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ASML Holding NV — Deutsche Bank Access European TMT Conference London 2012

20 slides from ASML Holding NV's conference presentation, Sep 5, 2012

  1. Slide 1: Deutsche Bank Access European TMT Conference London

    Deutsche Bank Access European TMT Conference London Franki D’Hoore, Director Investor Relations 5 September 2012

  2. Slide 2: Safe Harbor

    Safe Harbor Public Slide 2 4 September 2012 "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, including expected sales trends, expected shi

  3. Slide 3: Agenda

    Public Slide 3 4 September 2012 Agenda • Business summary • Co-investment program - Update • Business Environment • ASML technology strategy - Status • Outlook

  4. Slide 4: Business Summary

    Public Slide 4 4 September 2012 Business Summary

  5. Slide 5: Q2 results - highlights

    Q2 results - highlights Public Slide 5 18 July 2012 • Net sales of € 1,228 million, 44 systems sold valued at € 985 million, net service and field option sales at € 243 million • Gross margin of 43.2% • Operating margin of 27.0% • Net bookings of € 949 million, 43 systems • Backlog at € 1,503 millio

  6. Slide 6: Total net sales M€

    Total net sales M€ Public Slide 6 18 July 2012 Numbers have been rounded for readers’ convenience.

  7. Slide 7: Net system sales breakdown in value: Q2 2012

    Net system sales breakdown in value: Q2 2012 Public Slide 7 18 July 2012 Technology End-Use NAND 18% DRAM 9% KrF 27% I-Line 1% IDM 12% Region Foundry ArF Immersion 61% 72% Taiwan 43% USA 22% Sales in Units 22 18 Japan 4% 4 Korea Numbers have been 26% Europe 4% rounded for readers’ EUV ArF i ArFdry K

  8. Slide 8: Bookings activity by sector, EUV not included

    Bookings activity by sector, EUV not included Public Slide 8 Total value M€ 949 18 July 2012 Net booked NAND 19% • 38 new tools at € 896 million DRAM • 5 used tools at € 53 million 23% Foundry 36% IDM 22% Numbers have been rounded for readers’ convenience.

  9. Slide 9: Backlog in value per July 1st, EUV not included

    Backlog in value per July 1st, EUV not included Public Slide 9 Total value M€ 1,503 18 July 2012 Region Technology (ship to location) USA 30% KrF 22% Taiwan I-Line 3% 20% Japan 5% ArF dry 1% Singapore 4% End-use ArF immersion Korea 27% Europe 10% Foundry 74% 33% China 4% IDM 31% 85% of backlog New U

  10. Slide 10: Co-investment program update

    Public Slide 10 18 July 2012 Co-investment program update

  11. Slide 11: Customer co-investment program - Update

    Customer co-investment program - Update Public Slide 11 4 September 2012 • Customers will contribute € 1.38 billion over the next 5 years to accelerate the development of next generation technology • EUV current technology and beyond • Development of 450mm wafer technology • Customer co-investment p

  12. Slide 12: Business Environment

    Public Slide 12 18 July 2012 Business Environment

  13. Slide 13: Business Environment

    Business Environment Public Slide 13 4 September 2012 • DRAM sector 2012 purchases support approx 40% bit supply growth through shrink • NAND sector 2012 purchases support approx 80% bit supply growth, 50% from shrink with balance through capacity additions • Foundry spend in support of 28/32nm ramp

  14. Slide 14: Where are we in the cycle?

    Where are we in the cycle? Public Slide 14 Each sector has its own heartbeat Approx system sales by industry sector (Million Euro) 4 September 2012 ASML system sales per sector

  15. Slide 15: ASML Technology Strategy - Status

    Public Slide 15 18 July 2012 ASML Technology Strategy - Status

  16. Slide 16: Immersion – Productivity improvements

    Immersion – Productivity improvements Public Slide 16 4 September 2012 • TWINSCAN NXT:1950 productivity of 230 wafers per hour now the standard • Shipped 30 systems to customers to date • System upgrades at customer manufacturing sites has begun • Mitigating cost increases (in combination with Holis

  17. Slide 17: EUV status – NXE:3300

    EUV status – NXE:3300 Public Slide 17 4 September 2012 • Exposed first wafers on the NXE:3300 EUV scanners, the volume production successor of the NXE:3100 • First NXE:3300 is expected to ship by early 2013 • Shipment of the remainder of the 11 tools on order is planned throughout 2013 for customer

  18. Slide 18: Outlook

    Public Slide 18 18 July 2012 Outlook

  19. Slide 19: Q3 Outlook

    Q3 Outlook Public Slide 19 18 July 2012 • Net sales around € 1.2 billion • Gross margin about 43% • R&D costs at € 145 million • SG&A costs at € 60 million* ASML on track for H2 2012 sales between € 2.2 and € 2.4 billion * SG&A costs planned at higher run rate due to extra IT investments

  20. Slide 20: ASML

    ASML

ASML — Deutsche Bank Access European TMT Conference London 2012 on 6ix