Poet Technologies Inc. · NASDAQ:POET
Poet Technologies — Synopsis Photonics Symposium 2022
29 slides from Poet Technologies's conference presentation, Oct 20, 2022
Slide 1: Extending Wafer Level Chip Scale Packaging (WLCSP) to Photonics using Photonics Interposers
Synopsis Photonics Symposium Extending Wafer Level Chip Scale Packaging (WLCSP) to Photonics using Photonics Interposers Dr. Suresh Venkatesan CEO, POET Technologies
Slide 2: Topics
Topics Introduction Application Proof Points Conclusions 2
Slide 3: Photonics is undergoing a revolution today, like VLSI
Photonics is undergoing a revolution today, in much the same way as VLSI underwent a revolution these past three decades. Silicon Based Integration platforms are the key to Data Centers the predicted explosion (Optical Connectivity) in growth Millions/Year Compute (Chip to Chip communication) Automo
Slide 4: Key challenges in Photonics
Key challenges in Photonics Current technologies are not scalable for applications needing 100’s of millions and billions of units per year CURRENT Millions/Year VECTOR TECHNOLOGIES POET REASON Manufacturing, test and Unit Volume ✘ ✓ packaging is fully automated Components are integrated into 100s o
Slide 5: POET's Technology Solution – Photonics Interposers
POET’s Technology Solution – Photonics Interposers The POET Optical Interposer is the first-ever chip-scale hybrid integration of electronics and photonics into a single chip using wafer-level processing, assembly, test An Electrical Interposer POET Optical Interposer POET Optical Engine Electri Opt
Slide 6: POET's Optical Interposer
POET’s Optical Interposer POET’s Optical Interposer : A Co-Packaging Solution Implementation into a 100G-400G Optical Engine Low loss Self Aligned CMOS Compatible Micro Mirrors and Low Loss for out of Mechanically Waveguides plane coupling Interlocking Fiducials - Compatible with a wide range of l W
Slide 7: Simplified Design, Improved Energy and Lower Cost
Simplified Design, Improved Energy and Lower Cost Data Communications Challenges Conventional Discrete Assembly 22.5 • Serial data communication channels have not been able to keep up with Mux ROSA the pace of bandwidth growth. DSP F A U Mux F A U Dmu x • Number of communications lanes F A F A Dmu x
Slide 8: Example of Design Flexibility offered by an Interposer platform
Example of Design Flexibility offered by an Interposer platform 400G CHIPLETS for 1.6Tbps and beyond Quad Chiplets 3 Integration for 1.6Tbps 5 3.7mm 2 1 4 6 1. Flip Chip Driver/Laser : Low Latency 2. All pads re-configured to a single facet end for each of chiplet integration 3. Through Silicon Vias
Slide 9: Why Scale (and Signal Integrity) matter
Why Scale (and Signal Integrity) matter • Small Factor / Good Signal Integrity (no wirebonds, direct access to PCB with TSVs) à POET’s engines can be located anywhere on the PCB – minimizing the electrical trace lengths • For 800G and beyond – with no gear box requirements – this can enable Direct D
Slide 10: Key Competitive Differentiators
Key Competitive Differentiators Best in class integration of Tx and Rx: Small size, lower POET’s Optical Interposer provides a comprehensive integration power and customizable design platform relative to incumbent competing technologies Compared to other Silicon Photonic PIC vendors Wafer scale Asse
Slide 11: Application Platforms
Application Platforms Directly Modulated Laser Platform CW Laser Platform External Modulator Flip Chip on platform Integrated CW Lasers 9mm 6mm FR4 CW Laser • 100Gbps • 200Gbps FR4 Mux • 400Gbps • 800Gbps FR4 DeMux LR4 • 100Gbps High Speed PDs • Custom Configurations with multiple engines form facto
Slide 12: Optical Interposer Light Sources for High Bandwidth Communications
II Optical Interposer Light Sources for High Bandwidth Communications Engaged with leading AI-ML Accelerator and Chip-Chip communication companies to provide novel light sources at lower cost and greater flexibility than conventional laser suppliers. • POET’s Optical Interposer platform enables wafe
Slide 13: Optical Interposers for Integrating New Materials
