Applied Materials, Inc. · NASDAQ:AMAT
Applied Materials — Investor Presentation (December 2022)
31 slides from Applied Materials's investor presentation, Dec 14, 2022
Slide 1: eBeam Technology and Product Launch
eBeam Technology and Product Launch December 14, 2022 1 External Use
Slide 2: Forward-Looking Statements and Other Information
Forward-Looking Statements and Other Information This presentation contains forward-looking statements, including those regarding anticipated growth and trends in our businesses and markets, industry outlooks and demand drivers, technology transitions, our business and financial performance and mark
Slide 3: Welcome
WELCOME Michael Sullivan Corporate Vice President Head of Investor Relations DECEMBER 14, 2022 3 External Use Applied Materials External
Slide 4: eBeam Technology and Product Launch
eBeam Technology and Product Launch Keith Wells Group Vice President and General Manager Imaging and Process Control Group DECEMBER 14, 2022 4 External Use Applied Materials External
Slide 5: Agenda
AGENDA Technology Primer: Optical and eBeam eBeam Market Segments and Applications Cold Field Emission Technology New eBeam Products Q&A 5 External Use
Slide 6: How Optical and eBeam Imaging Work
How Optical and eBeam Imaging Work light light detector Optical lens reflected ~60° refracted ray ray SE detector column BSE detector eBeam electron beam low-energy secondary electrons ~0.5° high-energy back-scattered electron 6 External Use
Slide 7: Optical and eBeam: Complementary Technologies
Optical and eBeam: Complementary Technologies Optical Resolution Speed Optical Max Low High spot size = ~100nm eBeam eBeam High Max Low spot size = ~1.5nm Optical provides lower resolution imaging at faster speed, eBeam provides higher resolution imaging at slower speed 7 External Use
Slide 8: Resolution is the Amount of Detail in an Image
Resolution is the Amount of Detail in an Image SD (480p) UHD (4K) 30x Optical Resolution eBeam Resolution 50x 8 External Use
Slide 9: Surface Imaging with Optical and eBeam
Surface Imaging with Optical and eBeam Optical eBeam EUV pattern 25nm pitch top view High-resolution eBeam imaging enables critical dimension measurements and detection of very small defects in EUV patterning 9 External Use
Slide 10: 3D Imaging with Optical and eBeam
3D Imaging with Optical and eBeam Optical eBeam signal noise <100nm <100nm <100nm <100nm <2,000nm <2,000nm >10,000nm >10,000nm GAA GAA DRAM DRAM 3D NAND 3D NAND Noise increases significantly with depth Noise increases negligibly with depth Narrow eBeam helps characterize deep 3D structures and detec
Slide 11: Imaging Deep 3D Structures with Back-scattered Electrons
Imaging Deep 3D Structures with Back-scattered Electrons 3D imaging w/ SE eBeam high- cannot image energy deep trenches BSE deep structure 3D imaging w/ BSE low-energy SE bottom of deep trenches imaged bottom of deep structure BSE: back-scattered electrons top view SE: secondary electrons 11 Externa
Slide 12: eBeam Market and Segments
eBeam Market and Segments 2021 WFE Process Control eBeam Segments eBeam Defect Inspection Review 33% 28% Process eBeam $86.6B Control $11.0B 20% $2.2B 13% Other CD-SEM Optical 39% Process eBeam Defect Market WFE Optical eBeam CD-SEM Control Inspection Review Growth (‘19-’21) 68% 72% 67% 95% 142% 108
Slide 13: eBeam Market Segments
eBeam Market Segments TechInsights Actionable Applications Purpose Image Segments Insight SEE False Defect Review D DR-SEM to distinguish critical defects from noise, C SEMVision® A enable root cause analysis E B Defect Inspection DETECT PrimeVision® small, buried and electrical defects eBeam (New)
Slide 14: eBeam Market Participants
eBeam Market Participants eBeam eBeam Market eBeam Market Company Revenue Share Share Growth (2021) (2021) (2016-2021) $1,082M 50% +13% Hitachi $596M 28% -14% ASML $323M 15% 0% KLA $138M 6% +1% Source: TechInsights Inc. 2021 14 External Use
Slide 15: Introducing Cold Field Emission (CFE) Technology
Introducing Cold Field Emission (CFE) Technology Thermal source Thermal Field Emission Cold Field Emission (1970) (1990) (New) eBeam Source Operating Temperature 2,700K (2,426°C) 1,800K (1,526°C) 300K (26°C) Resolution (nm) >5 1-5 <1 Imaging Speed 1x 3-6x 9-100x Applied’s CFE technology increases eB
