revenue 7,019M TWD(USD 218.6M), YoY +10.0%, GM 31.2%(+0.7 ppt), EPS 7.1 Accounting Period Income 4Q24 3Q24 4Q24 over 2024FY 2023FY 2024FY over (all in thousands TWD except *) 3Q2
Slide 6: 4Q24 Sales Performance by BU
4Q24 Sales Performance by BU ABU: Grinding Wheel DBU: CMP Pad Conditioner SBU: Reclaim Wafer Others: Subsidiaries  KINIK: QoQ sales -1.4%, YoY +16.9%.  ABU: With lower demands in machinery & mechanical industries, QoQ sales -6.9%.  DBU: With higher CMP diamond disk’s demands in advanced logic tec
Slide 7: 1Q~4Q24 Sales Performance by BU
1Q~4Q24 Sales Performance by BU ABU: Grinding Wheel DBU: CMP Pad Conditioner SBU: Reclaim Wafer Others: Subsidiaries  KINIK 1Q~4Q24 revenue YoY +10.0%.  Among all business units, DBU's diamond disk revenue achieved the highest growth at +23%, increasing its contribution to the company’s total reve
Slide 9: 4Q24 Diamond Disk Sales (2/2)
4Q24 Diamond Disk Sales (2/2) • In 4Q24, DBU sales QoQ +4.4%. • The sales ratio of advanced technologies(5 nm and below) was increased to 57.1% from 52.6% mainly due to the increases of 3nm and 2nm disks. Remark：Data regards to one specific customer. 9 Copyright© KINIK COMPANY, All Rights Reserved.
Slide 11: Recent Key Information
Recent Key Information  On 2024/12/24, The BOD has approved the expansion budget NT$ 2 billions for the factory of SBU at Hsinchu Science Park, to increase 12”wafer capacities 100k pcs/month. Starting by 2nd half of 2026, KINIK’s total 12” wafer capacities will be increased from 300k to 400k pcs/mo
Slide 12: 2025 Outlook
2025 Outlook  ABU Grinding Wheel – Demand from traditional industrial machinery and machine tool customers is expected to recover gradually in 2025. Additionally, the increasing adoption of high-end grinding wheels and the expansion of ABF customer base will drive ABU’s full-year revenue to see a m
Slide 17: Core Technology Grinding
Mw Core Technology “ Grinding” ©... Xs _— lie61 ae? yer Diamond Dresser Bonding Tool CMP Disk Si/SiC Wafer Thinning y )
Slide 18: Major Product and Business Diagram
Major Product and Business Diagram Customer Semiconductor/Electronics/Optical… Machinery/Mechanical… Industries • CMP Disk • Grinding Wheel Major • Test Wafer • Resin Wheel • Diamond Tool • Diamond Wheel Products • Reclaim wafer • Si/SiC Wheel • CBN Wheel • Plating Wheel SBU DBU ABU KTC Hongia (Semi
Slide 20: KINIK's products in Semiconductor Industries
KINIK’s products in Semiconductor Industries Revenue(TWD) in 2024 3.5 billion 2.1 billion Ingot test& CMP Wafer Dicing Dressing 2.5D/3D ABF Bevel grind reclaim Disk thinning blade board Package bonding grind wafer grind tool Wafer IC Manufacturing IC Packaging 研磨技術 (Grinding Technology by Diamond Ab
Slide 22: Test / Reclaim Wafer
測試 & 再生晶圓 Te s t / R e c l a i m Wa f e r 中砂的再生晶圓之製程特色以延性輪磨(Ductile Mode Grinding)加工取代傳統研磨(Lapping)加工，目的是降低加工之變質層，減少化學藥品污染，且可提高加工精度，為最先進之再生晶圓製程。 The features of the KINIK reclaimed wafers are refurbished by ductile mode grinding used to replace traditional lapping to lower the strained thickne
Slide 23: CMP Diamond Disk
CMP鑽石碟 Diamond Disk CMP (Chemical Mechanical Polish) 化學機械拋光，主要用於先進IC製程中，透過拋光墊與拋光液同時透過機械與化學反應加工晶圓表面，達到表面晶圓材料的移除及整體的平坦化，才能接續後續製程以及提高良率，進而能循摩爾定律持續微縮IC線寬面積，推展出N5/N3/N2先進製程。而鑽石碟的功用就是在拋光晶圓的同時去加工拋光墊，以移除拋光時的副產物及穩定拋光速率並提升良率及延長拋光墊使用壽命，是先進IC拋光製程中提升良率及控制成本中非常重要的一環。 CMP (Chemical Mechanical Polish) is widely
Slide 24: CMP Diamond Disk
CMP鑽石碟 Diamond Disk 中砂鑽石碟用於半導體化學機械研磨製程中修整研磨墊以達到理想移除率及平坦度。 KINIK diamond disk is used on semi-conductor CMP process in order to make the pad reach the desirable removal rate and uniformity. Conventional Disk DiaGrid® I-DiaGrid® S-DiaGrid® Advanced Disk：High Performance / Long Life Time Pyradia® EDP D
Slide 25: EDP Disk for Metal Free Solution
EDP Disk for Metal Free Solution  Diamond disk protected with EDP film for metal-free requested in advanced IC technologies. 25 Copyright© KINIK COMPANY, All Rights Reserved.
Slide 27: Metal-free O-Pyradia
Metal-free O-Pyradia® 鑽石碟  O-Pyradia CMP pad conditioner for advanced customer’s tightened metal contamination control. Pyradia Type O-Pyradia Pyradia Tip Height Control Photo Material of Substrate Polymer Metal Strong Metal O-Pyradia Diamond Free LM(Ni ; Cr Bonding Material Polymer powder) Bonding
Slide 28: Semiconductor Grinding Wheel
