Amkor Technology, Inc. · NASDAQ:AMKR
Amkor Technology — Technical Presentation (September 2003)
14 slides from Amkor Technology's technical presentation, September 2003
Slide 1: Game, Memory and I/O Cards
Game, Memory and I/O Cards September 2003 Enabling a Microelectronic World
Slide 2: Small Form Factor Memory Card Formats
Small Form Factor Memory Card Formats Is there a standard format? • Cameras and PDA’s – MMC and SD – xD (Fuji/Olympus) • Mobile phone – MMC (Nokia) – mini-SD (Docomo) • Sony – Memory Stick – DUO • Amkor’s AmKard™ technology can support all of these formats – lowest cost solution in the world today ©
Slide 3: AmKard Technology
AmKard™ Technology • Key attributes – fully-molded card (no plastic lid) – LF or Laminate based – LF with or without an interposer – uses standard process and materials § LF version is like MLF § Laminate version is like PBGA – can support SMT process – 90-95% compliant to existing lidded POD specs
Slide 4: Memory Card Technology Cost
Memory Card Technology Laminate with Lid 998 1 003 2 001 2 Fully-Molded Laminate LeadFrame with Lid 003 2 Fully-Molded LF w/Lam 002 2 Cost Fully-Molded LeadFrame © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 5: Available Test Platforms in ATP
Available Test Platforms in ATP • Nextest Maverick: – ECR Option is Available – Models: -VT, -GT for Production – Automated Handler: Mirae MR5500 • Credence Kalos: – Model: "Hex", Meaning 16 Controllers § the "XW" version of Kalos is not available for production – Automated Handler: Mirae MR5500 • C
Slide 6: Fully-Molded (FM) LF MMC Cross Section
Fully-Molded (FM) LF MMC Cross Section Label Au Wire Mold Compound Die Half etch LF Contact Attach © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 7: STD Material Description FM LF-MMC
STD Material Description FM LF-MMC 1) L/F: 10mil Cu ESC Plating: hard Au 2) Die attach epoxy: Ablebond 2025D 3) Gold wire: 1.0 mil diameter 4) Mold compound: KTMC 5700TQ 5) Mark: Laser 6) Label: Laminate polyester construction 7) Shipping package: vacuum formed tray © 2003 Amkor Technology, Inc. Ena
Slide 8: Simplified Process Flow FM LF-MMC
Simplified Process Flow FM LF-MMC 1) Wafer Backgrind 2) Die attach 3) Die attach cure 4) Wire bond 5) Mold 6) Post mold cure 7) Laser mark 8) Deflash 9) Final Card Test 10) Labeling 11) Pack and Ship © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 9: AmKard Based MMC Process Flow
AmKard™ Based MMC Process Flow (can be applied to all other Small Form Factor Memory Cards) Wafer Saw Die Attach Wire Bond WAFER Transfer Mold Laser Mark Deflash Singulation © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 10: AmKard Based MMC Process Flow
AmKard™ Based MMC Process Flow (can be applied to all other Small Form Factor Memory Cards) Test (Optional) Labeling (Optional) Packing Ship © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 11: Higher Density Memory Cards
Higher Density Memory Cards LeadFrame • Stacking Options – different die size – same die size with spacer – same die size staggered © 2003 Amkor Technology, Inc. Enabling a Microelectronic World
Slide 12: Complex Routing in LF Structure
Complex Routing in LF Structure • Interposer mounted on the die paddle enables – complex die-to-die routing – SMT Gold wire Interposer Die #1 Die #2 1.4 Interposer Die pad 0.251 0.1 0.2 0.03 0.21 0.325 0.127 0.03 0.452 Die #1 Die #2 1.4 Interposer © 2003 Amkor Technology, Inc. Enabling a Microelectr
Slide 13: MMC Reliability Requirements
MMC • Reliability Requirements – The reliability requirements need to be defined by customer. Amkor is willing to work with our customer’s to define a standard set of tests. Currently we are running the following tests for MMCs. Condition Test Duration – High Temperature Storage (HTS) 85 ºC 500 (qua
Slide 14: Memory Card Roadmap
Memory Card Roadmap 2001 2002 2003 2004 100% Price for Assembly and Test Standard MMC Capability Established Added SD Capabilities 75% and Automated the Line Driving Assembly Leadframe and Version of the Future using Test Pricing MMC and SD AmKard™ Down Through Fully Molded Technology: 50% Technical
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