Slide 16: CFE: The Next Generation of eBeam Imaging
CFE: The Next Generation of eBeam Imaging TFE CFE Higher resolution, faster throughput, production-worthy 16 External Use
Slide 17: CFE Animation
CFE Animation YouTube link: https://youtu.be/k_nE2taufD8 17 External Use
Slide 18: CFE Accelerates Development of Industry's Most Advanced Nodes
CFE Accelerates Development of Industry’s Most Advanced Nodes 4 R&D Technology Development Use Scenario 2 TFE CFE Planar CMOS Resolution [nm] 10x faster imaging log scale FinFET 1 1.5x higher resolution Gate All Around 0.5 SLOW FAST Imaging Speed eBeam imaging with CFE gives GAA process engineers th
Slide 19: Customers Using CFE to Discover Process Issues
Customers Using CFE to Discover Process Issues GAA DRAM Scaling SiGe residue EUV stochastic defects open particle defect short 19 External Use
Slide 20: Launching SEMVision G10 with CFE for Defect Review
Launching SEMVision® G10 with CFE for Defect Review Sub-nanometer resolution for logic and memory scaling 1.5x higher imaging resolution of smallest defects 3x higher BSE collection efficiency for imaging buried defects 2x higher resolution at 10x lower dose for EUV resist imaging Up to 3x f
Slide 21: Strong Customer Pull for SEMVision G10
Strong Customer Pull for SEMVision ® G10 Units Shipped FY20 FY21 FY22 >$400M in cumulative revenue 21 External Use
Slide 22: SEMVision G10 for GAA Defect Review
SEMVision® G10 for GAA Defect Review Gate-All-Around Traditional eBeam TFE SEMVision G10 CFE residue top view Unique detection and 3D-depth analysis for critical GAA defects 22 External Use
Slide 23: SEMVision G10 for EUV Photoresist Review
SEMVision® G10 for EUV Photoresist Review EUV Photoresist Traditional eBeam TFE SEMVision G10 CFE of DRAM bit lines 50nm buried bridge 10nm top view Increased photoresist review sensitivity with >2x higher resolution and >10x lower eBeam dose 23 External Use
Slide 24: SEMVision G10 for DRAM Defect Review
SEMVision® G10 for DRAM Defect Review DRAM Traditional eBeam TFE SEMVision G10 CFE isolation layer 250nm particle top view defect CFE reveals yield-killing defects in DRAM 24 External Use
Slide 25: Introducing PrimeVision 10 with CFE for Defect Inspection
Introducing PrimeVision® 10 with CFE for Defect Inspection CFE improves detection of surface and buried defects Resolution of up to ~1nm to detect smallest surface defects New 3D detection channel finds buried defects Up to 10x speed for greater area coverage Best-in-class inspection for every
Slide 26: PrimeVision for GAA SiGe Residue
PrimeVision® 10 for GAA SiGe Residue GAA Traditional eBeam TFE PrimeVision 10 CFE SiGe residue top view New CFE 3D detection channel enables identification of residue in complex 3D structures 26 External Use
Slide 27: PrimeVision for DRAM Bit Line Inspection
PrimeVision® 10 for DRAM Bit Line Inspection DRAM Traditional eBeam TFE PrimeVision 10 CFE bit lines bridge Source: TechInsights top view CFE resolution enables detection of tiny yield-critical defects 27 External Use
Slide 28: EUV Patterning Challenges
EUV Patterning Challenges Size variation across features Variation within a feature Stochastic defects Variation as % of CD LER as % of CD Defects per cm2 > 2x > 2x > 10x Node 10nm 7nm 5nm 3nm Node 10nm 7nm 5nm 3nm Node 10nm 7nm 5nm 3nm open LER short Variation increasing in local and Line edge roug
Slide 29: CFE Accelerates EUV Process Development at Applied
CFE Accelerates EUV Process Development at Applied Single-chamber etch+dep Metrology cycling technique improves EUV Rough EUV photoresist patterns Improved Tailored Final photoresist patterns patterns imaging and algorithms for Applied patterning groups TFE CFE protrusion? bridge Applied Centris® Sy
Slide 30: Applied's eBeam Momentum
Applied’s eBeam Momentum CY21 eBeam System Revenue: $1.08B, ▲95% YoY CY21 eBeam Services » >90% of revenue from subscriptions » >90% subscription renewal rate SEMVision® G10: >$400M cumulative revenue » GAA: process development tool of record at all customers » FinFET: adopted for HVM by all l
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