DuPont de Nemours, Inc. · NYSE:DD
DuPont de Nemours — DuPont — Technical Presentation (April 2012)
18 slides from DuPont de Nemours's technical presentation, April 2012
Slide 1: DuPont Solamet PV51x Rear Side Tabbing Silver
DuPont™ Solamet® PV51x Rear Side Tabbing Silver 杜邦™ Solamet® PV51x 系列 背面电极导电银浆 The Choice for Better Performance and Competitive Cost Benefits Sabrina Hu 胡中馜 Regional PV Product Management & Competitive Intelligence Manager, AP 亚太区产品推广经理 DuPont Microcircuit Materials 杜邦微电路材料 1
Slide 2: Sustaining high performance and low cost solutions
维持 高效能 与 低成本 的永续解决方案 • As the PV industry moves towards grid parity, two key success factors will enable an industrial winner to: achieve better performance – high efficiency cells & modules be sensitive to manufacturing cost structures to sustain a healthy margin level while end product price trend
Slide 3: Solamet PV51x rear side tabbing silver paste
杜邦™ Solamet® PV51x 系列 – 背面电极银浆 25% Lower Unit Consumption - Lower Ag content - Lower unit cost / watt High Adhesion at Low Laydown - Enable excellent adhesion at low consumption by innovative chemistry - Good compatibility with various fluxes Comparable Efficiency - Rs and FF remain the same Environ
Slide 4: PV51M consumption comparison
杜邦™ Solamet® PV51M - 耗量比较 Condition No. Pressure (Kg) Speed (mm/s) Snap-off (mm) A 15 30 0.3 B 8 200 2.1 C 5 200 2.6 0.12 0.11 0.1007 0.1012 0.10 Up to 25% lower consumption Laydown(g) 0.09 0.08575 0.08 0.0745 •Printer: DEK 0.07 •Screen : 250 mesh •Tabbing width : 4mm •Tabbing length : 154mm 0.06 0.
Slide 5: PV51M solderability and adhesion: laydown impact
杜邦™ Solamet® PV51M – 焊接性与拉力表现 Laydown Impact on Adhesion Test Condition 8 Hot air non-contact type 7 soldering machine Standard condition 6 Solder Ribbons 5 Adhesion (N) 62Sn/36Pb/2Ag with 0.2 mm 4.83723 thickness 4.45412 4 Flux 3.16025 3 Kester 952S 2.54885 2 Tabbing Condition 1 4mmX154mm printed b
Slide 6: PV51M adhesion with lead-free solder ribbon
杜邦™ Solamet® PV51M – 焊接性与拉力表现 Adhesion with Lead-free Solder Ribbon Test Condition 8 Hot-air non-contact type 7 soldering machine Solder Ribbons 6 Adhesion (N) 62Sn/36Pb/2Ag with 0.17mm 5.2079 5 thickness 4.59315 96.5Sn/3.5Ag with 0.17mm 4 thickness 3.65785 3 2.97135 Flux Kester 952S 2 Tabbing Condi
Slide 7: PV51M soldering window
杜邦™ Solamet® PV51M – 焊接性与拉力表现 Soldering Window 7 Test Condition Hot-air non-contact type 6 soldering machine Solder Ribbons 5 4.46464 4.43935 4.45412 soldered at low heating temperature) 4.33736 4.34405 (Banchmark can not be successfully 4.3141 Adhesion (N) 62Sn/36Pb/2Ag with 0.17mm 4 thickness 3.04
Slide 8: PV51M reference solderability
杜邦™ Solamet® PV51M – 焊接性与拉力表现 Reference 1 Solderability Solder Ribbons Tabbing Condition Testing condition 0.17 x 2mm 4mmX154mm Hot-air Soldering Machine 62Sn/36Pb/2Ag Screen Mesh Flux 250 Kester 952S Ref. (0.10g) PV51M (0.08g) Consistent soldering adhesion value along tabbing 8 © DuPont
Slide 9: PV51M electrical performance
