Aehr Test Systems · NASDAQ:AEHR

Aehr Test Systems — Investor Presentation (July 2014)

20 slides from Aehr Test Systems's investor presentation, Jul 9, 2014

  1. Slide 1: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow July 2014 Nasdaq: AEHR

  2. Slide 2: Safe Harbor Statement

    Safe Harbor Statement This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties include wit

  3. Slide 3: Aehr Test Systems Company Overview

    Aehr Test Systems Company Overview Leading provider of systems that reduce the cost of testing and reliability screening of integrated circuits (ICs) used in today’s cutting edge technology.  Listed on NASDAQ: AEHR  New emerging IC test markets:  HQ in Fremont, CA  SSD Flash testing market: new

  4. Slide 4: Substantial Emerging Opportunities

    Substantial Emerging Opportunities  New Emerging IC Test Markets:  SSD Flash manufacturers ($200 - $300 million annual TAM opportunity):  Samsung  Hynix  Intel  Toshiba  Micron  SanDisk  Emerging Auto IC manufacturers ($50 - $75 million annual TAM opportunity):  nVidia  Sierra Wireless 

  5. Slide 5: SSD Flash Cycling Market

    SSD Flash Cycling Market NAND Application Share (2013) NAND Wafers by Application Other 20.0 MP3 7% (Millions of 300mm equivalent) 3% 18.0 SSD Wafer Starts Per Year 16.0 Tablets 14.0 Mobile 11% Cell Phones 12.0 Tablets 25% 10.0 PMP UFD 8.0 USB 14% SSD 6.0 21% 4.0 DSC/Video Flash Cards 2.0 Other 20%

  6. Slide 6: SSD Flash Wafer Level Cycling Yield Savings

    SSD Flash Wafer Level Cycling Yield Savings NAND FLASH SSD – Stacked die yield loss w/o WLBI Die Stack Effective Final Yield for Stacked Die Package 16 98.4% 92.3% 85.1% 78.5% 72.4% 66.7% 61.4% 56.6% 52.0% 12 98.8% 94.2% 88.6% 83.4% 78.5% 73.8% 69.4% 65.2% 61.3% 8 99.2% 96.1% 92.3% 88.6% 85.1% 81.7%

  7. Slide 7: Emerging Auto IC Test Market Opportunity

    Emerging Auto IC Test Market Opportunity  Automotive IC growth in sensors, control, information, and entertainment has substantially higher requirements for initial quality and long term reliability 5

  8. Slide 8: Emerging Auto IC Market Drivers

    Emerging Auto IC Market Drivers New Automotive Technology Driving Automotive IC Test Market Growth 6

  9. Slide 9: Our Products

    Our Products Cost-effective, reliable and highly configurable Test & Packaged Part Test & Burn-in Systems Burn-in Systems -15 Unique solution for test & burn-in for KGD and Multiple Wafer Test & automotive applications Burn-in Systems and Contactors -1 Reduced cost of test with high throughput paral

  10. Slide 10: Significant Worldwide Customer Base

    Significant Worldwide Customer Base ASE GROUP Over 2500 Systems Shipped Worldwide (Partial Customer List) 8

  11. Slide 11: AEHR Burn-in & Test Innovations

    AEHR Burn-in & Test Innovations Memory ATS-12000 MBT MTX ABTS-M Dynamic Test During APG Functional APG Functional Burn-in Burn-in Test & Burn-in Test & Burn-in 1977 1980s 1990s Today Logic ATS-12000 ATX MAX ABTS-L/P Dynamic Monitored Monitored Functional Burn-in Burn-in Burn-in Test & Burn-in 9

  12. Slide 12: Addressing Test & Burn-in Needs

    Addressing Test & Burn-in Needs ABTS Family of Packaged Part Test & Burn-in Systems  Automotive, Mobile Processors, Video/Graphics, 4G Comms, High Power SOCs, and Memory ICs  Proprietary family of high performance thermal chambers  Turn-key solution for individual temperature control of each devi

  13. Slide 13: ABTS / MAX Production Test Floor

    ABTS / MAX Production Test Floor 11

  14. Slide 14: Full-Wafer Test Evolution

    Full-Wafer Test Evolution Systems 14 200mm Wafer Slots Single 300mm Wafer 15 300mm Wafer Slots Single/Multi 300mm Wafer Air thermal control Liquid Cooled Liquid Thermal Control Liquid /Air Cooled Full Algo PG Full Algo or JTAG/BIST Vector or Algo PG Vector with JTAG/BIST 1995 2002 2006 2009 2014 Con

  15. Slide 15: Multi-Wafer Test & Burn-in

    Multi-Wafer Test & Burn-in  Cost-effective Solution for Producing Known- Good-Die (KGD)  Stacked and Multi-Chip Packages  Zero-defect tolerant applications  Wafer Level Reliability test of automotive, communication, and mission critical ICs  Move packaged part test and burn-in to wafer test  H

  16. Slide 16: High Volume Manufacturing Floor

    High Volume Manufacturing Floor 14

  17. Slide 17: Full Wafer Test & Burn-in

    Full Wafer Test & Burn-in FOX-1 Family of Single Wafer Test & Burn-in Systems  Low Cost Wafer Test – More test is moving to wafer with additional DFT, BIST, and Higher Parallelism  Automotive ICs – Full wafer functional, stress, and burn-in test of automotive ICs -1  Discrete and Embedded Memorie

  18. Slide 18: FOX-1 Production Test Floor

    FOX-1 Production Test Floor 16

  19. Slide 19: Investment Considerations

    Investment Considerations  Current TAM of $100 million expanding to $400 - $500 million  New emerging IC test markets have no incumbent test providers:  SSD Flash testing market ($200 - $300 million annual TAM opportunity)  Emerging Auto IC testing market ($50 - $75 million annual TAM opportunit

  20. Slide 20: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow Nasdaq: AEHR

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