III Optical Interposers for Integrating New Materials Monolithic Integration Hybrid Integration Heterogenous Integration Deposited or Grown on the wafer Assembled on to target as finished Transferred / Bonded on the wafer An Optical Interposer components • Best Cost Option Potential • High Material
Slide 14: Topics
Topics Introduction Application Proof Points Conclusions © POET Technologies Inc. | POET; NASDAQ | PTK: TSXV | PUBLIC 14 14
Slide 15: Flip Chip Lasers Integration in POET's Optical Engines
Flip Chip Lasers Integration in POET’s Optical Engines POET’s Interposer platform includes proprietary features for laser attach Laser – waveguide coupling performance excellent for both CW and DML lasers Passive laser placement and wafer scale assembly 15
Slide 16: Thermal Resistance
Thermal Resistance • The Thermal Resistance of the Interposer dictates the high temperature performance of the laser which in turn affects such parameters as Reliability, Bandwidth and Power consumption • Optimization of the assembly conditions helps achieve equivalent thermal resistance for ultra s
Slide 17: FR4 and LR4 Filter performance
FR4 (100G/200G/400G) and LR4(100G) Filter performance FR4 : 13nm pass band, 20nm channel spacing LR4 : 2.5nm pass band, 800GHz spacing LR4 MULTIPLEXER 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 1285 1290 1295 1300 1305 1310 1315 CH4 CH3 CH2 CH1 • Insertion Loss including fiber coupling < 1.8dB (FR4) a
Slide 18: Industry Leading Fiber Coupling Performance
Industry Leading Fiber Coupling Performance Measured Fiber Coupling Optical Losses Total loss from input to output : 0.7dB Transmission Loss : 0.3dB Best measured fiber coupling loss : 0.2dB/facet Expected in Production: 0.5bB/facet Measured Loss from Input to Output Wavelength scan from 1260nm to 1
Slide 19: Vertical Coupling Mirrors
Vertical Coupling Mirrors POET uses vertical coupling mirrors as a low loss alternative to grating couplers to couple light “out of plane” to the waveguides – these are used for coupling light to conventional top entry / emitting devices and for wafer level test Linear Mirrors : Used with 100G/200G
Slide 20: Vertical Mirror Performance
Vertical Mirror Performance Paraboloid Mirror 93.6% Yield 99.4% Yield Linear Pre-PD Bonding Paraboloid Post-PD Bonding Consistent performance both pre and post PD bonding
Slide 21: Topics
Topics Introduction Application Proof Points Conclusions 21
Slide 22: 100G CWDM Optical Engine
100G CWDM Optical Engine TRANSMITTER RECEIVER Sensitivity Receiver Spectrum Reference Transmitter 0C 1270 CH1, ER= 4.14dB, EMM=45.4% CH2, ER= 4.1dB, EMM=50.4% CH3, ER= 4.18dB, EMM=52.5% CH4, ER= 4dB, EMM=44.1% 1270, ER=4.26dB, EMM=44.7 1290, ER=4.5dB, EMM=41.4% (SN: 27-14 0011) (SN:29-14 0002) 1290
Slide 23: 200G FR4 Optical Engine
200G FR4 Optical Engine Common Optical Engine meeting the requirements of 100/200G 200G Optical Engine on Evaluation Board Optical Performance @ 75C CH1 OutER=3.87dB, TDECQ=1.98dB CH2 OutER=3.64dB, TDECQ=2.24dB Excellent 200G PAM4 signals through the Optical Interposer CH3 OutER=3.52dB, TDECQ=2.43dB
Slide 24: 100G LR4 Optical Engine
100G LR4 Optical Engine Industry first implementation of a “chip on board” LR4 implementation !! CH1 ER=4.25dB, EMM=13.2% CH2 ER=4.4dB, EMM=15.4% CH3 ER=4.23dB, EMM=21.4% CH4 ER=4.36dB, EMM=20.9% Channel 1 performance impacted by OOS wavelength
Slide 25: 400G/800G FR4 Receiver Performance
400G/800G FR4 Receiver Performance 400G FR4 Receivers integrated into 400G FR4 engine 750um pitch output guides for TIA compatibility 3777um FR4 Demultiplexer Input SSC - 13nm bandwidth - >20dB cross talk Optimized vertical mirror 9960um PBE IL: -2.3dB 16um aperture 56Gbps PDs Light from mirror near
Slide 26: 1.6Tbps FR4 Demonstrator
1.6Tbps FR4 Demonstrator 400G QSFP-DD Module (Module 3, Self-Gen 15Q) BL 4006 TIA 400G TIA 400G TIA
Slide 27: Topics
Topics Introduction Application Proof Points Conclusions 27
Slide 28: 400G Products with Integrated Hybrid Electronics
Flexible Architectures for multiple applications EICs Lasers/PDs EICs PIC Lasers/PDs Optical Interposer with lasers ASIC ASIC Optical Interposer with lasers + SiPh PIC + Detectors Silicon Silicon Interposer Interposer PCB PCB Modulated Laser solutions using the Optical Interposer Integrated Laser/PI
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