Semiconductor Grinding Wheel  The Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as Si, SiC, and advanced 2.5D/3D package (Cu/compound…etc.). The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of di
Slide 29: Diamond Roller
Diamond Roller  The diamond rollers are used to sophisticatedly dress the complex and high precision form of grinding wheels (e.g. Al2O3, SiC, cBN wheels) for automatic shaping high volume production of high precision transmission components such as ball screws, guides, bearings, gears, tools, auto
Slide 30: Tools for Semiconductor & photoelectric
To o l s f o r S e m i c o n d u c t o r & p h o t o e l e c t r i c 中砂以最新電鑄、成型與燒結技術製造成的精密鑽石切割刀。搭配特殊的金屬與樹脂等結合劑，使切割軟刀具備高剛性、低磨耗且具備良好的自銳性；適合在各類精密陶瓷、硬脆材料、磁性材料，光學玻璃，印刷電路板與半導體封裝材料的切割應用。 KINIK Company announces the introduction of Super Hubless Dicing Blade with resin, metal and nickel matrices. The dic
Slide 31: Porous Ceramic Chuck Table
To o l s f o r S e m i c o n d u c t o r & p h o t o e l e c t r i c 多孔質陶瓷真空吸盤 Porous Ceramic Chuck Table 多孔質陶瓷孔洞均勻微細、不發塵、可具靜電消散特性，應用於真空吸盤具備吸力均勻、局部吸附性、不產生印痕、工作效率及精度高等優點，可充分應用於半導體研磨、清洗、切割及檢測等設備。 – High-performance, High-precision, Uniform suction force. – Partial chucking without sagging. – Chucki
Slide 32: Ultra Precision Machining Tools
金屬精密加工刀具 U l t r a P r e c i s i o n M a c h i n i n g To o l s 中砂提供電子業、PCB板、木工業及金屬加工業所需的單晶（SCD）、聚晶鑽（PCD）、立方氮化硼（PcBN）等鑽石刀具已逾20年。近年積極投入生產高精度、更微小之SCD、PCD 及 PcBN產品供光學業、精密模具等加工技術使用，如：單晶鑽石車刀與銑刀、PcBN微小徑銑刀等。 KINIK company already has more than 20-year experience in providing all kinds of diamond tools f
Slide 33: PVD/CVD Coating Service
PVD/CVD 鍍膜 PVD/CVD Coating Service 中砂鍍膜代工中心2000年成立，在PVD/CVD真空鍍膜領域深耕近20 年，不斷投入相關鍍膜設備及開發TiN、TiCN、TiAlN、DLC、Diamond鍍膜技術等。同時持續將研究成果應用至各個產業，提供給客戶高效能的鍍膜應用工具，包括機械加工、精密模具、3C產品、汽車、通訊、醫療、光學及電子產業等。 Established in 2000, KINIK Coating Center has 20 years of experiences in PVD/CVD coating. KINIK persistently i
Slide 34: Traditional Grinding Wheel & Diamond / CBN Grinding Wheel
傳統砂輪及鑽石/CBN砂輪 Traditional Grinding Wheel & Diamond / CBN Grinding Wheel 中砂提供各式平面、內外圓、無心及雙平面等工件研磨及切斷用的傳統、 BD及電鑄砂輪。主要產業應用包含精密機械業的滑軌及齒輪研磨與砂輪成形修整用的鑽石滾輪、鋼鐵業的輥筒研磨、工具製造業的高速鋼鑽頭、CNC及PCD/PcBN刀具等研磨、半導體業的晶圓減薄及倒角研磨、高效率硬脆材料如SiC研磨用的蜂巢砂輪、光學模具模仁拋光等。 KINIK provides various grinding wheels for surface, internal &
Slide 38: Plant Information
廠區 Plant Information 總公司 Head Office 鶯歌廠區 Yingge Factory 239010 新北市鶯歌區中山路64號 No.64, Zhongshan Rd., Yingge Dist., New Taipei City 239010, Taiwan TEL:+886 2 2679-1931~40 Grinding Wheel & Diamond Disk 樹林廠區 Shulin Factory 238010 新北市樹林區中山路2段151巷16號 No.16, Ln. 151, Sec. 2, Zhongshan Rd., Shulin Dist., N
Slide 39: Plant Information
廠區 Plant Information 竹北廠區 Zhubei Factory 302059 新竹縣竹北市十興路260號 No.260, Shixing Rd., Zhubei City, Hsinchu County 302059, Taiwan TEL:+886 3 550-7160~5 竹科廠區 Hsinchu Science Reclaim & Test Wafer Park Factory 350401 苗栗縣竹南鎮科北五路6號再生晶圓 & 測試晶圓 No. 6, Kebei 5th Rd., Jhunan Township, Miaoli County 350401, Taiw
Slide 40: Plant Information
廠區 Plant Information 鴻記工業股份有限公司 Hongia Industry Co, Ltd. 239008 新北市鶯歌區余厝巷2號 No. 2, Yucho Lane, Yingge Dist., New Taipei City 239008, Taiwan TEL:+886 2 2679-1006 Email : [email protected] www.hongia.com.tw Electroplated Diamond Wheel 電鑄砂輪金力泰國有限公司 Kinik - Thai Co., Ltd. 225 Moo 7 , Khok Pip, S
Slide 41: Milestone
榮耀記事 Milestone 2021年11月榮獲行政院「第26屆國家品質獎全面卓越類 - 績優經營獎」。 Nov. 2021, Honored with “BUSINESS MERIT AWARD of Total BUSINESS EXCELLENCE” at the 26th NATIONAL QUALITY AWARD from the Executive Yuan, R.O.C. https://nqa.cpc.tw/NQA/Web/Awards26th_Content.aspx?p=f2b6e812- 92aa-49c3-8149-1e005a0fe706 41 Copyrig
Slide 42: Milestone
榮耀記事 Milestone 2021年10月榮獲經濟部「2022年第30屆台灣精品獎 - 12吋再生晶圓」。 Oct. 2021, Honored with “Taiwan Excellence Award - 12" Reclaimed Wafers” from the MOEA, R.O.C. https://www.taiwanexcellence.org/tw/award/product/1110433 Copyright© KINIK COMPANY, All Rights Reserved. 42
Slide 43: Milestone
榮耀記事 Milestone 榮獲經濟部第四屆卓越中堅企業獎 Honored with 4th Taiwan mittelstand Award from the MOEA, R.O.C, in 2017. 榮獲經濟部2013年第14屆工業精銳獎機械、運輸工業類 Honored with 14th Industrial Sustainable Excellence Award from the MOEA, R.O.C, in 2013. 榮獲經濟部台灣百大品牌獎 Honored with the Top 100 Taiwan Brands Award from the MOEA, R.O
Slide 44: Milestone
榮耀記事 Milestone 榮獲經濟部2006年台灣優良品牌獎 Honored with the Taiwan Superior Brand Award from the MOEA, R.O.C, in 2006. 榮獲第十屆經濟部產業科技發展傑出獎 Award of Excellence, the 10th R.O.C. MOEA Industrial Technology Advancement Award in 2002. 全國第一家砂輪公司榮獲國家傑出精品獎 The first grinding wheel plant won Excellent Product Award in 1