杜邦™ Solamet® PV51M – 电性表现 Paste Laydown Consump Eff. FF Isc Voc Rs Rsh Rfront Rback tion PV51M 0.075g -25% 18.66% 78.50 9.125 0.621 2.91 173 0.0249 0.0052 PV51M 0.085g -15% 18.66% 78.76 9.084 0.622 2.83 179 0.0232 0.0051 PV51M 0.100g -0% 18.66% 78.68 9.086 0.623 2.80 174 0.0225 0.0052 Ref. 0.100g --
Slide 10: Continuing toward high performance and low cost: PV51G
持续向 高效能 低成本 的目标迈进 - 杜邦™ Solamet® PV51G With wide acceptance of DuPont™ Solamet® PV51M in the PV market on both performance and cost-effective solutions DuPont continues to take on the leadership role in developing next generation rear side tabbing silver pastes to further help reduce the cost struct
Slide 11: PV51G consumption comparison
杜邦™ Solamet® PV51G - 耗量比较 Condition No. Pressure (bar) Speed (mm/s) Snap-off (mm) 1 0.25 250 2.0 2 0.75 200 1.8 3 2.00 100 0.5 Individual Value Plot of Laydown (g) 0.25 0.75 2.00 ref. PV51G 0.14 0.1395 ~30% lower 0.13 consumption 0.12 0.12085 Laydown (g) 0.11 0.10 0.10075 0.093 •Printer: Ekra Asys 0
Slide 12: PV51G rear side tabbing silver cost advantage
杜邦™ Solamet® PV51G 背面电极银浆的成本优势 Significant consumption savings with comparable efficiency performance -15% -25% Drop-in Performance 0.09g/cell 0.076g/cell Optimization 0.0675 g/cell Market Ref. 12 © DuPont
Slide 13: PV51G cost advantage
杜邦™ Solamet® PV51G 背面电极银浆的成本优势 Assumption : Ag @ $35, with 1GW output 13 © DuPont
Slide 14: PV51G solderability: laydown impact on adhesion
杜邦™ Solamet® PV51G – 焊接性与拉力表现 Laydown Impact on Adhesion Test Condition Boxplot of ADH (N) Pin type soldering machine Paste 6 Standard condition ref. PV51G Solder Ribbons 5 4.50767 62Sn/36Pb/2Ag with 0.17 mm 4.35711 thickness 4.15633 4.10778 4.1185 3.96328 3.79233 ADH (N) 4 3.56494 Flux 3 2.67594 2.
Slide 15: PV51G solderability: flux impact on adhesion
杜邦™ Solamet® PV51G – 焊接性与拉力表现 Flux Impact on Adhesion Test Condition Boxplot of ADH Pin type soldering machine 7 Paste ref. 0.08g PV51G Solder Ribbons 6 0.12g 62Sn/36Pb/2Ag with 0.17mm 4.71644 thickness 5 4.31275 4.25033 4.10778 ADH (N) 4.1185 4.02533 3.77672 Flux 4 3.198 2.77561 2.75956 3 2.69439 2
Slide 16: PV51G electrical performance
杜邦™ Solamet® PV51G – 电性表现 Paste Laydown Consumption Eff. FF Isc Voc Rs Rsh Irev PV51G 0.089 g -28% 18.57 78.5 9.06 0.623 3.12 213 0.08 Incumbent 0.124 g 0 18.57 78.4 9.07 0.623 3.09 200 0.10 Boxplot of NCell Cell : 6’’ mono Paste 0.188 ref. PV51G 0.187 0.185962 0.185854 0.185785 0.185778 0.186 0.185
Slide 17: Summary: Solamet PV51x features
Summary DuPont™ Solamet® PV51x features: 25% Lower Unit Consumption less Ag content High Adhesion at Low Laydown Enables excellent adhesion at low consumption by innovative chemistry Comparable Efficiency Rs and FF remain the same 17 © DuPont
Slide 18: Copyright and trademark notice
Copyright © 2012 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, The miracles of science™, energy for a thriving world™, and all products denoted with ® or ™ are registered trademarks or trademarks of E.I. du Pont de Nemours and Company or its affiliates.