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Shanghai Prisemi Electronics Co., Ltd. news in 2026

Shanghai Prisemi Electronics Co., Ltd.'s news releases, calls and decks from 2026, newest first.

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(688230)"SHANGHAI PRISEMI ELECTRONICS CO., LTD."Announcement on Implementation of Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition and Completion of Registration of Convertible Corporate Bonds

November 4, 2026

Announcement on Completion of Transfer of Target Assets in Connection with the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

September 22, 2026

Announcement on Participating in the 2026 Semi-annual Collective Performance Briefing for the STAR Market Chip Design Industry

August 28, 2026

Announcement on Adjustment of Internal Investment Structure of Raised Funds Investment Projects and Capital Reduction of Certain Implementation Entities

August 27, 2026

Announcement on Resolutions of the 2nd Extraordinary General Meeting in 2026

August 26, 2026

Notice on Convening the 2nd Extraordinary General Meeting in 2026

August 10, 2026

Announcement on Obtaining Registration Approval from the China Securities Regulatory Commission for the Issuance of Convertible Corporate Bonds and Payment of Cash for Asset Acquisition

August 7, 2026

Announcement on Revision of Report on Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition (Registration Draft)

July 20, 2026

Announcement on Approval by the Shanghai Stock Exchange M&A and Restructuring Review Committee of the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

July 16, 2026

Announcement on Meeting Arrangement of the M&A and Restructuring Review Committee of the Shanghai Stock Exchange for the Review on the Company's Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition

July 9, 2026

Announcement on Receiving Letter of Implementation of Review Center's Opinions from Shanghai Stock Exchange

July 8, 2026

Indicative Announcement on the Update to the Reply to the Review Inquiry Letter Regarding the Application for the Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition, and Raising Supporting Funds

July 3, 2026

Announcement on Resolutions of the 1st Extraordinary General Meeting in 2026

June 15, 2026

Indicative Announcement on Update of Reply to the Inquiry Letter Regarding the Review of the Application for Issuance of Convertible Corporate Bonds and Cash Payment for Asset Acquisition, as well as the Fundraising for Supporting Funds

June 10, 2026

and Handling Industrial and Commercial Change Registration, as well as Amending the Senior Management Members

May 26, 2026

Announcement on Resolutions of the 4th Meeting of the 3rd Board of Directors

May 11, 2026

Announcement on Change of Sponsor Representative for Continuous Supervision

April 28, 2026

Announcement on Attending Annual Performance Briefing for Analog Chip Design Sector on SSE STAR Market 2025 for the "15th Five-Year Plan" - Research on Core Technologies of Integrated Circuits for Self-Reliance and Self-Development in Science and Technology

April 21, 2026

Announcement on Implementation of Dividend Distribution for 2025

March 11, 2026

Announcement on Acceptance by Shanghai Stock Exchange of Application Documents for Issuing Convertible Corporate Bond to Purchase Assets in Cash and Raise Supporting Funds

March 10, 2026

Announcement on Resolutions of the 2025 Annual General Meeting

February 27, 2026

Self-Inspection Report on the Trading of Stocks by Related Entities in the Transaction

February 25, 2026

Report on the Use of Previously Raised Funds

February 2, 2026

Announcement on Progress in Planning Major Asset Restructuring

January 21, 2026

Announcement on Election of Chairman and Members of Special Committees of the Board of Directors and Appointment of Senior Management Members and Securities Affairs Representative

January 4, 2026