Kinik Company — Q4 2024 Earnings Presentation on 6ix

Kinik — Q4 2024 Earnings Presentation

Slide 1: 4Q24 Investor Conference

Slide 2: Disclaimers

Slide 3: Outline

Slide 4: Company Overview

Slide 5: 4Q24 Consolidated Income statement

Slide 6: 4Q24 Sales Performance by BU

Slide 7: 1Q~4Q24 Sales Performance by BU

Slide 8: 4Q24 Diamond Disk Sales (1/2)

Slide 9: 4Q24 Diamond Disk Sales (2/2)

Slide 10: 4Q24 SBU Test/Reclaim Wafer Sales

Slide 11: Recent Key Information

Slide 12: 2025 Outlook

Slide 13: Q&A

Slide 14: Appendix

Slide 15: KINIK Company

Slide 16: History, Now, and Future of KINIK

Slide 17: Core Technology Grinding

Slide 18: Major Product and Business Diagram

Slide 19: Products Introduction

Slide 20: KINIK's products in Semiconductor Industries

Slide 21: Test / Reclaim Wafer

Slide 22: Test / Reclaim Wafer

Slide 23: CMP Diamond Disk

Slide 24: CMP Diamond Disk

Slide 25: EDP Disk for Metal Free Solution

Slide 26: equaDia Disk

Slide 27: Metal-free O-Pyradia

Slide 28: Semiconductor Grinding Wheel

Slide 29: Diamond Roller

Slide 30: Tools for Semiconductor & photoelectric

Slide 31: Porous Ceramic Chuck Table

Slide 32: Ultra Precision Machining Tools

Slide 33: PVD/CVD Coating Service

Slide 34: Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

Slide 35: Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

Slide 36: Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

Slide 37: Traditional Grinding Wheel & Diamond / CBN Grinding Wheel

Slide 38: Plant Information

Slide 39: Plant Information

Slide 40: Plant Information

Slide 41: Milestone

Slide 42: Milestone

Slide 43: Milestone

Slide 44: Milestone