Axcelis Technologies, Inc. · NASDAQ:ACLS
Axcelis Technologies — Advanced Semiconductor Manufacturing Conference (ASMC) 2026
16 slides from Axcelis Technologies's conference presentation, May 2026
Slide 1: Advanced Semiconductor Manufacturing Conference
ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE
Slide 2: ASMC 2026
ASMC 2026 ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE MAY 11–14 | HILTON ALBANY, ALBANY, NY
Slide 3: MUSIC to Reduce Defects and Improve Throughput on Implants for SiC MOSFETs
MUSIC to Reduce Defects and Improve Throughput on Implants for SiC MOSFETs HC Jayashankar
Slide 4: Introduction
Introduction • Many implanted structures require multiple implants at different energies to form a proper junction depth profile • For example, multiple implants are required to form a nearly constant doping level in the vertical direction • This is especially true for silicon carbide devices, becau
Slide 5: Multi-Step Implant Chain (MUSIC)
Multi-Step Implant Chain (MUSIC) • MUSIC is a technique to complete multiple implants without removing the wafer from the chuck by rapidly retuning the beam in between implants • Only the downstream beamline components are retuned in the MUSIC protocol (source retuning is not fast enough) • MUSIC pr
Slide 6: MUSIC is a unique capability for multiple chain implants
MUSIC is a unique capability for multiple chain implants Traditional Energy Chain Multi-Step Implant Chain that minimizes beam retuning while the wafer remains on Autotune Recipe 1 Autotune All Recipes the electrostatic chuck (ESC). Implant Wafer 1 Implant Wafer 1 with all • Potential benefits of MU
Slide 7: Experiment
Experiment • SiC Power MOSFET device • Compared conventional multiple implants Sequence Species Energy (keV) Dose (cm-2) with MUSIC for P+ 80 2.5x1014 P+ 120 5.0 x1014 • 2 phosphorus sequences Sequence 1 P+ 150 5.0 x1014 • 2 aluminum sequences P+ 200 5.0 x1014 P+ 7.5 x1013 • 2 lots (25 wafers) for e
Slide 8: Results – Productivity Improvement
Results – Productivity Improvement • Process time per lot decreased and net throughput increased significantly for all implant sequences measured
Slide 9: Results – Bare Wafer Sheet Resistivity
Results – Bare Wafer Sheet Resistivity • No meaningful change in average 350 0.45 Sheet ressitivity, ohms/square sheet resistance or across wafer Normal Mean 0.4 300 uniformity for either of sequences Standard Deviation, % MUSIC Mean 0.35 1 and 2 250 Normal Stdev 0.3 200 MUSIC Stdev 0.25 150 0.2 0.1
Slide 10: Results – Bare Wafer SIMS Results
Results – Bare Wafer SIMS Results • No across wafer difference in the combined profiles Sequences 1 & 2 with MUSIC Sequence 1 & 2 without MUSIC
Slide 11: Results – Bare Wafer SIMS Results
Results – Bare Wafer SIMS Results • No across wafer difference in the combined profiles Sequences 4 with MUSIC Sequence 4 without MUSIC
Slide 12: Results – Device Wafer Electrical Test
Results – Device Wafer Electrical Test • No change in the trend for N+ Source resistance MUSIC Wafers
Slide 13: Results – Device Wafer Electrical Test
Results – Device Wafer Electrical Test • No change in the trend for body resistance MUSIC Wafers
Slide 14: Results – Device Wafer Electrical Test
Results – Device Wafer Electrical Test • No change in the trend for body threshold voltage MUSIC Wafers
Slide 15: Results – Wafer Yield
Results – Wafer Yield • No change in the yield map resulting from the MUSIC protocol • Light blue = good die Conventional MUSIC
Slide 16: Conclusions
Conclusions • MUSIC is a new technique to complete multiple implants of the same species at different energies, doses, and tilts without removing the wafer from the chuck • Achieved by varying the voltages in the downstream portion of a high current or medium current beamline, while keeping source,
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